IPC-TM-650 EN 2022 试验方法--.pdf - 第81页
T a ble 1 T ype 1 +150µm +75 µm +20 µm –20 µm T ype 2 + 7 5 µm +45 µm +20 µm –20 µm T ype 3 + 4 5 µm +25 µm +20 µm –20 µm T ype 4 + 3 8 µm +20 µm –20 µm T ype 5 + 3 0 µm +15 µm –15 µm T ype 6 + 1 5 µm + 5 µm – 5 µm IPC-T…
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
Number
2.2.14.2
Subject
Solder
Powder
Particle
Size
Distribution
—
Optical
Image
Analyzer
Method
Date
1/95
Revision
Originating
Task
Group
Solder
Paste
Task
Group
(5-24b)
1
.0
Scope
This
test
method
is
designed
to
determine
pow¬
der
particle
size
distribution
in
creams
by
image
analysis.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
1
0
grams
of
solder
paste
4
.0
Equipment/Apparatus
Thinner
5
.0
Procedure
5.1
Preparation
5.1.1
Stencil
some
solder
cream
onto
a
glass
slide
using
a
5
or
6
mm
diameter,
0.1
mm
thick
stencil.
5.1.2
Apply
a
little
thinner
to
the
solder
paste
and
gently
disperse
the
paste
over
an
area
about
20
mm
diameter,
using
a
glass
rod.
Cover
with
a
22
mm
diameter
cover
glass
and
gently
press
to
give
a
monolayer
dispersion
of
powder
par¬
ticles
under
the
cover
glass.
It
is
important
to
get
a
good
dispersion
without
a
lot
of
bubbles
or
particle
agglomerates.
If
the
paste
you
are
exam¬
ining
has
a
high
metal
content,
remove
some
of
the
stencilled
paste
before
dispersing
it.
The
standard
stencils
are
suitable
for
85-86%
metal
paste.
5.1.3
Label
the
glass
slide
with
the
powder
batch
number.
5.2
Images
for
Analysis
The
next
step
is
to
put
1
0
or
1
5
images
from
each
sample
into
an
image
directory.
5.2.1
Start
up
the
image
analyzer.
5.2.2
Set
up
the
microscope
illumination
for
X10
and
select
the
X1
0
objective.
5.2.3
Put
the
slide
on
the
microscope,
focus,
swing
the
bin¬
ocular
eyepiece
to
the
left
sending
the
light
to
the
TV
camera,
and
refocus
on
the
screen.
5.2.4
Ensure
that
there
are
no
agglomerations
or
badly
out-
of-focus
particles
and
then
capture
the
image.
5.2.5
Capture
1
0
images
covering
the
slide
in
a
systematic
way
without
consciously
selecting
areas
(other
than
avoiding
agglomerations
and
areas
of
very
low
particle
density).
5.2.6
Record
the
number
of
the
slide
and
remove
from
the
microscope.
5.2.7
Put
the
next
slide
on
the
microscope
and
repeat
the
process.
5.2.8
When
all
the
samples
have
been
recovered,
swing
the
eyepiece
back
and
switch
off
the
microscope.
5.2.9
Comments
-
Do
not
change
the
illumination
between
samples.
-
Record
a
series
of
samples
at
the
same
magnification.
5.3
Image
Analysis
5.3.1
When
images
from
the
required
number
of
samples
have
been
entered,
select
'Multi
Sample
Size'
on
the
menu
(or
'One
Sample
Size'
for
a
single
sample).
An
image
in
red
and
blue
will
then
come
up
on
the
screen.
5.3.2
Using
the
left
and
center
buttons
on
the
mouse,
adjust
the
thresholds
until
the
red
areas
correspond
to
the
particles
to
be
measured.
Selecting
the
right
hand
button
allows
you
to
vary
the
line
on
the
screen
where
the
intensity
plot
is
mea¬
sured.
Adjust
the
top
threshold
so
that
it
is
about
halfway
down
the
intensity
minima.
Press
center
and
right
buttons
on
the
mouse
simultaneously.
5.3.3
You
should
now
see
a
green
rectangle
on
a
grey
image.
If
there
is
no
rectangle,
press
the
left
hand
button
until
one
appears.
