创建组件识别数据的方法.pdf - 第123页

123/178 IM-SMT-VSNDI C-0002 -000 Figure 97 Special 1 1: Not sup ported Special 12: Size Fittin g (Bare chip )re cognition This is used f or recognition of c hip compone nts. It detects the object whos e size is close to …

100%1 / 178
122/178
IM-SMT-VSNDIC-0002-000
and the center of the component is larger than the Min. Brightness Difference
(brightness of the outer periphery – brightness of the center > Min. Brightness
Difference), the result is satisfactory.
Option 2: Brightness threshold of center area
If the brightness of the component center is smaller than the Brightness
threshold of center area, the result is satisfactory. (0 is not checked)
(7) Special 7: Not supported
(8) Special 8: Chip Array
Option 1: (0: Convex electrode type, 1: Concave electrode type (Not supported),
2: Flat electrode type (C array))
(9) Special 9: Not supported
(10) Special 10: Check Upside-Down of Diode
This checks the variation of the brightness (dispersion) of the determination area in order
to identify the top surface and the bottom surface of the component.
It is applicable for the components with the characters printed on the molded area of the
pickup surface such as 2-terminal diodes.
Option 1: Threshold of 3-sigma
This sets the threshold of the brightness variance (3 sigma) in the determination
area. The variance becomes larger as the variation of the brightness becomes
larger.
Option 2: Threshold of Average
This sets the lower limit of the average threshold (Ave) of the determination area.
It is available only when “Dispersion” is selected from the “NG condition” item,
and is used to avoid the over-determination when judged by the variance.
Option 3: Judgment Flag
(Some old versions of software may not be equipped with this function.)
Dispersion: When the brightness variance is larger than the threshold in the
determination area, it is determined to be an error.
Non Dispersion: When the brightness variance is smaller than the threshold in the
determination area, it is determined to be an error.
The determination area is set to the “Lead Group 1” in the W direction.
(When it is required to offset to the East direction, set to E direction.)
- Number of the Lead Group W: 1
- Number of the leads W1: 0
- Lead Pitch W1: 0
- Lead Width W1: Determination area size Y
- Reflct LL W1: Determination area size X
- Find Pos X W1: Check Area Offset X
- Find Pos Y W1: Check Area Offset Y
Bit position
Check
-
Area Offset Enable:(0: Disable, 1: Enable)
NG condition: (0: Dispersion, 1: Non Dispersion)
123/178
IM-SMT-VSNDIC-0002-000
Figure 97
Special 11: Not supported
Special 12: Size Fitting (Bare chip )recognition
This is used for recognition of chip components. It detects the object whose size is
close to the defined component size by changing the threshold. It can also be used for
direction discrimination.
<Example of the setting for direction discrimination>
- Lead Group N: 2
- Number of the leads N2: Number of the brightness measurement area (circle)
- Lead Pitch N2: Pitch of the measurement area
- Lead Width N2: The diameter of the brightness measurement area (circle)
- Find Pos X: The coordinate of start point X in the brightness measurement area
- Find Pos Y: The coordinate of start point Y in the brightness measurement area
Option 1: Setting Flag
Option 2: The “Min. Brightness Difference” in the brightness measurement area
(When the value “0” is specified, the value “50” is adopted as default.)
Special 13: Not supported
Special 14: Not supported
Special 15: Check Many Adsorption
This detects whether more than one component is picked up by checking around
the detected chip component. The thickness of the actual component needs to be
input accurately as the distance to be checked varies depends on the component
thickness.
Determination area size Y
Determination area size X
Check Area Offset X
Check Area Offset Y
Bit position
Check Type: (0:Black, 1: White)
Check Direction: (0:
(0°, 180°), 1: (0°, 90°, 180°, 270°)
Picked up
properly
Not properly
picked up
124/178
IM-SMT-VSNDIC-0002-000
2.11.7. Special Recognition of chip components (Cylindrical chips)
There are several special recognition algorithms available in the Cylindrical Chip Recognition
mode.
(1) Special 1: Average brightness check in a object
If the outer periphery is brighter than the specified value, the result is satisfactory.
Option 1: The minimum value of difference between the brightness of outer periphery
and inner part
Option 2: The minimum brightness of inner part
Option 3: Cut Inner Noise
Option 4: Cut Outer Noise
(2) Special 2: Average brightness check in a object
If the outer periphery is darker than the specified value, the result is satisfactory.
Option 1: The maximum value of difference between the brightness of outer
periphery and inner part
Option 2: The maximum brightness of inner part
Option 3: Cut Inner Noise
Option 4: Cut Outer Noise
(3) Special 3: Center of gravity and shape constant check
This checks the shape constant.
Option 3: Cut Inner Noise
Option 4: Cut Outer Noise
The shape constant of a circle is obtained by dividing the square of the circumference
by the surface area, which becomes the constant of the certain value as shown below:
Peripheral length
2
/Surface area = (2 π r)
2
/ π r 2= 4 π
This value is calculated for the detected target, and is checked to see if it is within the
tolerance. (The surface area is also checked to see if it is within the tolerance.)
2.12. Special components
There are several mode available for recognition of special components.
1) Special Recognition mode
2) Odd. Chip Recognition mode
3) As Mark Recognition mode
4) Sp. Quad Recognition mode
5) Gravity mode
2.12.1. Special shapes
This recognition mode serves as the base for accommodating components with special
shapes. All of the component data shown in
Table 88
can be set.
Basically, this works as connector recognition, but it supports various types of recognition
depending on the base Alignment Type and algorithm(s) that are set.
For detailed information, please refer to the individual type of special recognition.