创建组件识别数据的方法.pdf - 第110页
110/178 IM-SMT-VSNDI C-0002 -000 detection. Conse quentl y , the y should be defined as clos e to the outer edge as poss ible within the var ious quadrants. ( The user do not ne ed to c oncern about m aking these pos iti…

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Figure 79
The following is the definition coordinate.
Figure 80
Pos 0 ~ 7 are the balls referred to as reference balls, and are used for rough position

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detection. Consequently, they should be defined as close to the outer edge as possible
within the various quadrants. (The user do not need to concern about making these positions
precisely.) It is possible to perform recognition by using Pos1 ~ 4, or Pos5 ~ 8.
<< Commands for bump position definition >>
Command Items to be set
#SIZE Sets the size of the component.
#DIAMETER Sets the default ball diameter.
#POS Sets the ball position.
#POS 0 – #POS 7 Sets the reference ball position.
Table 75
The following is the actual example of recognition.
<<Flip chip Special 2 and 3>>
Figure 81
Items to be set Set value
Alignment Group Special
Alignment Type Special
Comp. Threshold 0
Comp. Tolerance 30
Search Area (mm) 0.5
Body Size X (mm) 3.5
Body Size Y (mm) 3.5
Body Size Z (mm) 0.5
Cntr. Offset X (mm)
0.0
Cntr. Offset Y (mm)
0.0
Cntr. Offset R (mm)
0.0
Ruler Width 0
Algorithm Special 2
Base Alignment Flip chip
Vision Option 1 126
Vision Option 2 0
Vision Option 3 0
Common
Data
Vision Option 4 0
File specified by
this number.

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Figure 82
shows the definition shape.
Figure 82
Figure 83 shows the recognition result obtained by the data.
Figure 83
2.11 Chip components
There are a number of modes for chip recognition.
1) Standard Chip Recognition mode
2) MELF Chip Recognition mode
3) Bare Chip Recognition mode
4) Cylindrical Chip Recognition mode
5) Special Chip Recognition mode
6) Small Chip Recognition mode