4OM-1625-004_w.pdf - 第331页

4OM-1603 1012-005 5-B

4OM-1603

1012-005 5-A

Chapter 5

Troubleshooting on Component Picks and Placement

This chapter describes the scope of troubleshooting on component picks

and placement.

 1.ClassicationofFailureSymptomsandHelpfulHintson

Countermeasures against Failure

2. Troubleshooting on Pickup Errors

3. Troubleshooting on Component Placement Errors

4OM-1603

1012-005 5-B

4OM-1603

5-1

1.ClassicationofFailureSymptomsandHelpfulHintsonCountermeasuresagainstFailure:Chap.5

1012-005

1. ClassicationofFailureSymptomsandHelpfulHints

on Countermeasures against Failure

1.1 ClassicationofFailureSymptoms

The machine processes can be classied into Processes A, B, C, D, and E as

shown below.

Reference

Refer to "4. Surface Mounting Mechanism" in "Chapter 1 (Vol. 1: Guide)" for

the outline of actions.

Process A : The placement head moves to the feeder base and picks up a

component.

Process B : The head moves to the area where the component recognition

camera is installed and a component recognition process is

taken there.

Process C : The placement angle is corrected while the head is moving to

the PCB positioning section.

Process D : The component is placed on the PCB.

Process E : The component-placed PCB is discharged.

Feeder Base Section

Component Recognition Camera

PCB Positioning Section

Process A

Process B

Process C

Process D

Process E

F4E1

Based on these processes, failures can be divided roughly into the following two

types.

Failure before Component Placement : This type of failure occurs mainly in

Processes A, B, and C.

Failure after Component Placement : This type of failure occurs mainly at

Processes D and E.