X3_X4_Series machine.pdf - 第363页

User manual SIPLAC E X-Series 6 Component han dling Software Vers ion SR.601.xx 11/ 2005 US Ed ition 6.9 Used tape c hannel - component t rolley docking unit SIPL ACE HF 363 6.9.2 Removing the sep arating pla t e for t a…

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6 Component handling User manual SIPLACE X-Series
6.9 Used tape channel - component trolley docking unit SIPLACE HF Software Version SR.601.xx 11/2005 US Edition
362
6.9 Used tape channel - component trolley docking
unit SIPLACE HF
6.9.1 Separating plate for tape pocket heights up to 17 mm
In the standard version, the used tape channel can guide component tapes with a maximum
pocket height of 17 mm to the pneumatic tape cutter.
6
Fig. 6.9 - 1 Used tape channel, SIPLACE HF
(1) Inlet slot for the used tapes
(2) Outlet slot for the used tape above the pneumatic tape cutter
(3) Dividing plate for tapes < 17 mm (can be removed for tapes > 17 mm)
(4) DIN 84 - M3x6 screw, 2x
User manual SIPLACE X-Series 6 Component handling
Software Version SR.601.xx 11/2005 US Edition 6.9 Used tape channel - component trolley docking unit SIPLACE HF
363
6.9.2 Removing the separating plate for tape pocket heights > 17 mm
If S feeder modules that process component tapes with a pocket height > 17 mm are used, such
as, for example, the 44 mm S DP feeder module, then the separating plate (item 3 in Fig. 6.9 - 1
)
must be removed.
WARNING 6
Æ Switch the placement machine off at the main switch to remove the dividing plate.
Æ Disconnect the machine from the power and compressed air supply.
Æ Secure the machine to prevent it being switched on again, as described in section 2.10, page
86
.
Æ Wait until the operating pressure for the tape cutter has dropped to 0 MPa.
Æ Wear robust protective gloves.
Æ Do not reach inside the used tape channel.
Æ Loosen the two slotted screws (item 4 in Fig. 6.9 - 1).
Æ Pull out the dividing plate.
PLEASE NOTE
Do not position feeder modules with shallow pockets immediately beside bar feeder modules
with deep pockets. The used tapes could overlap and build up.
6 Component handling User manual SIPLACE X-Series
6.10 Matrix tray changer Software Version SR.601.xx 11/2005 US Edition
364
6.10 Matrix tray changer
The use of flatpack ICs is becoming an increasingly significant aspect in the production of flat
modules. These components are now almost exclusively provided in waffle trays. The space re-
quired by waffle trays is relatively large in comparison to the component density, however. The low
component capacity also requires the waffle trays to be changed frequently, which means that the
placement sequence has to be interrupted if the trays are changed manually.
The use of a matrix tray changer eliminates this unnecessary time loss since the waffle trays are
stored and automatically changed. Programmable, random access to up to 100 x waffle-pack
trays also considerably increases the range of components that can be made available.
6.10.1 Description
The matrix tray changer can be used to store and change up to 100 waffle trays fully automatically.
The levels (storage locations in the towers) for the waffle trays are numbered consecutively in as-
cending order from bottom to top.
The towers move independently of one another in the vertical direction until the selected maga-
zine is within range of the feed axis. The horizontal feed axis transports the waffle-pack tray from
the tower into the access area of the placement head.
Tower 1 has 30 levels, each of which can hold 2 JEDEC trays or one large tray up to 240 x 340
mm² from the waffle-pack tray carriers.
Tower 2 has a capacity of 40 levels for JEDEC trays.
In place of a component trolley, a matrix tray changer may be docked into locations 2 and 4 on the
X2 machine, but only at location 2 on the X3 machine. The docking unit installed for the compo-
nent trolley can be replaced with the docking device for the matrix tray changer. Or conversely,
the matrix tray changer can be replaced with a component trolley.
The matrix tray changer has an integral chassis, and is therefore easy to move to other locations.
It is supplied with the PCB conveyor height implemented for X2/X3 machines, but can be adapted
for the 830, 900, 930 and 950 mm PCB conveyor heights with just a few simple operations.