KE2000R动作说明书.pdf - 第4页
R e v 0 . 0 0 动作说明书 3-7-2 吸附 的真空同 传 传 传 传 ........................................................................................................ 3- 35 3-7-3 识 装 传 的真空同 传 传 传 ............................................…
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目 录
1 气装 部概要电 电 ......................................................................................... 1-1
1-1 气装 部的布局电 电 ................................................................................................... 1-1
2 ＸＹ、Z、θ的明轴说 ............................................................................... 2-1
2-1 Ｙ 的明轴说............................................................................................................. 2-1
2-2 Ｘ 的明轴说............................................................................................................. 2-2
2-3 Z、θ 的明轴说......................................................................................................... 2-3
2-3-1 Z 的分辨率轴 ....................................................................................................................... 2-5
2-3-2 θ轴的分辨率....................................................................................................................... 2-5
3 于各功能关 关 ............................................................................................. 3-1
3-1 原点位作的明复动 说................................................................................................ 3-1
3-1-1 θ 原点 位轴复....................................................................................................................... 3-1
3-1--2 Z轴的原点复位.................................................................................................................... 3-1
3-1-3 XY轴的原点复位 .................................................................................................................... 3-2
3-1-4 后电板的原点复位................................................................................................................. 3-4
3-2 基板 送传 .................................................................................................................. 3-5
3-2-1 中心 达马 ............................................................................................................................... 3-7
3-2-2 ＢＵ机台................................................................................................................................. 3-8
3-2-3 .............................................................................................................. 3-9基板 送同传 传传传传
3-3 吸嘴更 作换动 ........................................................................................................ 3-10
3-3-1 有θ修正传.......................................................................................................................... 3-10
3-3-2 无θ修正传.......................................................................................................................... 3-11
3-3-3 激光 定测 ............................................................................................................................. 3-12
3-4 激光 、ＶＣＳ 元件的安装流程识识 识识 ..................................................................... 3-13
3-4-1 激光 元件的安装流程识识 .................................................................................................... 3-13
3-4-2 VCS 元件的 装流程识识 识 .................................................................................................... 3-14
3-5 Zθ 作轴动 ............................................................................................................... 3-15
3-5-1. Z 的速度分轴 轴 ................................................................................................................ 3-15
3-5-2. Z 的 作行程轴动 ................................................................................................................ 3-16
3-5-3. Z 的速度比，加速度比轴 ...................................................................................................... 3-26
3-5-4. θ 的速度比轴 ....................................................................................................................... 3-30
3-6 芯片跳起检测 ........................................................................................................ 3-32
3-6-1 概要.................................................................................................................................... 3-32
3-6-2 判定方法 ............................................................................................................................. 3-32
3-7 真空同传传传 ........................................................................................................ 3-35
3-7-1 元件 的分轴识 轴 .................................................................................................................. 3-35
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3-7-2 吸附 的真空同传 传传传 ........................................................................................................3-35
3-7-3 识装传的真空同传传传 ........................................................................................................3-37
3-7-4 弃元件 的真空同废 传 传传传 .................................................................................................3-38
3-8 激光 作识识动 ........................................................................................................ 3-39
3-9 激光 异常识识 ........................................................................................................ 3-44
3-10 供料器的驱动 ...................................................................................................... 3-48
3-11 ＶＣＳ 作识识动 ...................................................................................................... 3-52
3-11-1 部元件 像 ， 装 作 曲传识识 识 动 传传 图 ..................................................................................3-53
3-11-2 照明作明动说.....................................................................................................................3-54
3-11-3 各照明装置的最大 流电 电...................................................................................................3-57
3-11-4 元件分 的照明无效轴电......................................................................................................3-58
3-11-5 大型 元件 子的控制视视 识识视 ...........................................................................................3-59
3-11-6 大型 元件高度控制视视 ......................................................................................................3-60
3-11-7 大型 元件和已 装元件的元件高度限制视视 识 ......................................................................3-63
3-11-8 效元件外形尺寸实 .............................................................................................................3-64
3-11-9 分割 控制识识 .....................................................................................................................3-65
3-11-10 分割 的分割 隔识识传 传 ....................................................................................................3-66
3-11-11 分割动动 识识...................................................................................................................3-67
3-11-12 分割 的方式识识传 ...........................................................................................................3-68
3-12 ＢＯＣ标识识识 ..................................................................................................... 3-69
3-12-1 作动 传传............................................................................................................................3-69
3-12-2 序识识识 ............................................................................................................................3-70
3-12-3 指定 的修正方法标标 ..........................................................................................................3-71
3-12-4 OCC（Offset Correction Camera）的 明说 ..............................................................................3-74
3-13 坏标标检测.......................................................................................................... 3-76
3-13-1 坏标标检测 ........................................................................................................................3-76
3-14 共面 定测 ............................................................................................................. 3-77
3-14-1 共面 定方法测 .....................................................................................................................3-77
3-14-2 共面 定 的测 传 XY 作轴动 .....................................................................................................3-78
3-14-3 共面 定可能的元件外形尺寸测 ...........................................................................................3-79
3-14-4 共面分割 定 作测动 .............................................................................................................3-79
3-14-5 定模式的测 测换 .................................................................................................................3-80
3-14-6 共面 定方式的不同测 ..........................................................................................................3-81
3-14-7 共 定方式图测 .....................................................................................................................3-82
4 机器部的 明说 .............................................................................................4-1
4-1 人机部的构成 .......................................................................................................... 4-1
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4-2 人机部的功能 .......................................................................................................... 4-1
5 机器控制部的 明说 ..................................................................................... 5-1
5-1 各基板的功能 .......................................................................................................... 5-2
5-1-1 CPU基板............................................................................................................................... 5-2
5-1-2 ＸＭＰ基板（RMB基板）、SYNQNET 接连 基板 ........................................................................... 5-4
5-1-3 接口 基板桥 ............................................................................................................................ 5-5
5-1-4 ＭＣＭ基板............................................................................................................................. 5-6
5-1-5 SAFETY基板、CARRY基板 ..................................................................................................... 5-7
5-1-6 ＢＡＳＥ−ＦＥＥＤＥＲ基板、温度 感器基板传 .............................................................................. 5-9
5-1-7 Ｉ／Ｏ 控制器基板（４０００１９４３）......................................................................................... 5-12
5-1-8 装 主基板识 贴 ...................................................................................................................... 5-12
5-1-9 操作基板（４０００１９５２） ...................................................................................................... 5-20
5-1-10 ＬＩＧＨＴ ＣＴＲＬ基板............................................................................................................ 5-21
5-1-11 ＩＰ−Ｘ３机板....................................................................................................................... 5-24
5-2 达的控制方式马 ..................................................................................................... 5-25
5-2-1 XY 的控制方式轴 ................................................................................................................. 5-25
5-2-2 Ｚ，θ 的控制方式轴 .............................................................................................................. 5-27
5-2-3 基板 送部的控制方式传 ........................................................................................................ 5-29
6 故障 理处 .................................................................................................... 6-1
6-1 元件 装识 .................................................................................................................. 6-1
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