YesAX V3.1.2 - Software User Manual.pdf - 第14页

1-2 Introduction 1.1.1 System Block Diag ram for X 2 AXI S ystem XY Stage A lignment Camera A ssembly Top Light A ssembly Side Light Asse mbly Conveyor EBOX 1 I/O Control EBOX 2 Servo Motor Control PC LCD Monitor Key boa…

Introduction 1-1

1 - Introduction

YESTech Automated X-Ray Inspection (AXI) is an effective technology for finding

manufacturing defects in electronic assemblies.

1.1 Automated 2D Inspection System –X2

Nordson YESTECH’s X2 AXI System is a fully automated 2D X-Ray inspection system. It can

couple with an AOI machine to perform dual technology inspection. The X2 AXI System is

equipped with an X-Ray camera as well as a vision camera. The vision camera is mainly used for

generating background map image for the board being inspected. It can also be used to read

barcodes from the boards. Other than that, all inspection functions are performed under X-Ray

camera view and by X-Ray inspection methodologies.

1-2 Introduction

1.1.1 System Block Diagram for X2 AXI System

XY Stage

Alignment

Camera

Assembly

Top Light

Assembly

Side Light Assembly

Conveyor

EBOX 1

I/O Control

EBOX 2

Servo Motor

Control

LCD

Monitor

Keyboard

Mouse

IEEE 1284

LCB

X-ray

Intensifier

X-ray

Camera

Stage

X-ray Tube

X-ray Power

Supply

Left Shutter

Right Shutter

RS232

USB2

Introduction 1-3

1.2 Automated 3D Inspection System –X3

Nordson YESTECH’s X3 AXI System is a fully automated 3D X-Ray inspection system. The

X3 system is like an X2 - 2D machine but with extra 3D inspection capabilities. In other words,

the X3 can not only do a full 2D inspection of a PCB as X2 does, it can also do a 3D inspection

of the PCB. During inspection the 2D and 3D inspections are optimally combined together to

achieve both speed and capability requirement.

In practice the X3 “ looks” at the solder joint from 8 (or more) different angles and then, by

combining the captured image set using digital tomosynthesis reconstruction algorithms, creates

slices parallel to the board surface. These slices can separate the top side from the bottom side so

that each side of the double sided board can be independently analyzed.

2D X-ray Image

3D Top Slice 3D Bottom Slice

The height offset of the board’s top surface can be measured by using a laser device and this

information is used to compensate for board warp. It is possible to setup the parameters and the

position where the laser measurements will have to be made and the range over which the

measurement will be effective.