5.3.4
A
particle
is
measured
if
the
top
of
the
particle
lies
within
the
rectangle,
so
the
size
and
position
of
the
rectangle
must
be
adjusted
so
that
the
sides
are
half
a
particle
diameter
from
the
sides
of
the
screen,
and
the
base
of
the
rectangle
a
whole
particle
diameter
from
the
bottom
of
the
screen.
The
top
of
the
rectangle
should
lie
along
the
top
of
the
screen.
The
Table 1
Type 1 +150µm +75 µm +20 µm –20 µm
Type 2 + 75 µm +45 µm +20 µm –20 µm
Type 3 + 45 µm +25 µm +20 µm –20 µm
Type 4 + 38 µm +20 µm –20 µm
Type 5 + 30 µm +15 µm –15 µm
Type 6 + 15 µm + 5 µm – 5 µm
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.2.14.2
Solder
Powder
Particle
Size
Distribution
—
Optical
Image
Analyzer
Method
1/95
middle
button
on
the
mouse
swaps
between
'moving'
and
'growing'
the
rectangle.
When
the
rectangle
is
set,
press
the
right
hand
button
on
the
mouse
to
proceed.
5.3.5
On
the
keyboard
that
now
comes
up
on
the
screen,
select
the
number
of
samples
being
processed.
5.3.6
On
the
next
keyboard
select
the
number
of
particles
to
be
measured
(200
for
type
1
-4
and
400
for
type
5-6
is
sug¬
gested).
5.3
Evaluation
Express
the
masses
of
the
powder
above,
within,
and
below
the
nominal
size
range
as
percentages
of
the
mass
of
the
original
sample.
Enter
data
in
Table
1.
ASTM D-1210-79
*Source: Precision Gage & Tool Co. 28 Volkenand Ave., Dayton, Ohio
45410 513/254-8404
Table 1
1st 4th Major
Type 1 160µm 150 µm 140 µm
Type 2 80µm 75 µm 65 µm
Type 3 50µm 45 µm 40 µm
Type 4 40µm 38 µm 35 µm
Type 5 30µm 25 µm 23 µm
Type 6 20µm 15 µm 15 µm
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
method
is
designed
to
determine
the
maximum
(average)
solder
particle
size
in
a
solder
paste
using
a
fineness
of
grind
gauge.
2
.0
Applicable
Documents
Fineness
of
Dispersion
of
Pigment-Vehicle
Systems
3
.0
Test
Specimen
At
least
100
grams
of
uniformly
mixed
solder
paste.
4
.0
Equipment/Apparatus
Gauge-Hegman
Type
OMA
185*,
or
equivalent,
in
accordance
with
ASTM
D1
21
0-79.
A
hardened
steel,
stainless
steel,
or
chrome-
plated
steel
block
approximately
175
mm
in
length,
65
mm
in
width,
and
13
mm
thick.
The
top
surface
of
the
block
shall
be
ground
smooth
and
flat
and
shall
contain
one
or
two
grooves
140
mm
in
calibrated
length
and
12.5
mm
wide
parallel
to
the
longer
sides
of
the
block.
Each
groove
shall
be
tapered
uniformly
in
depth
lengthwise
from
a
suitable
depth
(for
example
50
to
1
00
micrometers)
at
1
0
mm
from
one
end
to
zero
depth
at
the
other
with
interme¬
diate
calibrations
in
accordance
with
the
depth
at
these
points.
Scraper
—
A
single-
or
double-edged
hardened
steel,
stainless
steel,
or
chrome-plated
steel
blade
90
mm
long,
38
mm
wide,
and
6.4
mm
thick.
The
edge
or
edges
on
the
long
sides
shall
be
straight
and
rounded
to
a
radius
of
approximately
0.38
mm.
Number
2.2.14.3
Subject
Determination
of
Maximum
Solder
Powder
Particle
Size
Date
Revision
1/95
Originating
Task
Group
Solder
Paste
Task
Group
(5-24b)
5.1.1
Using
a
fineness
of
grind
gauge
(Hegman)
Type
CMA
185
or
equivalent
in
accordance
with
ASTM
D-1210
deter¬
mine
the
maximum
and
average
particle
size
of
the
powder.
5.2
Evaluation
Acceptance
of
each
type
of
powder
shall
be
based
on
the
specifications
listed
in
Table
1.
Enter
the
results
in
Table
2
"Test
Report
on
Solder
Paste.”
5.1
Test