创建组件识别数据的方法.pdf - 第100页

100/178 IM-SMT-VSNDI C-0002 -000 2.10.4 Flip-chip recognition <<Items to be set for Flip- ships>> Items to be set Set value Explanation Alignment Group Ball Sets the com ponent categor y . Alignment T ype Fli…

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Option 3: Recognition flag (Same as Special 2)
8. Special 8: Standard BGA recognition by using the multi-stage threshold value
Option 1: Lower 8 bits of the index number for the ball position information
Option 4: Upper 8 bits of the index number for the ball position information
Option 2: Binarization correction parameter
Option 3: Recognition flag
(9) Special 9: Not supported
(10) Special 10: BGA recognition with direction judgment by using marks.
(* This needs to be custom-ordered.)
Option 1: Lower 8 bits of the index number for the ball position information
Option 4: Upper 8 bits of the index number for the ball position information
Option 2: Binarization correction parameter
Option 3: Recognition Flag (Same as Special 2)
Number of Lead Group S: 1
Number of the leads S1: Check Direction Flag
Lead width S1: Direction Mark Diameter
Reflect LL. S1: Min. Brightness Difference
Find Pos. X S1: Direction Mark Center X
Find Pos. Y S1: Direction Mark Center Y
Note:
Please refer to “Appendix 3. Creating simple data in the special recognition modes” for the
method how to create components data in Special mode
Bit position
Sets up the 8 steps of the Threshold steps.(If
0,16,1:8,2:16,3:24..7:56)
Sets up the detection stage as
+
-
n (If 0, +
-
1, 1:+
-
1,2:+
-
2,3:+
-
3,
…
)
Excessive ball check (0:None, 1:Exist)
Bit position
Check Type:
(0: Black, 1: White)
Check Direction:
(0: 2 direction, 1: 4 direction)
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2.10.4 Flip-chip recognition
<<Items to be set for Flip-ships>>
Items to be set Set value
Explanation
Alignment Group Ball Sets the component category.
Alignment Type Flip Chip
Sets the component type.
Comp. Threshold
Sets the binarization level. (If 0, the binarization
level is set automatically.)
Comp. Tolerance Specifies the tolerance as a percentage.
Search Area (mm) Sets the range of the detection.
Body Size X (mm) Sets the size of the outer edge.
Body Size Y (mm) Sets the size of the outer edge.
Body Size Z (mm) Sets the size of the outer edge.
Bump Number N
Sets the number of BGA ball rows in the N
direction.
Diameter N (mm)
Sets the diameter of the solder balls in the N
direction.
StartPos X N (mm)
Sets the bump center position X of the starting
position in the N direction.
StartPos Y N (mm)
Sets the bump center position Y of the starting
position in the N direction.
End Pos X N (mm)
Sets the bump center position X of the ending
position in the N direction.
End Pos Y N (mm)
Sets the bump center position Y of the ending
position in the N direction.
Bump Number S
Sets the number of BGA ball rows in the S
direction.
Diameter S (mm)
Sets the diameter of the solder balls in the S
direction.
StartPos X S (mm)
Sets the bump center position X of the starting
position in the S direction.
StartPos Y S (mm)
Sets the bump center position Y of the starting
position in the S direction.
End Pos X S (mm)
Sets the bump center position X of the ending
position in the S direction.
End Pos Y S (mm)
Sets the bump center position Y of the ending
position in the S direction.
Bump Number E
Sets the number of BGA ball rows in the E
direction.
Diameter E (mm)
Sets the diameter of the solder balls in the E
direction.
StartPos X E (mm)
Sets the bump center position X of the starting
position in the E direction.
StartPos Y E (mm)
Sets the bump center position Y of the starting
position in the E direction.
End Pos X E (mm)
Sets the bump center position X of the ending
position in the E direction.
End Pos Y E (mm)
Sets the bump center position Y of the ending
position in the E direction.
Bump Number W
Sets the number of BGA ball rows in the W
direction.
Diameter W (mm)
Sets the diameter of the solder balls in the W
direction.
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Items to be set Set value
Explanation
StartPos X W (mm)
Sets the bump center position X of the starting
position in the W direction.
StartPos Y W (mm)
Sets the bump center position Y of the starting
position in the W direction.
End Pos X W (mm)
Sets the bump center position X of the ending
position in the W direction.
End Pos Y W (mm)
Sets the bump center position Y of the ending
position in the W direction.
Table 70
This is the recognition mode used for flip-chips such as shown in Figure 75.
Only the balls on the outer periphery are recognized. The centers of the balls on each side
where recognition is to start and end are specified. It is possible to specify the same ball for
both the horizontal and vertical directions.(In Figure 75, the starting points in the N and W
directions share the same point, and the ending points in the N direction and the ending point
in the E direction share the same point.)
Figure 75
[Recognition check items]
Items Yes / No
Notes
Body Size No
Ball pitch No
Number of balls Yes
Table 71
Dia
meter N
Diameter W
Diameter E
Diameter S
Pitch N
Pitch E
Pitch S
Pitch W
Body Size Y
Body Size X
Start Pos N/W
Start Pos S
End Pos N
Start Pos E
End Pos E
End Pos S
End Pos W