创建组件识别数据的方法.pdf - 第99页

99/178 IM-SMT-VSNDI C-0002 -000 Option 3: Recog nition flag ( Same as S pecial 2) 8. S pecia l 8: S tandard BGA recogni tion by using the multi-s tage threshold value Option 1: Low er 8 bits of the index n umber for the …

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Items to be set
Set
value
Lead Group N 1
Common
Ruler Offset N 0
Lead Number: 1N 25
Reflect LL.: 1N (mm) 624.0
Lead Width: 1N (mm) 0.6
Lead Pitch: 1N (mm) 1.27
Find Pos X: 1N (mm) -15.24
N
Direction
Group
1
Find Pos Y: 1N (mm) 15.24
Lead Group E 1
Common
Ruler Offset E 0
Lead Number: 1E 25
Reflect LL.: 1E (mm) 0
Lead Width: 1E (mm) 0.6
Lead Pitch: 1E (mm) 1.27
Find Pos X: 1E (mm) 15.24
E
Direction
Group
1
Find Pos Y: 1E (mm) -15.24
Table 69
Figure 74
5. Special 5: Not supported
6. Special 6: Not supported
7. Special 7: CGA recognition
Option 1: Lower 8 bits of the index number for the ball position information
Option 4: Upper 8 bits of the index number for the ball position information
Option 2: Binarization correction parameter
Set the
total
number
of balls.
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Option 3: Recognition flag (Same as Special 2)
8. Special 8: Standard BGA recognition by using the multi-stage threshold value
Option 1: Lower 8 bits of the index number for the ball position information
Option 4: Upper 8 bits of the index number for the ball position information
Option 2: Binarization correction parameter
Option 3: Recognition flag
(9) Special 9: Not supported
(10) Special 10: BGA recognition with direction judgment by using marks.
(* This needs to be custom-ordered.)
Option 1: Lower 8 bits of the index number for the ball position information
Option 4: Upper 8 bits of the index number for the ball position information
Option 2: Binarization correction parameter
Option 3: Recognition Flag (Same as Special 2)
Number of Lead Group S: 1
Number of the leads S1: Check Direction Flag
Lead width S1: Direction Mark Diameter
Reflect LL. S1: Min. Brightness Difference
Find Pos. X S1: Direction Mark Center X
Find Pos. Y S1: Direction Mark Center Y
Note:
Please refer to “Appendix 3. Creating simple data in the special recognition modes” for the
method how to create components data in Special mode
Bit position
Sets up the 8 steps of the Threshold steps.(If
0,16,1:8,2:16,3:24..7:56)
Sets up the detection stage as
+
-
n (If 0, +
-
1, 1:+
-
1,2:+
-
2,3:+
-
3,
…
)
Excessive ball check (0:None, 1:Exist)
Bit position
Check Type:
(0: Black, 1: White)
Check Direction:
(0: 2 direction, 1: 4 direction)
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2.10.4 Flip-chip recognition
<<Items to be set for Flip-ships>>
Items to be set Set value
Explanation
Alignment Group Ball Sets the component category.
Alignment Type Flip Chip
Sets the component type.
Comp. Threshold
Sets the binarization level. (If 0, the binarization
level is set automatically.)
Comp. Tolerance Specifies the tolerance as a percentage.
Search Area (mm) Sets the range of the detection.
Body Size X (mm) Sets the size of the outer edge.
Body Size Y (mm) Sets the size of the outer edge.
Body Size Z (mm) Sets the size of the outer edge.
Bump Number N
Sets the number of BGA ball rows in the N
direction.
Diameter N (mm)
Sets the diameter of the solder balls in the N
direction.
StartPos X N (mm)
Sets the bump center position X of the starting
position in the N direction.
StartPos Y N (mm)
Sets the bump center position Y of the starting
position in the N direction.
End Pos X N (mm)
Sets the bump center position X of the ending
position in the N direction.
End Pos Y N (mm)
Sets the bump center position Y of the ending
position in the N direction.
Bump Number S
Sets the number of BGA ball rows in the S
direction.
Diameter S (mm)
Sets the diameter of the solder balls in the S
direction.
StartPos X S (mm)
Sets the bump center position X of the starting
position in the S direction.
StartPos Y S (mm)
Sets the bump center position Y of the starting
position in the S direction.
End Pos X S (mm)
Sets the bump center position X of the ending
position in the S direction.
End Pos Y S (mm)
Sets the bump center position Y of the ending
position in the S direction.
Bump Number E
Sets the number of BGA ball rows in the E
direction.
Diameter E (mm)
Sets the diameter of the solder balls in the E
direction.
StartPos X E (mm)
Sets the bump center position X of the starting
position in the E direction.
StartPos Y E (mm)
Sets the bump center position Y of the starting
position in the E direction.
End Pos X E (mm)
Sets the bump center position X of the ending
position in the E direction.
End Pos Y E (mm)
Sets the bump center position Y of the ending
position in the E direction.
Bump Number W
Sets the number of BGA ball rows in the W
direction.
Diameter W (mm)
Sets the diameter of the solder balls in the W
direction.