YesAX V3.1.2 - Software User Manual.pdf - 第287页

Specifications 29 -3 29.4 Laser Height Senso r Specifications Table 29 -3 provides laser height sensor spe cifications f or the system s. Table 29 -3 He ight Sensor Speci fications Laser Height Sensor Laser Height Sensor…

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29-2 Specifications
29.3 System Specifications
Table 29-2 provides general specifications for the systems.
Table 29-2 System Specifications
Specifications
Throughput
Up to 4 sq. in./sec. > 500,000 components per hour
Max. Board Size
23” x 18” (580mm x 460mm)
Clearance
2” (50mm) top and bottom
Min. Component Size
0201; 01005 with high magnification option
False Calls
<500 PPM (<0.05% typical)
Defects Detected
Part: position, missing, wrong, polarity, skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Material Handling
SMEMA, dual direction auto width conveyor, pass / fail signals, board
clamping
Lighting
Proprietary Fusion Lighting multi-angle LED
Imager
1 mega pixel color camera, 1 mega pixel X-ray camera
25, 12 or 6 micron pixel size
Noise
<70dBA, 76 db peak @ 1 M
Ambient Air Temp
41°F to 122°F (5°C to 50°C)
Max Relative Humidity
< 90% non-condensing
Altitude
5280 feet (1609 meters)
CE Certification
Yes (see
SECSII \ GEM Interface
Option
Specifications 29-3
29.4 Laser Height Sensor Specifications
Table 29-3 provides laser height sensor specifications for the systems.
Table 29-3 Height Sensor Specifications
Laser Height Sensor
Laser Height Sensor
for Transparent, Reflective Surfaces
Probe Activation Force
NA
NA
Probe Tip Diameter
NA
NA
Probe Retract
NA
NA
Laser Classification
Class 2
Class 2
Light Source
Semiconductor Laser <1 mW,
670 nm (red)
Semiconductor Laser 1 mW,
670 nm (red)
Spot Diameter
700 µm at reference distance of 55 mm
7 µm at reference distance of 30 mm
Reference Distance
and Range
55 mm ± 10 mm
(2.2 in. ± 0.4 in.)
30 mm ± 1 mm
(1.2 in. ± 0.04 in.)
Ambient Light
4,000 lux max.
10,000 lux max.
Sampling Rate
1 kHz
1 kHz
Dynamic Resolution
10 µm
10 µm
Repeatability
± 25 µm @ 3s
(See Note 1)
± 25 µm @ 3s
(See Note 3)
Accuracy
1
± 50 µm @ 3s
± 50 µm @ 3s
Sensing Range
20 mm (± 10 mm)
(see Note 2)
20 mm (± 10 mm)
Operation Mode
Range-finding
Plunge
1
Measured on a white ceramic dispense card (card properties: 96% roll compacted Alumina, flatness 0.003-in. per
linear inch, .8 µm Ra value).
2
Measured from the top of the conveyor rail. The sensing range is 10-mm above and 10-mm below the top of the rail.
If a customer’s height-sense location is 10-mm above the conveyor rail, the LHS will not focus (contact the factory;
a special is required).
3
Measured on a reflective surface.
29-4 Specifications
29.5 Recommended Working Area Allowances
Table 29-4 provides an overall view of the minimum service space allowance for the AXI Systems.
Table 29-4 Working Allowances
Specifications
Front
36 inches
Back
36 inches
Left
Inline: N/A
Batch: 36 inches
Right
Inline: N/A
Batch: 36 inches