SIPLACE Station Software 7xx to 714 介绍.pdf - 第63页
Station Software 7xx to 714.0 (R20-2) / Feature Description 11/2020 Edition 63 7.4 Automatic Pin Positioning with Smar t Pin Support For many products it is neces sary to support the board with so-call ed Support Pins in…
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7 Feature Description – Station Software V706.x
Features (V706.0: Compatible Mode V705)
7.1 SX1/SX2 V2 Placement Machine
The station software supports the new SX1/SX2 V2 placement machine (with one or two gantries)
in one-computer operation. The SX1/SX2 V2 placement machine only differs slightly from the
SX1/SX2 placement machine:
– Support of the new SX V2 PCB conveyor system.
– Calibration part holder at another position and consequently also the zero point.
7.2 DX4 Dual Placement Machine
The station software supports the new DX4 Dual placement machine with dual lane conveyor in
one-computer operation. The DX4 Dual placement machine only differs slightly from the SX4
placement machine:
– Head configuration with C&P20 placement heads only.
7.3 SX V2 Conveyor System
A new SX V2 conveyor system has been introduced for the SX1/SX2 V2 placement machine.
SX V2 consists of the input, processing and output sections and supports single and dual lane
conveyor.
Fixed and flexible conveyor rails and such properties as width adjustment, moving the board into
the machine etc. are, for the most part, identical to the existing conveyor system for the SX1/SX2
placement machine.
The maximum board length without the Long Board option is 450 mm and 610 mm with this
option. The maximum board width results from the fixed rail position and the conveyor mode (dual
or dual as single). The maximum board thickness is 6.5mm.
Light barriers are installed at fixed positions as stoppers for the board in the conveyor system: one
light barrier per conveyor segment (input conveyor, processing area, output conveyor and, if
applicable, intermediate conveyor). Optionally, an additional light barrier may be installed for the
Long Board option.
There are no mechanical stopper and no overlapping mapping.
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7.4 Automatic Pin Positioning with Smart Pin Support
For many products it is necessary to support the board with so-called Support Pins in the
processing area. The support pins are placed on the lifting table and are kept at the defined
position by a magnet.
Manual override in the clamping area is very non-ergonomic and thus it is difficult to position the
support pins accurately by hand. Therefore an automatic pin positioning has been realized for the
SX1/SX2 V2 placement machine that is supported by this station software version. The support pin
positioning is performed by a pin picker that may position a definable number of support pins on the
lifting table. The support pin positions are defined for the recipe in SIPLACE Pro.
When the recipe is produced on the line, the support pins are automatically positioned before
production begins. Already available support pins on the lifting table may then be brought to new
positions. Missing support pins are taken from a pin magazine. If too many support pins are
available on the lifting table, they will be put back into the pin magazine. In the Setup view it is
possible to check the current support pin positions and to place or remove support pins.
Detailed information on Smart Pin Support can be found in the corresponding user manual,
item no. [00197001-01], and in the online help files to SIPLACE Pro and the station software.
Restrictions
– No collision checks in case of manual configurations on the Machine service and SIPLACE
service activity levels.
– Support pins cannot be placed before all boards in the processing area have been produced
and unloaded from the machine. Loaded boards are blocked in the input section.
– In case of barcode mode together with support pin positioning, a barcode change results in a
long changeover time, as the support pin positioning does not start until all boards have been
unloaded (except for the boards in the input section).
7.5 Revision of SSI Interface for OIS Events
The SSI interface has been revised in order to improve the support of I-Placement mode by the
OIS events. Especially, the support has been improved for the monitoring data in connection with
the "Continue production when track is empty" feature.
7.6 New SIPLACE Glue Feeder Feeder Type
The station software supports the new SIPLACE Glue Feeder feeder type. SIPLACE Glue Feeder
is an X-feeder with which glue dots can be applied onto the rear side of the component just before
the component gets placed.
The glue dots are modeled in SIPLACE Pro by defining the X-position, Y-position and the diameter
of each glue dot on the component. Multiple different glue dots can be defined for a single
component.
The process parameters of a glue dot are stored in a characteristic line at the station. The
corresponding XML file contains the glue name, the glue dot diameter, the number of shots per
glue dot, the Z-height of the jet and the fixed defined frequency of the shots.
The process parameters per glue dot are assigned at the station as follows:
Via the definition for the glue dot diameter in SIPLACE Pro the closest glue dot diameter in the
characteristic line is defined (always rounded down). The defined number of shots, the Z-height
and the frequency of the glue type are the process parameters that are passed on to the pickup
process and the SIPLACE Glue Feeder.
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The XML file is available under the C:\Sirio\Types directory on the service desktop and may be
edited by an XML editor, if necessary. The process parameters can only be modified, copied or
distributed at the station by a SIPLACE service engineer. For this the Service (SIPLACE) activity
level is required. After the XML file has been changed, the station has to be warm-started or the
placement machine rebooted.
After the job has been downloaded to the station, the operator can measure the X-, Y- and Z-
positions of the jet and check if the jet is soiled via SIPLACE Vision (manually in the Manual
Operations for the feeder) The X- and Y-positions are measured with the PCB camera and the Z-
position with a nozzle and a reference plate.
The station software generates a glue job for each glue dot during which the following steps are
performed:
– The component is moved to the X-/Y-positions to apply the glue dots (considering the
measured X-/Y-offsets of the jet).
– The component is moved to the configured Z-position (XML file) to apply the glue dots
(considering the measured Z-height of the jet).
– The component presence is checked by SIPLACE Vision to ensure that the glue dots are not
applied onto an empty nozzle.
– The glue dots are applied onto the component using the process parameters that are stored in
the characteristic line at the station.
– The component presence is checked again by SIPLACE Vision to ensure that the component
did not get out of place during the glue process. If a measuring error occurs during the
component check by SIPLACE Vision, the component is rejected, i.e. components from a tray
are not returned into the tray.
– The Z-axis is moved to the initial position.
A collision check of the process height is performed before the glue process starts. At risk of
collision the glue process is rejected or the component is not picked-up.
Glue dot inspection and teaching by SIPLACE Vision
In order for SIPLACE Vision to detect and evaluate a glue dot, a reference image of a component
will be acquired right before the glue is applied onto the component.
During a measuring job with glue dot inspection, there will be a check for each glue dot, if:
– The glue dot exists.
– The size is within the defined tolerance, i.e. if the measured surface of the glue dot lies
between the minimal and maximal circular area in the model.
– The glue dot lies within the defined "target area": a rectangular target area can be defined in
the model. The inspection checks if the glue dot is completely positioned within this target area.
An error message is displayed if the glue dot touches the border of the target area.
Optionally, a separate lighting can be set for the glue dot inspection.
The following glue dot parameters may be modified in the GF Editor at the station:
– Inspection
– Tolerance
– Target area (X/Y/size)