创建组件识别数据的方法.pdf - 第90页
90/178 IM-SMT-VSNDI C-0002 -000 2.10.1. Simple B GA Recognition mo de <<Items to be set for Sim ple BG As>> Items to be set Set value E xplanatio n Alignment Group Ball Set s the com ponent catego ry . Alignm…
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This mode is used for recognition of connectors that have leads only in one direction, and
there are some missing leads as shown in
Figure 67.
The number of the start and end of the missing leads are specified for Off Lead start /Off Lead
end parameters. In case of
Figure 67
, the values would be as follows:
Number of the leads: 9
Off Lead start: 4
Off Lead end: 6
Figure 67
If a connector has missing leads in two or more directions, it is recognized with the Off Lead
mode used for IC components.
[Recognition check items]
Items Yes / No Notes
Body Size No
Lead pitch Yes The pitch in the direction with one lead is not checked.
Lead width May exist
Checks only when the lead width is more than 1.0mm.
(Note 1)
Reflect LL No
Find Pos No
Table 60
Note:
“Lead width” check function may not be available for some old software versions.
2.10. Ball components
There are several modes that can be used for recognition of the ball components.
1) Simple BGA Recognition mode
2) BGA Recognition mode
3) Flip-chip Recognition mode
Lead length
Lead width
Lead pitch
Body Size Y
Body Size X
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2.10.1. Simple BGA Recognition mode
<<Items to be set for Simple BGAs>>
Items to be set Set value Explanation
Alignment Group Ball Sets the component category.
Alignment Type Simple BGA
Sets the component type.
Comp. Tolerance
Specifies the tolerance of the ball pitch as a
percentage.
Search Area (mm) Sets the range of the detection.
Body Size X (mm) Sets the size of the outer edge.
Body Size Y (mm) Sets the size of the outer edge.
Body Size Z (mm) Sets the size of the outer edge.
Ball number N
Sets the number of BGA ball rows in the horizontal
direction.
Ball number E
Sets the number of BGA ball rows in the vertical
direction.
BGA diameter (mm)
Sets the diameter of the solder balls.
BGA Pitch (mm) Sets the pitch of the solder balls.
Ball Amount Sets the total number of the solder balls.
Table 61
This mode is used for recognition of BGAs and CSPs whose solder balls with the same
diameter are placed at the same pitch in a regular pattern over the entire grid.
If there are places on the grid where there are no balls, or the pitches are different in the
horizontal and vertical directions, the after-mentioned BGA mode is used.
Figure 68
[Recognition check items]
Items Yes / No Notes
Body Size No
Ball pitch Yes
Table 62
Body Size Y
Body Size X
Ball diameter
Ball pitch
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The following is the actual example of the setting and the recognition result.
<<Items to be set for Simple BGAs>>
Items to be set Set value
Alignment Group Ball
Alignment Type Simple BGA
Comp. Tolerance 30
Search Area (mm) 3.0
Body Size X (mm) 5.0
Body Size Y (mm) 8.0
Body Size Z (mm) 0.5
Ball number N 6
Ball number E 8
BGA diameter (mm) 0.4
BGA Pitch (mm) 0.8
Ball Amount 48
Table 63
Figure 69