IPC-7095C-2013.pdf - 第161页
9.4.15 Missing Solder 9.4.16 Nonwet Open (NWO) Solder Joint 9.4.17 Head-on-Pillow (HoP) Solder Joint Possible Cause The condition is a result of package missing solder paste deposit on the PCB land(s). The presence of th…
9.4.11 Insufficient Solder and Flux for Proper Joint
Formation
9.4.12 Reduced Termination Contact Area
9.4.13 Solder Bridging
9.4.14 Incomplete Solder Reflow
Possible Cause
The solder ball suspended in air is due to the lack of solder and
flux. This condition is due to a solder skip during the stencil
printing process. In evaluating the solder ball interface at the left
it appears that the two materials did not reach a fully liquidus
condition.
Potential Solution
Check stencil and solder deposition as well as flux contained
within solder paste.
Possible Cause
The condition may be due to package warping upward in the
area shown. The three center connections have extended into
a column while the adjacent contacts remain somewhat spheri-
cal.
Potential Solution
Movement during BGA ball solidification as well as overheating
within the reflow process.
Possible Cause
Solder bridging between contacts is likely due to the transfer of
solder paste residue during the solder printing process or
because the stencil did not seat securely to the board surface
during the process.
Potential Solution
Check stencil opening and avoid excess solder paste deposi-
tions.
Possible Cause
The solder ball on the substrate and the solder paste on the
board did not reach a fully liquidus condition during the reflow
soldering process.
Potential Solution
Determine reflow profile in order to validate solder paste used
in attachment.
IPC-7095C January 2013
146
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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9.4.15 Missing Solder
9.4.16 Nonwet Open (NWO) Solder Joint
9.4.17 Head-on-Pillow (HoP) Solder Joint
Possible Cause
The condition is a result of package missing solder paste
deposit on the PCB land(s). The presence of the solder paste
deposit is necessary to form the BGA solder joint. This solder
paste deposit would melt during reflow soldering and coalesce
with the molten BGA solder to form the solder joint.
Potential Solution
Check stencil aperture for clogging with solder paste. Also.
ensure that the stencil is designed correctly with each aperture
opening for each SMT land on the PCB.
Possible Cause
Clogged stencil aperture, interaction between BGA warpage
and solder paste type.
Potential Solution
– Monitor paste volume using automated inspection system.
– Selection of right solder paste material/formulation to over-
come defect.
– Overprinting solder paste in risk area (BGA package corners).
– Minimizing board warpage (e.g., use of pallets).
Possible Cause
Interaction between BGA and PCB warpage, Reduced Tal at
Reflow.
Potential Solution
– Overprint solder paste in risk area (BGA package corners).
– Minimize Delta Temp within component and Increased Peak
Temperature and Time Above Liquidus (TAL) in reflow.
– Reflow in nitrogen (N
2
) ambient.
– Selection of right solder paste material/formulations to over-
come defect.
– Minimizing board warpage (e.g., use of a pallet).
January 2013 IPC-7095C
147
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---
10 GLOSSARY AND ACRONYMS
AABUS As Agreed Upon Between User and
Supplier
ASIC Applications Specific IC
ASM Array Surface Mount
ASMP Application Specific Module Packaging
AXI Automatic X-Ray Inspection
BGA Ball Grid Array
BOC Board-On-Chip
BT Bismaleimide-Triazine
CAGE Commercial and Government Entity
CBGA Ceramic Ball Grid Array
CCGA Ceramic Column Grid Array
CGA Column Grid Array
COB Chip-On-Board
CPU Central Processing Unit
CSP Chip Scale Packages
CTE Coefficient of Thermal Expansion
CTF Critical To Function
DBDPE Decabromodiphenyl Ether
DDR-
SDRAM
Double-Data-Rate Synchronous Dynamic
Random Access Memory
Df Dissipation Factor
DfM Design for Manufacturability
DfR Design for Reliability
DIG Direct Immersion Gold
Dk Dielectric Constant
DMA Dynamic Mechanical Analysis
DSBGA Die-Size Ball Grid Array
DSC Differential Scanning Calorimetry
DSP Die Size Package
dT Temperature Differential
ECM Electrochemical Migration Test
ENEPIG Electroless Nickel/Electroless Palladium/
Immersion Gold
ENIG Electroless Nickel Immersion Gold
ESD Electrostatic Discharge/Electrostatic Device
ESS Environmental Stress Screening
EU European Union
FAT Flux Activation Time
FBGA Fine Pitch Ball Grid Array
FC Flip Chip
FPT Fine Pitch Technology
FRBGA Fine-Pitch, Rectangular Ball Grid Array
FT Functional Test
GAC Grid Array Component
HASL Hot Air Solder Level
HAST Highly Accelerated Stress Testing
HCI Hydrochloric
HDB High Density Printed Boards
HF Hydrofluoric
HoP Head-on-Pillow
I/O Input/Output
ICT In-Circuit Test
ILC Independent Loading Mechanism
IMC Intermetallic Compound
IR Infrared
LCP Liquid Crystal Polymer
LFBGA Low-Profile Fine-Pitch Ball Grid Array
LMC Least Material Condition
LTD Liquidus Time Delay
MCM Multichip Module
MCM-L Multichip Module-Laminate
MCP Multichip Package
MD Metal Defined
MDA Manufacturing Defect Analyzer
MDS Multi Device Subassembly
MLC Multilayer Ceramic
MMB Moisture Membrane Bag
MMC Maximum Material Condition
NAND Not ‘‘And’’
NSMD Nonsolder Mask Defined
OEM Original Equipment Manufacturer
OSP Organic Solderability Preservative
PBB Polybrominated Biphenyl
PBBO Polybrominated Biphenyl Oxide
PBDE Polybrominated Diphenyl Ether
PBGA Plastic Ball Grid Array
PCA Printed Circuit Assembly
PCB Printed Circuit Board
PCM Phase Change Materials
PCMCIA Personal Computer Memory Card
International Association
PGA Pin Grid Array
PLCC Plastic Leaded Chip Carrier
PSA Pressure Sensitive Adhesives
PTH Plated Through-Hole
QFP Quad Flat Pack
RDS Rectangular Die Size
RF Radio Frequency
IPC-7095C January 2013
148
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---