IPC-7095C-2013.pdf - 第17页

mounting substrate. W ith the exception of no-clean ﬂuxes, cleaning problems arise with ﬁne-pitch devices that sit almost ﬂush (less than 250 µm) to the board. For proper cleaning, a 0.4 mm to 0.5 mm standof f is recomme…

IPC-7526 Stencil and Misprinted Board Cleaning Hand-

book

IPC-7711/7721 Rework, Modiﬁcation and Repair of Elec-

tronic Assemblies

IPC-9701 Performance Test Methods and Qualiﬁcation

Requirements for Surface Mount Solder Attachments

IPC/JEDEC-9704 Printed Wiring Board Strain Gage Test

Guideline

IPC-9708 Test Methods for Characterization of Printed

Board Assembly Pad Cratering

2.2 JEDEC

JEP95 Section 4.5 Fine Pitch (Square) Ball Grid Array

Package (FBGA)

JEP95 Section 4.6 Fine Pitch (Rectangular) Ball Grid

Array Package (FRBGA)

JEP95 Section 4.7 Die-Size Ball Grid Array Package

(DSBGA)

JEP95 Section 4.9 Generic Matrix Tray for Handling and

Shipping (Low Stacking Proﬁle for BGA Packages)

JEP95 Section 4.10 Generic Matrix Tray for Handling

and Shipping

JEP95 Section 4.14 Ball Grid Array Package (BGA)

JEP95 Section 4.17 Ball Grid Array (BGA) Package

Measurement and Methodology

JEP95 Section 4.22 Fine Pitch Square Ball Grid Array

Package (FBGA) Package on Package (PoP)

JESD22-A102 Unbiased Autoclave Test Method

JESD22-A103 High Temperature Storage Test Method

JESD22-A104 Thermal Shock Test Method

JESD22-A118 Accelerated Moisture Resistance-Unbiased

HAST

JESD22-B103 Board-Level Vibration Test Method

JESD22-B110 Subassembly Mechanical Shock Test

Method

JESD22-B111 Board-Level Drop Test Method

JESD217 Test Methods to Characterize Voiding in Pre

SMT Ball Grid Array Packages

3 SELECTION CRITERIA AND MANAGING BGA

IMPLEMENTATION

Every electronic system consists of various parts: inter-

faces, electronic storage media, and the printed board

assembly. Typically, the complexity of these systems is

reﬂected in both the type of components used and their

interconnecting structure. The more complex the compo-

nents, as judged by the physical size and the number of

input/output terminals they possess, the more complex is

the interconnecting substrate. Cost and performance drivers

have resulted in increased component density and a greater

number of components attached to a single assembly, while

the available mounting area has shrunk. In addition, the

number of functions per device has increased and this is

accommodated by using increased I/O count and reduced

contact pitch. Reduced contact pitch represents challenges

for both assemblers and bare board manufacturers. Assem-

blers encounter handling, coplanarity and alignment

problems.

Component packaging in general and microprocessor and

memory packages in particular, drive the rest of the elec-

tronic assembly packaging issues. The driving forces for

component packaging are thermal and electrical perfor-

mance, reliability, real estate constraints and cost. Periph-

eral devices with 1.00 mm pitch have become common-

place in the industry. However, this package cannot

accommodate higher than 84 pins. Larger peripheral pin

count devices require lead pitches of 0.65 mm, 0.5 mm or

0.3 mm.

Although pitches below 1.00 mm are useful for reducing

package size, the increased density presents many prob-

lems for most manufacturers. At these ﬁne-pitches, leads

are very fragile and susceptible to damage such as lead

coplanarity, lead bending and sweep. To place these pack-

ages, a pick-and-place machine with vision system and

waffle pack handlers are necessary. These two features,

however, can add substantial capital equipment costs. Fig-

ure 3-1 shows an example of the package manufacturing

process. Ball grid arrays were developed to overcome the

assembly challenges presented by these ﬁne-pitch, high

lead-count peripheral devices.

Since BGAs use solder bump interconnections instead of

leads, problems associated with lead damage and coplanar-

ity are eliminated. BGA pitches from 1.00 mm to 1.5 mm,

have well over 250 µm of standoff height, so problems with

paste printing, placement, reﬂow and cleaning are signiﬁ-

cantly reduced. BGAs also provide much shorter signal

paths compared to ﬁne-pitch devices. Shorter signal paths

can be very critical in high-speed applications. The termi-

nation types also play a role in the spacing between I/Os.

