1OM-1626-001_w.pdf - 第188页

1OM-1610 5-7 1. Specications : Chap.5 091 1-001 Item Description 12. Applicable Components High-Speed Head Multi-Functional Head (1) Applicable Components Size : 0.4 × 0.2 to 44 × 44 mm Thickness : Max. 12.7 mm Lead Pit…

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1OM-1610
5-6
1. Specications : Chap.5
0911-001
Item Description
11. Component
Placeable Range
Unit : mm
Notes :
(a) The above gure shows that the vacuum nozzles are not
protruding from the outer shapes of components.
(b) Comp
onents cannot be placed in the shadowed area.
Components cannot be placed in the range (0.5 mm) around the
opening such as a hole.
(c)
This size is the max. possible placement height including the
placed component height from the PCB.
T1E1-6
1OM-1610
5-7
1. Specications : Chap.5
0911-001
Item Description
12. Applicable
Components
High-Speed Head Multi-Functional Head
(1) Applicable Components
Size : 0.4
×
0.2 to 44
×
44 mm
Thickness
: Max. 12.7 mm
Lead Pitch : 0.3 mm pitch or
more
Lead Width : Min. 0.1 mm
Lead Length
: Min. 0.20 mm
Note :
Some components
cannot be used due to the
mechanical characteristics,
shapes, etc.
(1) Applicable Components
Size : 1.0
×
0.5 to 55
×
55 mm
Thickness
: Max. 25.4 mm
Lead Pitch : 0.3 mm pitch or
more
Connector : Max. 100
×
26 mm
Note :
Some components
cannot be used due to the
mechanical characteristics,
shapes, etc.
Applicable Components for Reference
•
Cylindrical Components
Resistors, Capacitors, Diodes, and Other similar-shaped components
•
Square Components
Resistors, Film Capacitors, Coils, Chip Ceramic Filters, and Other
similar-shaped components
•
Deform Components
Semi-Fixed V
ariable Resistors, Trimmer Capacitors, and Other similar-
shaped components
•
ICs
Mini-Flat ICs, Plastic Chip Carrier with Leads, and Other similar-shaped
components
•
Leaded Components
Mini-Mold T
ransistors, Mini-Power Transistors, Filters, LEDs, Diodes,
Coils, Tantalum Capacitors, Aluminum Electrolytic Capacitors, and Other
similar-shaped components
•
Connectors
Connectors for FFC / FPC, PCB-to-PCB Connectors, Wire-to-PCB
Connectors, PLCC Sockets, and Other Similar
-Shaped Components
•
BGA/CSP Components (Option)
BGA, CSP, LGA, and Other Similar
-Shaped Components
Size
: Max. 44
×
44 mm
Ball Diameter
: Min.
φ
0.13 mm
Ball Pitch
: 0.25 mm pitch or more
T1E1-7
1OM-1610
5-8
1. Specications : Chap.5
0911-001
Item Description
(2) Packaged Posture Standards
Taped Components
JIS or its equivalent
•
Paper Tapes (Width : 8 mm)
•
Embossed Tapes (Width : 8 to 72 mm)
•
Reel Outer Diameter :
φ
382 mm or less
Note :
Some taping sizes are limited.
Some taped components cannot be used due to the mechanical
characteristics.
Stick Components
•
Carrier Stick :
Width 8 to 60 mm × Thickness 3 to 16 mm × Length 400 to 600 mm
T
ray Components
•
Tray : 100
×
100 to 323
×
136 mm
(In the case of using the JEDEC multi-layer tray feeder)
T1E1-8