SIPLACE Station Software 7xx to 714 介绍.pdf - 第10页

10 13 Feature Description – Statio n Software V712.x 243 13.1 Customer-specific Nozzles – Improvements .................................................... 243 13.2 "IPC -HERMES-9852" – Enha ncements ..........…

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11 Feature Description Station Software V710.x 213
11.1 SIPLACE TX micron New Placement Machine ............................................. 213
11.1.1 Vacuum Tooling ............................................................................................... 213
11.1.2 ACT Dependent on Precision ....................................................................... 213
11.2 Shuttle Extension for SIPLACE TX-Series ....................................................... 214
11.3 Precision Value ................................................................................................ 215
11.4 Alternative Component Shapes ....................................................................... 215
11.5 Odd Shape Components OSC Package Option ........................................... 216
11.5.1 Vision OSC Measuring Options ....................................................................... 216
11.5.2 Increased Placement Force of Twin VHF ........................................................ 218
11.5.3 Improved Placement of Snap-In Components ................................................. 219
11.5.4 Support to Find Best Acceleration ................................................................... 221
11.6 New Fiducial Type Notch .............................................................................. 224
11.7 Special Fiducial Evaluation for LED Centering ................................................ 224
11.8 Simplified Tray Teaching for Standard Trays ................................................... 225
11.9 Improved Foil Torn Handling............................................................................ 225
11.10 Teaching Pickup Location Nozzle Tip Displayed .......................................... 225
11.11 SIPLACE CPP M New Placement Head ....................................................... 226
11.12 SIPLACE JTF-ML2 New Feeder ................................................................... 226
11.13 Vacuum Tooling ............................................................................................... 227
11.13.1 Verifying the Vacuum Tooling .......................................................................... 227
11.13.2 Checking the Vacuum Tooling Fiducials .......................................................... 227
11.14 Providing Process and Board Data via ASM OIB ............................................ 227
11.15 Shuttle Extension for SIPLACE TX-Series Enhancements ........................... 227
11.16 Board Inspections New Types ...................................................................... 228
11.17 Alternative Components Enhancements ....................................................... 228
11.18 Temperature-Based Head Recalibration ......................................................... 228
11.19 Touchless Placement New Placement Process ........................................... 228
11.20 Twin Head Placing Two Long but Narrow Components in One Cycle .......... 229
11.21 Nozzles New Concave Nozzles .................................................................... 229
11.22 Long Board Option up to 1525 mm .................................................................. 229
11.23 Automatic Calibration System Identification for SX-series ............................ 229
11.24 Miscellaneous Improvements and Adaptions .................................................. 230
11.24.1 Audible Signal for Indicator Lamps New Pulse State .................................... 230
11.24.2 Station Software GUI Adaptions ................................................................... 230
12 Feature Description Station Software V711.x 231
12.1 "The Hermes Standard" New Communication Protocol ................................ 231
12.2 New Placement Force Very Low Force in Placement, Pickup and Dipping
Processes ........................................................................................................ 232
12.3 SEMO CRF80 New Tape Feeder ................................................................. 232
12.4 SIPLACE TX micron-Series Teaching .......................................................... 232
12.5 Unique Machine Data for Quality Check .......................................................... 233
12.6 Enhanced Machine Endurance Run ................................................................ 233
12.7 Component Position Check ............................................................................. 234
12.8 Using Two Dip Modules for Dipping ................................................................. 235
12.9 Enhanced FCCS Tool ...................................................................................... 235
12.10 Enhanced SIPLACE Vision Functionality ......................................................... 235
12.11 SIPLACE TX V2 New Placement Machine ................................................... 236
12.11.1 Switching Off Cover Fan and Vacuum Pump Fan ........................................... 236
12.12 SIPLACE C&P20 P2 New Placement Head ................................................. 236
12.13 SST48 and SST49 New Camera Types ....................................................... 236
12.14 SIPLACE SmartFeeder Xi New X-Feeders ................................................... 237
12.15 Linear Dipping Unit 2 X New Dipping Module ............................................... 237
12.16 Adjusting Z-Height of Vacuum Tooling ............................................................ 239
12.17 SIPLACE JTF-ML2 Enhanced Functionality ................................................. 240
12.18 Multiple Road Runner Feeders Improved Handling ...................................... 241
12.19 "The Hermes Standard" Board Locking Process .......................................... 241
12.20 Front-Back-Offset Measurement...................................................................... 242
12.21 Checking GigE Camera Connections Enhanced Functionality ..................... 242
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13 Feature Description Station Software V712.x 243
13.1 Customer-specific Nozzles Improvements .................................................... 243
13.2 "IPC-HERMES-9852" Enhancements ........................................................... 243
13.3 OSC Package Option Enhancements........................................................... 244
13.4 CPP Placement Head Increased Placement Force and Component Weight245
