创建组件识别数据的方法.pdf - 第178页
178/178 IM-SMT-VSNDI C-0002 -000 << For chip com ponents >> Figure 149 << For ball comp onents >> Figure 150 V ertical/ hor izontal component si ze (mm) Lead detection l ines Cross m ark indicatin…
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Appendix 4. Lead position check
Using the position where the lead tips should exist (the black dots at the lead tips in Figure
147) as the center, it checks whether the center of the actually detected lead tip is in the
allowable range or not.
In other words, this checks the offset between the actual lead tip position and the ideal
position that was determined from the component data, the component center that was
determined, and the tilt.
If the check range is 1.0 mm, this checks to see if the detected lead is within a range of +-1.0
mm.
Figure 147
Allowable range
Allowable range
Allowable range where the
lead
tip should be as its center
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Appendix 5. Reading and interpreting the recognition results display
The recognition results are displayed on the vision monitor or in the vision image monitor
window. The displayed contents vary depending on the recognition mode.
This section describes the typical results.
<For lead components>
Figure 148
Component detection center coordinate (
critical area
)
The total number of det
ected leads
Tilt of detected
component.
(degree)
Coordinate for the
center of
the side.
(pixels)
Number of the
leads per side.
Average pitch
per side.(mm)
Average lead width
per side. (mm)
The lead whose
ｔ
ip is detected
Lead detection lines
Lines connecting the
center position on the sides
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<< For chip components >>
Figure 149
<< For ball components >>
Figure 150
Vertical/ horizontal
component size
(mm)
Lead detection lines
Cross mark
indicating the
component
center.
Average ball
pitch in the
horizontal
direction.(mm)
Average ball
pitch in the
vertical direction.
(mm)
Number of rows
of balls in the
horizontal direction.
Number of columns
of balls in the
vertical direction.
Average ball
diameter. (mm)
Display showing
layout of
detected balls.