1OM-1626-001_w.pdf - 第189页
1OM-1610 5-8 1. Specications : Chap.5 091 1-001 Item Description (2) Packaged Posture Standards T aped Components JIS or its equivalent • Paper T apes (W idth : 8 mm) • Embossed T apes (W idth : 8 to 72 mm) • Reel Outer…
1OM-1610
5-7
1. Specications : Chap.5
0911-001
Item Description
12. Applicable
Components
High-Speed Head Multi-Functional Head
(1) Applicable Components
Size : 0.4
×
0.2 to 44
×
44 mm
Thickness
: Max. 12.7 mm
Lead Pitch : 0.3 mm pitch or
more
Lead Width : Min. 0.1 mm
Lead Length
: Min. 0.20 mm
Note :
Some components
cannot be used due to the
mechanical characteristics,
shapes, etc.
(1) Applicable Components
Size : 1.0
×
0.5 to 55
×
55 mm
Thickness
: Max. 25.4 mm
Lead Pitch : 0.3 mm pitch or
more
Connector : Max. 100
×
26 mm
Note :
Some components
cannot be used due to the
mechanical characteristics,
shapes, etc.
Applicable Components for Reference
•
Cylindrical Components
Resistors, Capacitors, Diodes, and Other similar-shaped components
•
Square Components
Resistors, Film Capacitors, Coils, Chip Ceramic Filters, and Other
similar-shaped components
•
Deform Components
Semi-Fixed V
ariable Resistors, Trimmer Capacitors, and Other similar-
shaped components
•
ICs
Mini-Flat ICs, Plastic Chip Carrier with Leads, and Other similar-shaped
components
•
Leaded Components
Mini-Mold T
ransistors, Mini-Power Transistors, Filters, LEDs, Diodes,
Coils, Tantalum Capacitors, Aluminum Electrolytic Capacitors, and Other
similar-shaped components
•
Connectors
Connectors for FFC / FPC, PCB-to-PCB Connectors, Wire-to-PCB
Connectors, PLCC Sockets, and Other Similar
-Shaped Components
•
BGA/CSP Components (Option)
BGA, CSP, LGA, and Other Similar
-Shaped Components
Size
: Max. 44
×
44 mm
Ball Diameter
: Min.
φ
0.13 mm
Ball Pitch
: 0.25 mm pitch or more
T1E1-7
1OM-1610
5-8
1. Specications : Chap.5
0911-001
Item Description
(2) Packaged Posture Standards
Taped Components
JIS or its equivalent
•
Paper Tapes (Width : 8 mm)
•
Embossed Tapes (Width : 8 to 72 mm)
•
Reel Outer Diameter :
φ
382 mm or less
Note :
Some taping sizes are limited.
Some taped components cannot be used due to the mechanical
characteristics.
Stick Components
•
Carrier Stick :
Width 8 to 60 mm × Thickness 3 to 16 mm × Length 400 to 600 mm
T
ray Components
•
Tray : 100
×
100 to 323
×
136 mm
(In the case of using the JEDEC multi-layer tray feeder)
T1E1-8
1OM-1610
5-9
1. Specications : Chap.5
0911-001
Item Description
13. Placement Heads
High-Speed Head Multi-Functional Head
Equipped with 2 heads / 2 beams
Vacuum Nozzle: Max. 15 nozzles on
each head
Ref.
:
Maximum Number of
Component Picks:
Component Size
4 × 3 mm or less 15
to
7 × 7 mm or less 7
to
8 × 8 mm or less 5
to
10 × 10 mm or less 4
to 12 × 12 mm or less 3
to 20 × 20 mm or less 2
to
44 × 44 mm or less 1
Note
:
There are two types of
nozzles-one for high-speed
component placement and
the other for middle-size odd-
shaped component placement.
Although the nozzles for high-
speed and middle-size odd-
shaped components can be
used together, the nozzles
for middle-size odd-shaped
components must be attached,
leaving one out of every three
pitches empty due to the
location of the diffusion plates.
Nozzle for High-Speed
Component Placement :
The diameter is
φ
6 mm
or less. This nozzle
is used for 0402
components. Applicable
size of components :
0402 to 20
×
20 mm.
Nozzle for Middle-Size Odd-
Shaped Component Placement :
The diameter is
φ
12 mm
or less. The nozzle tip
is processed according
to the applicable
components.
The nozzle can be used
for the component size of
up to 44
×
44 mm.
Equipped with 2 heads / 2 beams
Vacuum Nozzle: Max. 3 nozzles on
each head
Ref.
:
Maximum Number of
Component Picks:
Component Size
26.2
× 26.2 mm or less 3
to 55 × 55
mm or less 2
Note
:
For components not within the
above ranges, the number of
components to be picked up
should be "1".
(In the case of connector 100
×
26 mm, etc.)