1OM-1626-001_w.pdf - 第58页
1OM-1610 1. What is the direct drive modular mounter? : Chap.1 1-1 091 1-001 1. What is the direct drive modular mounter? This machine is provided with a batch recognition system by which various kinds of electronic comp…
1OM-1610
0911-001 1-B
1OM-1610
1. What is the direct drive modular mounter? : Chap.1
1-10911-001
1. What is the direct drive modular mounter?
This machine is provided with a batch recognition system by which various
kinds of electronic components (simply called "Components" hereinafter) can be
recognized in batch (nonstop y batch recognition) and realizes
highly accurate component placement on the PCBs at high speed. The machine
is also equipped with two beams, two heads, and two component recognition
cameras, making it possible to handle many different kinds of components in
small lots or few different kinds of component in large lots for diversied scales
of production.
This machine introduces our latest technologies such as direct drive heads, X/
Y-axis linear motor driving, etc., (the performance proven by our direct drive
turret mounters) that have been used in the past actual production and is provided
with various functions for reduction of OOS (out of service) time. That is the
reason why this mounter is called "Direct Drive Modular Mounter with High
Total Productivity for Next Generation".
1.1 Location of Each Unit
Cart Installation Section
Placement Head Section,
PEC Recognition Section
Placement Head Section,
PEC Recognition Section
XY Beam Section
XY Beam Section
Nozzle Stocker Section
Nozzle Stocker Section
PCB Transfer Section
PCB Transfer Section
Component Recognition Unit
F1A1
1OM-1610
1-2
1. What is the direct drive modular mounter? : Chap.1
0911-001
1.2 Main Features
Beam Section
•
XY-Axis Linear Motor Driving
The X/Y axis driven by linear motors and scales realized highly accurate
component placement at high speed, reducing vibration and noise.
The Y-axis twin driving made it possible to achieve highly accurate
positioning at high speed.
•
2-Beam and 2-Head Structure
The machine has two stages and each stage is provided with front and rear
beams (2 heads and 2 beams in total).
The front and rear beams take component placement and pickup actions in
turn repeatedly, for efcient and continuous component placement.
Head Section
•
Multiheads
Each head is provided with line sensors which can measure component
height. The results of the measurement are fed back, realizing the best
amount of pushing distances for high quality component mounting.
Each head holds twelve nozzles that pick up components in succession,
reducing the shuttling frequency of the beams for realization of high
throughput.
A simulation is made to determine the number of components to be placed
at a time, enabling the best selection in the number of nozzles for the
multiheads.
•
Component Thickness Measurement
The picked component thickness is measured using a line sensor and the
acquired data is fed back to the height for component placement.
The vacuum nozzle detection function enables detection of an overcarried
component, realizes highly accurate detection, and ensures high quality
placement.
•
Soft Mounting Nozzle
This nozzle can be used for soft component placement because it reduces
impacts caused due to upward wapage of PCBs which affects minute
components of 1005 size or less.
Minute component placement without two-step speed reduction becomes
possible for improved productivity.