Design guidelines should indicate that it is important to

allow added spacing between the ﬁne-pitch devices and the

2. www.jedec.org

IPC-7095C January 2013

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Not for Resale

No reproduction or networking permitted without license from IHS

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mounting substrate. With the exception of no-clean ﬂuxes,

cleaning problems arise with ﬁne-pitch devices that sit

almost ﬂush (less than 250 µm) to the board. For proper

cleaning, a 0.4 mm to 0.5 mm standoff is recommended,

with the need to meet this requirement based on the size of

the BGA package, since smaller proﬁles allow easier pen-

etration of the cleaning solutions. Using a temporary solder

mask over the vias under a package avoids ﬂux entrapment

problems. However, this extra process step increases pro-

duction cost.

3.1 Description of Infrastructure The use of BGAs in

the design through assembly processes has become com-

mon in the last few years. Nevertheless, incorporating these

parts into electronic assemblies requires dedicated engi-

neering resources to develop, implement and integrate the

processes into the assembly operation. Even though BGAs

can leverage existing SMT infrastructure, there are techni-

cal considerations that must be addressed in order to be

successful in implementing BGA components into existing

product conﬁgurations.

3.1.1 Land Patterns and Circuit Board Considerations

Land patterns are copper areas on the surface of the printed

board which provide the mechanical attachment for the

component and the electrical connection for its leads or

terminations. Land patterns are important to manufacturing

because the dimensions of the land affect the consistency

and reliability of the resulting solder joint, and may also

affect cleaning and testability. Land pattern design for grid

array components is even more critical because of the

increased difficulty in solder joint inspection and repair/

rework. Land pattern design issues for BGA need to be

understood. This is essential to assure proper solder joint

formation and prevent defects such as bridging, opens and

to achieve optimal reliability. Land pattern development

was difficult in the past because of the lack of standardiza-

tion in physical sizes of components, and also in the toler-

ances that were considered acceptable. There has been a lot

of effort to standardize recently, and rules for developing a

three-tiered approach to different land pattern design can be

found in IPC-7351 Generic Requirements for Surface

Mount Design and Land Pattern Standard.

BGA lands can be solder mask deﬁned (SMD) where the

solder mask overlaps the land, or metal deﬁned (MD)

where the solder mask stays away from the land. There are

pros and cons of each approach and the choice often

depends on the pitch of the BGA (impacting land size), or

the size of the BGA (impacting part mass). These condi-

tions help deﬁne thermal stress reliability where the MD

solder mask avoids the possibility of a stress crack in the

collapsed ball or mechanical shock reliability where the

SMD solder mask helps to secure the land to the laminate.

Both the board manufacturer and the assembler must deal

with land size issues, compatible surface ﬁnishes, solder

mask registration and electrical testing. But the assembler

has additional challenges related to the selection of appro-

priate solder alloys and paste properties, and the develop-

ment of temperature proﬁles and consistent processes for a

wide variety of board types and component styles.

Although the electronics industry continually reports the

development of new component packages with higher and

higher pin counts, the components with the highest usage

have pin counts in the 16 to 64 I/O range. Over 50% of all

Die Attach

Known

Good

Die

Start

Wire Bond Mold Package

Chip Attach

using Flip Chip Process

Underfill Die

Print Flux

or Paste

on BGA

Substrate Lands

Place Balls

on BGA

Substrate Lands

Perform

Electrical

Test

Inspect Pack Ship

Ball Attach

Reflow Balls on

BGA Substrate Lands

IPC-7095c-3-1

Figure 3-1 BGA Package Manufacturing Process

January 2013 IPC-7095C

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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components fall into this category, while only 5% of all

components used have over 208 I/Os, the cross-over point

between peripheral leaded component style packages and

array type formats. Many peripherally leaded, lower I/O

count devices, such as memory and logic devices, have

been converted to area array packaging formats as either

BGAs or ﬁne pitch BGAs or some similar version of a bot-

tom only termination (see IPC-7093).

