IPC-TM-650 EN 2022 试验方法--.pdf - 第74页

IPC-OI-645 IPC-A-600E The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 Sanders Road • Northbrook, IL 60062 Material in this T est M ethods Manual was vol untaril y establis hed by T echni cal Co…

100%1 / 824
ANSI NCSL Z540
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
method
is
intended
to
cover
all
mechanical
dimension
inspections
typically
referenced
on
a
Printed
Board
drawing.
This
will
cover
non-optically
enhanced
measurement
techniques
which
are
not
covered
by
IPC-TM-650,
Method
2.2.2.
2
.0
Applicable
Documents
International
Calibration
Standards
or
Physical
Constants
3
.0
Test
Specimens
The
test
specimen(s)
shall
be
defined
in
the
applicable
performance
specification
or
standard.
4
.0
Apparatus
or
Material
4.1
Mechanical
measurement
gage
capable
of
sufficient
accuracy
precision
and
resolution
to
accomplish
the
neces¬
sary
measurement
(i.e.,
calipers,
micrometers,
pin
gages,
templates,
etc.).
4.2
All
mechanical
measurement
gages
shall
be
calibrated
in
accordance
with
ANSI
NCSL
Z540,
International
Calibration
Standards
or
Physical
Constants.
Number
2.2.1
Subject
Mechanical
Dimensional
Verification
Date
8/97
Revision
A
Originating
Task
Group
Rigid
Board
T.M.
Task
Group,
7-1
Id
5
.0
Procedure
5.1
Gages
which
use
an
origin
based
system
(i.e.,
calipers,
micrometers)
shall
be
initialized
at
the
origin.
5.2
Operate
the
gage
in
a
manner
consistent
to
obtain
the
accuracy,
repeatability,
and
precision
required.
5.3
If
the
attribute
to
be
measured
can
vary
across
the
printed
board,
multiple
measurements
must
be
made
to
char¬
acterize
the
variation
within
the
sampled
area
(i.e.,
hole
sizes,
thickness).
5.4
Read
and
record
the
dimensions
for
the
attribute(s)
measured
using
the
same
number
of
significant
digits
speci¬
fied
by
the
drawing,
standard,
or
specification
as
a
minimum
or
maximum
limiting
value.
6
.0
Notes
The
following
items
can
affect
the
test
results.
Tool
wear
&
maintenance
Environment
effects
Delicacy
of
gages
-
proper
storage
Improper
calibration
IPC-OI-645
IPC-A-600E
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
method
is
intended
to
describe
optically
enhanced
measurement
techniques
for
dimensions
of
3
mm
or
less,
typically
referenced
on
a
Printed
Board
drawing.
This
method
will
not
cover
mechanical
dimensional
verification
which
is
covered
by
IPC-TM-650,
Method
2.2.1
.
This
method
is
intended
to
supersede
IPC-TM-650,
Method
2.2.3.
2
.0
Applicable
Documents
Standard
for
Visual
Optical
Inspection
Aids
Acceptability
of
Printed
Boards
3
.0
Test
Specimens
3.1
The
test
specimen(s)
shall
be
defined
in
the
applicable
performance
specification
or
standard.
4
.0
Apparatus
or
Material
4.1
Optical
inspection
aid
capable
of
a
magnification
where
the
feature(s)
to
be
measured
occupies
at
least
20%
of
the
field
of
view.
(See
IPC-OI-645
for
detailed
description.)
4.2
Reticle
or
Filar
Micrometer
attachment
to
Optical
Inspec¬
tion
Aid
that
contains
gradiations
or
a
scale,
which
will
provide
a
minimum
measurement
resolution
of
50%
of
the
last
signifi¬
cant
digit
of
the
referenced
dimensional
requirement.
The
Reticle
or
Filar
Micrometer
should
be
calibrated
at
the
given
magnification
to
ascertain
the
distance
in
mm
(inches)
between
each
division.
5
.0
Procedure
Number
2.2.2
Subject
Optical
Dimensional
Verification
Date
8/97
Revision
B
Originating
Task
Group
Rigid
Board
T.M.
