创建组件识别数据的方法.pdf - 第3页
3/178 IM-SMT-VSNDI C-0002 -000 2.1 1. 2 MELF c hips ...................................................................... ............................... 1 14 2.1 1. 3 Bare chip ........ ................................…
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1. Component data .......................................................................................................... 5
1.1 Component data configuration ..................................................................................... 5
1.2 The basics of the component data definitions............................................................ 12
1.3 Simple settings for component data........................................................................... 14
1.4 Precautions concerning the component data definitions ........................................... 17
1.4.1 ReflectLL. ............................................................................................................ 17
1.4.2 Component sizes (chip component).................................................................... 18
2. Details of the component data setting .................................................................... 18
2.1 2-pin components....................................................................................................... 19
2.2 Mini-mold trasnsistors / SOTs .................................................................................... 21
2.2.1 Mini-mold transistor / SOTs Special –(1) ............................................................. 26
2.2.2 Mini-mold transistor / SOTs Special –(4) ............................................................. 28
2.3 P-Tr ............................................................................................................................ 29
2.4 SOPs .......................................................................................................................... 35
2.4.1 Special recognition in the SOP Recognition mode.............................................. 37
2.5 SOJs........................................................................................................................... 44
2.5.1 Special recognition in the SOJ Recognition mode .............................................. 47
2.6 QFPs .......................................................................................................................... 48
2.6.1 Special recognition in the QFP Recognition mode.............................................. 50
2.7 PLCCs ........................................................................................................................ 53
2.7.1 Special recognition in the PLCC Recognition mode ........................................... 56
2.8 Off Lead...................................................................................................................... 60
2.9 Connector components .............................................................................................. 67
2.9.1 Single-direction connectors ................................................................................. 67
2.9.2 4-direction connectors ......................................................................................... 69
2.9.3 Special recognition of connectors........................................................................ 74
2.9.4 Odd-shape connectors ........................................................................................ 88
2.10 Ball components....................................................................................................... 89
2.10.1 Simple BGA Recognition mode......................................................................... 90
2.10.2 BGA Recognition mode ..................................................................................... 92
2.10.3 Special recognition of BGAs.............................................................................. 94
2.10.4 Flip-chip recognition ........................................................................................ 100
2.10.5 Flip-chip recognition: Special 1........................................................................ 102
2.10.6 Flip-chip recognition : Special 2 and 3 ............................................................ 107
2.11 Chip components ....................................................................................................111
2.11.1 Standard chips ................................................................................................. 112
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2.11.2 MELF chips..................................................................................................... 114
2.11.3 Bare chip.......................................................................................................... 115
2.11.5 Special chips.................................................................................................... 117
2.11.6 Small Chip ....................................................................................................... 118
2.11.6 Special recognition of chip components .......................................................... 119
(standard chips, MELF chips, special chips)................................................................. 119
2.11.7 Special Recognition of chip components (Cylindrical chips) ........................... 124
2.12 Special components............................................................................................... 124
2.12.1 Special shapes ................................................................................................ 124
2.12.2 Odd-shape chips ............................................................................................. 128
2.12.3 Mark types ....................................................................................................... 129
2.12.4 Special Quad ................................................................................................... 155
2.12.5 Center of Gravity detection.............................................................................. 162
3. Fiducial Mark Recognition...................................................................................... 165
3.1 Center of Gravity detection (Recognition type: Normal) .......................................... 165
3.2 Template matching (Recognition type: pattern) ....................................................... 167
3.3 Corner detection....................................................................................................... 168
3.4 Top Edge detection .................................................................................................. 169
3.5 CirEdge detection..................................................................................................... 170
3.6 Contour rectangle detection / contour triangle detection ......................................... 170
3.7 Edge circle detection................................................................................................ 171
3.8 Edge rectangle / triangle detection .......................................................................... 171
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Appendix ............................................................................................................................. 173
Appendix 1. Noise processing.......................................................................................... 173
Appendix 2. Detection level differences used to detect leads (threshold value) ........ 174
Appendix 3. Creating simple data in the special recognition modes ........................... 175
Appendix 4. Lead position check ..................................................................................... 176
Appendix 5. Reading and interpreting the recognition results display........................ 177