Although the percentage of high I/O components used on

an electronic assembly is small, they play a big part in

driving the industry infrastructure for both bare board and

assembly manufacturing. These high I/O components

determine the process for bare board imaging, etching, test-

ing and surface ﬁnishing. They determine the materials

used for fabrication and drive assembly process improve-

ments in a similar manner. In addition to land design, one

should also keep in mind that the inner rows of BGA pins

require additional layers for interconnection. Increasing the

number of pins (vias) drives layer count due to the reduc-

tion of routing channels. Higher layer count means higher

cost of the bare board. The electronics industry has evolved

from using through-hole assembly technology in which the

component leads went into the printed board substrate and

were either soldered to the bottom side of the board or into

a plated-through hole. Surface Mount Technology (SMT)

has advanced to a stage where the majority of electronic

components manufactured today are only available in SMT

form.

Manufacturing products with SMT in any signiﬁcant vol-

ume requires automation. For low volume, a manually

operated machine or a single placement machine may be

sufficient. High volume SMT manufacturing requires spe-

cial solder paste deposition systems, multiple and various

placement machines, in-line solder reﬂow systems and

cleaning systems.

The heart of surface mount manufacturing is the machine

that places the components onto the printed board land

areas prior to soldering. Unlike through-hole (TH) insertion

machines, surface mount placement machines are usually

capable of placing many different component types. As

design densities have increased, new SMT package styles

have evolved. Examples are ﬁne pitch technology (FPT),

ultra ﬁne pitch technology (UFPT), and array surface

mount (ASM). This latter category consists of the many

families of ball or column grid arrays, chip scale packages

(CSP), ﬁne pitch BGAs (FBGA), and ﬂip chip (FC) appli-

cations. These parts are all capable of being placed by

machines provided that the equipment has the required

positioning accuracy.

Increased device complexity has been a primary driving

factor for SMT. In order to minimize the component

package size, component lead spacing has decreased (e.g.,

1.27 mm to 0.65 mm). Further increases in semiconductor

integration requiring more than 196 I/Os can drive pack-

ages to even closer perimeter lead spacing, such as 0.5, 0.4,

0.3, and 0.25 mm. However, the array package format has

become the favorite for high I/O count devices. Area array

component package styles have a pitch that originally was

much larger than the equivalent peripherally leaded device;

however, that lead format is now also seeing reductions in

pitch conﬁgurations.

Ball and column grid arrays were standardized in 1992

with 1.5, 1.27 and 1.0 mm pitch. Fine pitch BGA array

package standards have established pitches of 1.0, 0.8,

0.75, 0.65, and 0.5 mm. There are some implementations

of FBGAs where the pitch has been reduced to 0.4 mm,

and future components are being evaluated with 0.3 and

0.25 mm pitch conﬁgurations. Although standard conﬁgu-

rations for BGAs and their associated land patterns exist, as

described in IPC-7351, some component manufacturers

have modiﬁed the standard conﬁgurations in order to

improve the interconnection capability in the component

substrate. The tailoring of the standard geometries makes it

important to check the manufacturer’s data sheet to deter-

mine the exact characteristics of the pitch, ball size and

depopulation (removed balls).

There is a question as to how many lead pitches are

required between 1.0 mm and 0.5 mm. Some indicate that

a 60% rule is of value where the ball diameter is 60% of

the pitch. This results in a 0.5 mm ball diameter for a

0.8 mm pitch. FBGAs would use a 0.4 mm ball diameter

for a 0.65 mm pitch. On the other hand, some feel that it

would be better to standardize a 0.3 mm diameter ball for

all FBGA packages. Standardization of a single ball size

would simplify land pattern development, allow more uni-

form routing channels on the interconnecting substrate, and

help standardize socket pin contact design interconnection

of the part I/Os. All of these conditions are affected both by

ball pitch and ball diameter. Using a standardized pitch and

ball diameter combined with the ability to remove termina-

tions that are not needed would make designs more coher-

ent, as shown on the right side of Figure 3-2. The trend

illustrated on the left side of Figure 3-2 forces the creation

of many different test sockets. Interconnection of the part

I/Os is affected both by ball pitch and ball diameter. The

standard ball diameter as speciﬁed by the JEDEC JC11

Committee alleviates pressure on the substrate design.

Array packages permit a variety of ball conﬁgurations i.e.,

staggered positions or partially populated parts, to provide

the room required for adequate conductor routing. With a

common base array pitch, signiﬁcant advantages can be

gained in terms of providing a coherent standard for all of

the elements of the electronic manufacturing infrastructure

for components, sockets, substrates and test systems (see

Figure 3-3). The component selection process for an elec-

tronic assembly should minimize the variation in package

types and pin pitches. Problems with the assembly of large

I/O count and ﬁne-pitch peripheral packages has caused

IPC-7095C January 2013

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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