Task
Group,
7-1
Id
5.2
Adjust
the
optical
aid
so
that
both
the
feature(s)
to
be
measured
and
the
reticle
or
filar
micrometer
attachment
are
in
focus.
5.3
Align
the
reticle
or
filar
micrometer
so
that
the
measure¬
ment
scale
is
visible
and
aligned
with
the
edges
of
the
fea-
ture(s)
to
be
measured.
5.4
Read
the
reticle
or
filar
micrometer
to
obtain
the
number
of
divisions
between
feature
edges.
5.5
To
obtain
the
actual
dimensions
of
the
feature,
multiply
the
number
of
divisions
read
by
the
calibration
data
previously
obtained
for
the
reticle
or
filar
micrometer
in
(|im/division)
(inches/division)
at
the
given
magnification.
5.6
Record
the
dimensions
for
the
attribute(s)
measured
using
the
same
number
of
significant
digits
specified
by
the
drawing,
standard,
or
specification
as
a
minimum
or
maximum
limiting
value.
6
.0
Notes
6.1
For
a
thorough
description
of
the
requirements,
defini¬
tions,
and
certification
provisions
for
optical
inspection
aids,
see
IPC-OI-645.
6.2
IPC-A-600
contains
figures
and
diagrams
which
depict
measurement
techniques
for
certain
attributed.
5.1
Select
an
optical
aid
which
allows
for
clear
viewing
of
the
area(s)
containing
the
attributes
to
be
measured.
NOTE:
NOTE:
NOTE:
IPC-TM-650
Number
Subject Date
Revision
Page 3 of 4
2.2.13.1
Thickness,
Plating
in
Holes
Microhm
Method
1/83
A
4
steady
reading
indicates
that
the
probes
am
mak¬
ing
good
contact.
Trial
settings
to
obtain
the
minimum
resis¬
tance
value
will
indicate
when
the
probes
are
properly
located
over
the
interconnection.
5.2.5
If
poor
electrical
contact
is
evidenced,
relocate
the
probes
until
a
minimum
resistance
is
indicated.
During
the
microscopic
inspection
(30X)
of
the
edges
of
the
plated-through
hole
and
the
adjacent
areas
on
the
ter¬
minal
area,
there
shall
be
no
detectable
damage
to
the
sur¬
faces
by
contact
with
the
probes
during
testing.
In
the
absence
of
such
surface
defects,
the
microhm
testing
can
assuredly
be
considered
nondestructive.
5.2.6
Read
and
record
the
microhm
value.
5.2.7
Compare
the
microhm
value
with
the
plating
thickness
of
the
standardization
curve
as
illustrated
in
Fig.
3.
The
theo¬
retical
curves
shown
in
Fig.
3
indicate
to
within
0.2-rail
thick¬
ness
the
plating
in
the
through
connection
and
for
all
practical
purposes
are
representative
of
the
resistance-
plating
thick¬
ness
relationships
encountered
in
practice.
This
comparison
shall
indicate
if
the
plating
thickness
of
the
through
connection
meets
the
acceptable
thickness
requirements
5.2.8
When
this
method
is
used,
any
reading
above
the
specified
allowable
microhm
reading
shall
be
reason
for
fur¬
ther
investigation
of
the
defect
for
conformance
to
the
require¬
ments
of
the
applicable
fabrication
specification.
5.2.9
Plating
thickness
curves
shall
be
generated
by
the
user.
6.0
Resistance
Curves
6.1
Curves
for
the
resistances
of
plated-through
holes
of
three
different
diameters
in
1/16"
printed
wiring
boards
are
presented
in
this
test
method
(Fig.
3).
Over
coatings
of
gold,
tin-lead,
etc.,
can
have
an
effect
on
the
micro-ohm
readings
depending
on
the
electrical
resistance
relative
to
the
copper.
Resistivity
of
tin-lead
is
approximately
ten
times
that
of
cop¬
per,
while
gold
is
of
the
same
resistivity.
6.2
To
eliminate
material
and
equipment
variables,
the
user
should
develop
thickness-resistance
curves
for
his
particular
condition
based
on
metallographic
cross-section
measure¬
ments
(TM-650
Method
2.2.13).
These
curves
may
be
used
as
guides
for
acceptance
of
product.