13.5 Smart Pin Support Enhancements................................................................ 245
13.5.1 Smart Pin Support for SIPLACE TX V2-Series ................................................ 245
13.5.2 Prompt To Fill Or Empty Magazines / Garages ............................................... 246
13.6 Linear Dipping Unit 2 X / Linear Dipping Unit E Enhancements ................... 246
13.7 Shuttle Extension for SIPLACE SX V2-Series ................................................. 246
13.8 SIPLACE MeasuringFeeder X ......................................................................... 246
13.9 Station Behavior When Using Alternative Tracks ............................................ 248
13.10 "Cracked Die Inspection" ................................................................................. 248
13.11 Measuring Barcode on Bottom Side of Component......................................... 251
13.12 Pass-Through Mode for Boards without Recipe .............................................. 251
13.13 Redesigned Calibration View ........................................................................... 252
13.14 Displaying Customer Messages ...................................................................... 255
13.15 SIPLACE Vision Functionality Additional Enhancements ............................. 256
13.15.1 Contamination Scan ........................................................................................ 256
13.15.2 Detection of Tilted Chips .................................................................................. 257
13.15.3 Face Down Recognition with Gullwing Leads Enhancement ........................ 257
13.15.4 Flux Inspection ................................................................................................. 258
13.16 Miscellaneous Improvements and Enhancements .......................................... 258
13.17 OSC Package Option Enhancements........................................................... 260
13.18 Robustness Package Enhancements ........................................................... 260
13.19 "IPC-HERMES-9852" Enhancements ........................................................... 261
13.20 Smart Pin Support Enhancements................................................................ 262
13.21 Saving of Data Enhancements ..................................................................... 262
13.22 Pickup Position Teaching Enhancements..................................................... 262
14 Feature Description Station Software V713.x 263
14.1 Smart Pin Support for TX V2 Enhancements ............................................... 263
14.2 Automatic Cavity Calibration for Linear Dipping Unit 2 X (LDU 2 X) ................ 264
14.3 Easy Software Deployment.............................................................................. 264
14.4 Maintenance Data Interface (MDI) Supported ................................................. 264
14.5 Five Color Signal Tower Supported for SIPLACE SX V3 Machine .................. 264
14.6 New Nozzle Types ........................................................................................... 265
14.7 Conveyor Direction in Station GUI ................................................................... 265
14.8 Placement Improvements Freely Programmable Custom Reject Bins ......... 266
14.9 Placement Improvements Automatic Pin1 Recognition ................................ 266
14.10 Reject Rate View - Enhancements .................................................................. 266
14.11 Changes for Stop Thresholds for Reject Rate Monitoring ............................... 266
14.12 Changes With HERMES-IPC-9852 Version 1.2 .............................................. 267
14.13 New Fiducial Type “Edge” Supported .............................................................. 267
14.14 Inspecting Components After Placement at Too High Speed .......................... 267
14.15 “SIPLACE Service” Button Permanently Visible in Station GUI ....................... 267
14.16 Adjusting Sigma Level for Accuracy Check Tool (ACT) Results ...................... 268
14.17 Support of SIPLACE TX2 V2 HD / SIPLACE TX2i V2 HD ............................... 269
14.18 Configuring Tolerance Values for Resetting the Conveyor Width .................... 269
14.19 Scan Request Dialog Enhancements ........................................................... 270
14.20 Monitoring and Logging of Maintenance Status ............................................... 271
14.21 Synchronizing Recalibrations of All SIPLACE Stations Along the Line ........... 272
14.22 Verifying Vacuum Tooling by Barcode Fiducial ............................................... 274
14.23 Selecting Flexible Filling Level for Matrix Trays ............................................... 276
15 Feature Description Station Software V714.x 277
15.1 SIPLACE Tray Unit Supported......................................................................... 277
15.2 SIPLACE TX2 V2 Placement at Forward Stopper and Reverse Stopper
Supported in Convoy Mode ............................................................................. 277
15.3 New Hardware Supported on SIPLACE TX2 V2 ............................................. 278
15.4 Smart Pin Support Changed Behavior for Product Changeover Sequence . 278
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15.5 Combination of CPP M and CP20 M3 Placement Heads Supported in
TX micron V2 ................................................................................................... 278
15.6 Tray Teaching Dialog Enhancements ........................................................... 279
15.7 Component Camera (Type 48) 8x8 GigE and PCB Camera (Type 54)
Supported ........................................................................................................ 279
15.8 Automatic Recognition of XX Nozzle Magazine Change on Prepare for
Production ........................................................................................................ 280
15.9 Verifying Clinching Tool by Barcode Fiducial ................................................... 280
15.10 Navigating Between Related Vision Dump Files .............................................. 282
15.11 Status of Fans Displayed in Station GUI for SIPLACE SX V3 Placement
Machine ........................................................................................................... 284
15.12 Changed Behavior When Components Cannot Be Rejected .......................... 286
15.13 OSC Package Enhancements ...................................................................... 287
15.14 Password of Account ASM_Admin Can Be Freely Chosen ............................. 287