X3_X4_Series machine.pdf - 第113页
User manual SIPLAC E X-Series 3 Technical data Software Vers ion SR.601.xx 11/ 2005 US Ed ition 3.4 Dimensions and weight of the placement machine 113 3.4.13 Maneuvering di stance for the matrix tray changer 3 3 3 3 Fig.…
3 Technical data User manual SIPLACE X-Series
3.4 Dimensions and weight of the placement machine Software Version SR.601.xx 11/2005 US Edition
112
3.4.12 Dimensions of the X2 placement system with matrix tray changer
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Fig. 3.4 - 11 Dimensions of the X2 placement system with matrix tray changer in millimeters
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PLEASE NOTE 3
A matrix tray changer may be docked in at locations 2 and 4 in place of a component trolley.
User manual SIPLACE X-Series 3 Technical data
Software Version SR.601.xx 11/2005 US Edition 3.4 Dimensions and weight of the placement machine
113
3.4.13 Maneuvering distance for the matrix tray changer
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3
3
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Fig. 3.4 - 12 Maneuvering distance for the MTC
1, 2, 3, 4 Locations no. 1, 2, 3, 4
X2 machine: Locations 2 and 4
X3 machine: Location 2 only
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3 Technical data User manual SIPLACE X-Series
3.5 Line concept Software Version SR.601.xx 11/2005 US Edition
114
3.5 Line concept
3.5.1 Description
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The SIPLACE concept is characterized by its flexibility, modularity, compactness and high power
density. It allows a production line to be individually configured from identical and different mod-
ules. If the production requirements change, the individual placement machines are so compact
that they can be recombined quickly and easily.
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Fig. 3.5 - 1 Sample line concept
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The SIPLACE family has exactly the right placement machine, whatever the output requirements:
SIPLACE X-series
placement machines can be used to place IC, flip-chip, bare die and
exotic components (OSC). They cover the spectrum of components from 0201 to 85 x 85 /
125 x 100 mm² with a very high placement rate.