Chapter3_Repair_Guide.pdf - 第161页

Model DECAN Series Company SAMSUNG TECHWIN Module 3.1 1 HEAD T otal Pages 62 目录 [ 设定 HEAD BLOW 及 VACUUM(F2) ] .................................................................. 2 [ 设定 HEAD BLOW 及 VACUUM(L2) ] ...........…

Model

DECAN Series

Company

SAMSUNG TECHWIN

Module

3.10 FEEDER

Version

Title

更换控制板

Page

3-10-16

Note

5. 参考下列内容将连接器连接到主板

6. 组装盖板

7. 更换后，设定

-设定原点、传感器初始化、映射

Model

DECAN Series

Company

SAMSUNG TECHWIN

Module

3.11 HEAD

Total Pages

[设定 HEAD BLOW 及 VACUUM(F2)] .................................................................. 2

[设定 HEAD BLOW 及 VACUUM(L2)] .................................................................. 7

[HEAD 外观检查] ................................................................................................ 12

[组装 HEAD(F2)] ................................................................................................ 13

[组装 HEAD(L2)] ................................................................................................ 15

[组装 HEAD AMP(F2)] ....................................................................................... 17

[组装 HEAD AMP(L2)] ....................................................................................... 22

[HEAD CABLE 布线] .......................................................................................... 24

[Z 轴噪音判定标准] ............................................................................................. 27

[更换 HEAD SOLENOID VALVE(F2)] ................................................................ 28

[更换 HEAD SOLENOID VALVE(L2)] ................................................................ 30

[更换 NOZZLE HOLDER] ................................................................................... 32

[更换 BALL SPLINE(F2)] .................................................................................... 33

[更换 BALL SPLINE(L2)] .................................................................................... 36

[组装 LM GUIDE] ............................................................................................... 39

[调整 Z、R 轴传输带张力 (F2)] .......................................................................... 40

[调整 Z、R 轴传输带张力 (L2)] ........................................................................... 41

[组装 MOTOR DRIVER] ..................................................................................... 42

[更换 Z、R 轴传感器(F2)] ................................................................................... 44

[更换 Z、R 轴传感器(L2)] ................................................................................... 45

[再组装 Z、R 轴 MOTOR PULLEY(F2)] ............................................................. 46

[再组装 Z、R 轴 MOTOR PULLEY(L2)] ............................................................. 51

[更换 FLY MIRROR] .......................................................................................... 55

[更换 MIRROR SWING MOTOR] ....................................................................... 56

[再组装 SWING CAM SET SCREW] .................................................................. 57

[更换 FIDUCIAL CAMERA 照明 LED] ................................................................ 58

[注入润滑脂(F2)] ................................................................................................ 60

[注入 GREASE(L2)] ........................................................................................... 61

[更换 ROTARY JOINT(L2)] ................................................................................ 62

Model

DECAN Series

Company

SAMSUNG TECHWIN

Module

3.11 HEAD

Version

Title

设定HEAD BLOW及VACUUM(F2)

Page

3-11-2

Note

[设定 HEAD BLOW 及 VACUUM(F2)]

 确认 Main Air Setting

确认 Digital Gauge 值是否 0.5 Mpa(Spec 0.45~0.55Mpa)及设定

 确认气动 Current Level

1. 选择 MMI <Diagnosis> → <Vacuum>

2. Vacuum/Blow Off 状态下，确认 Current Level

 确认 Current Level 是否符合于 0±9 mmHg

 不符合时，调整 Head IO Board 的 VR，重新设定

3. 以相同方式确认 Gantry2 的 Head 11~20