创建组件识别数据的方法.pdf - 第91页

91/178 IM-SMT-VSNDI C-0002 -000 The following is the actual example of the s etting and the recognitio n result. <<Items to be set for Sim ple BG As>> Items to be set Set value Alignment Group Ball Alignment …

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2.10.1. Simple BGA Recognition mode
<<Items to be set for Simple BGAs>>
Items to be set Set value Explanation
Alignment Group Ball Sets the component category.
Alignment Type Simple BGA
Sets the component type.
Comp. Tolerance
Specifies the tolerance of the ball pitch as a
percentage.
Search Area (mm) Sets the range of the detection.
Body Size X (mm) Sets the size of the outer edge.
Body Size Y (mm) Sets the size of the outer edge.
Body Size Z (mm) Sets the size of the outer edge.
Ball number N
Sets the number of BGA ball rows in the horizontal
direction.
Ball number E
Sets the number of BGA ball rows in the vertical
direction.
BGA diameter (mm)
Sets the diameter of the solder balls.
BGA Pitch (mm) Sets the pitch of the solder balls.
Ball Amount Sets the total number of the solder balls.
Table 61
This mode is used for recognition of BGAs and CSPs whose solder balls with the same
diameter are placed at the same pitch in a regular pattern over the entire grid.
If there are places on the grid where there are no balls, or the pitches are different in the
horizontal and vertical directions, the after-mentioned BGA mode is used.
Figure 68
[Recognition check items]
Items Yes / No Notes
Body Size No
Ball pitch Yes
Table 62
Body Size Y
Body Size X
Ball diameter
Ball pitch
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The following is the actual example of the setting and the recognition result.
<<Items to be set for Simple BGAs>>
Items to be set Set value
Alignment Group Ball
Alignment Type Simple BGA
Comp. Tolerance 30
Search Area (mm) 3.0
Body Size X (mm) 5.0
Body Size Y (mm) 8.0
Body Size Z (mm) 0.5
Ball number N 6
Ball number E 8
BGA diameter (mm) 0.4
BGA Pitch (mm) 0.8
Ball Amount 48
Table 63
Figure 69
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2.10.2 BGA Recognition mode
<< Items to be set for BGAs>>
Items to be set Set value
Explanation
Alignment Group Ball Sets the component category.
Alignment Type BGA Sets the component type.
Comp. Tolerance
Specifies the tolerance of the ball pitch as a
percentage.
Search Area (mm) Sets the range of the detection.
Body Size X (mm) Sets the size of the outer edge.
Body Size Y (mm) Sets the size of the outer edge.
Body Size Z (mm) Sets the size of the outer edge.
Ball number N
Sets the number of BGA ball rows in the
horizontal direction.
Ball number E
Sets the number of BGA ball rows in the vertical
direction.
BGA diameter (mm)
Sets the diameter of the solder balls.
BGA Pitch N (mm) Sets the pitch of the solder balls.
BGA Pitch E (mm) Sets the pitch of the solder balls.
Ball Amount Sets the total number of the solder balls.
Binary Level
Sets the parameter for correcting the
binarization level.
When performing recognition of the components
that have the white area other than the balls to
be detected, set the ratio of the white portion as
a percentage of the overall ball area in order to
correct the binarization level.
Table 64
This mode is used when there are places without solder balls on the grid, or the pitches are
different in the horizontal and vertical directions. It is also applicable for BGAs and CSPs in a
zigzag pattern. In this mode, recognition is performed by using the information that specifies
whether there are balls on the grid or not.
Figure 70
Ball diame
ter
Ball pitch
N
Ball pitch E
Body Size Y
Body Size X