IPC-7095C-2013.pdf - 第163页

RFID Radio Frequency Identiﬁcation RMS Root Mean, Square RoHS Restriction of Hazardous Substances RSS Ramp-Soak-Spike R TS Ramp-to-Spike SAC Sn/Ag/Cu SDRAM Synchronous Dynamic Random Access Memory SGA Solder Grid Array S…

10 GLOSSARY AND ACRONYMS

AABUS As Agreed Upon Between User and

Supplier

ASIC Applications Speciﬁc IC

ASM Array Surface Mount

ASMP Application Speciﬁc Module Packaging

AXI Automatic X-Ray Inspection

BGA Ball Grid Array

BOC Board-On-Chip

BT Bismaleimide-Triazine

CAGE Commercial and Government Entity

CBGA Ceramic Ball Grid Array

CCGA Ceramic Column Grid Array

CGA Column Grid Array

COB Chip-On-Board

CPU Central Processing Unit

CSP Chip Scale Packages

CTE Coefficient of Thermal Expansion

CTF Critical To Function

DBDPE Decabromodiphenyl Ether

DDR-

SDRAM

Double-Data-Rate Synchronous Dynamic

Random Access Memory

Df Dissipation Factor

DfM Design for Manufacturability

DfR Design for Reliability

DIG Direct Immersion Gold

Dk Dielectric Constant

DMA Dynamic Mechanical Analysis

DSBGA Die-Size Ball Grid Array

DSC Differential Scanning Calorimetry

DSP Die Size Package

dT Temperature Differential

ECM Electrochemical Migration Test

ENEPIG Electroless Nickel/Electroless Palladium/

Immersion Gold

ENIG Electroless Nickel Immersion Gold

ESD Electrostatic Discharge/Electrostatic Device

ESS Environmental Stress Screening

EU European Union

FAT Flux Activation Time

FBGA Fine Pitch Ball Grid Array

FC Flip Chip

FPT Fine Pitch Technology

FRBGA Fine-Pitch, Rectangular Ball Grid Array

FT Functional Test

GAC Grid Array Component

HASL Hot Air Solder Level

HAST Highly Accelerated Stress Testing

HCI Hydrochloric

HDB High Density Printed Boards

HF Hydroﬂuoric

HoP Head-on-Pillow

I/O Input/Output

ICT In-Circuit Test

ILC Independent Loading Mechanism

IMC Intermetallic Compound

IR Infrared

LCP Liquid Crystal Polymer

LFBGA Low-Proﬁle Fine-Pitch Ball Grid Array

LMC Least Material Condition

LTD Liquidus Time Delay

MCM Multichip Module

MCM-L Multichip Module-Laminate

MCP Multichip Package

MD Metal Deﬁned

MDA Manufacturing Defect Analyzer

MDS Multi Device Subassembly

MLC Multilayer Ceramic

MMB Moisture Membrane Bag

MMC Maximum Material Condition

NAND Not ‘‘And’’

NSMD Nonsolder Mask Deﬁned

OEM Original Equipment Manufacturer

OSP Organic Solderability Preservative

PBB Polybrominated Biphenyl

PBBO Polybrominated Biphenyl Oxide

PBDE Polybrominated Diphenyl Ether

PBGA Plastic Ball Grid Array

PCA Printed Circuit Assembly

PCB Printed Circuit Board

PCM Phase Change Materials

PCMCIA Personal Computer Memory Card

International Association

PGA Pin Grid Array

PLCC Plastic Leaded Chip Carrier

PSA Pressure Sensitive Adhesives

PTH Plated Through-Hole

QFP Quad Flat Pack

RDS Rectangular Die Size

RF Radio Frequency

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RFID Radio Frequency Identiﬁcation

RMS Root Mean, Square

RoHS Restriction of Hazardous Substances

RSS Ramp-Soak-Spike

RTS Ramp-to-Spike

SAC Sn/Ag/Cu

SDRAM Synchronous Dynamic Random Access

Memory

SGA Solder Grid Array

SIR Surface Insulation Resistance

SMD Solder Mask Deﬁned

SMOBC Solder Mask Over Bare Copper

SMT Surface Mounting Technology

SO-DIMM Small Outline Dual In-Line Memory

Module

SOIC Small Outline Integrated Circuit

SPC Statistical Process Control

SRAM Static Random Access Memory

SSO Simultaneously Switching Output

STII Soldering Temperature Impact Index

TAB Tape-Automated Bonding

TAL Time Above Liquidus

TBBPA Tetrabromobisphenol A

TBGA Tape Ball Grid Array

Td Decomposition Temperature

TFBGA Thin Proﬁle Fine Pitch Ball Grid Array

Transition Temperature

TIM Thermal Interface Materials

TMA Thermal Mechanical Analysis

UFPT Ultra Fine Pitch Technology

UtRAM Uni-transistor Random Access Memory

UUT Unit Under Test

UV Ultraviolet

VFBGA Very Thin-Proﬁle Fine-Pitch Ball Grid Array

WEEE Waste in Electrical and Electronic

Equipment

ZIF Zero Insertion Force

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11 BIBLIOGRAPHY AND REFERENCES

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Bogatin, E., ‘‘BGAs for Workstation Application,’’ Proc.

Ball Grid Array Nat. Symp., Dallas, TX, March 1995.

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Testament of the BGA Void,’’ SMTA International 2011.

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be Avoided for Surface Mount Solder Component Leads

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IPC-TR-462, ‘‘Solderability Evaluation of Printed Boards

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ber 1987, IPC Publications.

John Lau, ‘‘Ball Grid Array Technology’’ 1995. p.122.

Shows a graph of relative PCB cost per layer count.

Katchmar, R., ‘‘Position Dependence of CTE in Plastic

Ball Grid Arrays,’’ Proc. Int. Electronics Packaging Conf.

(IEPS), Atlanta, September 1994, pp. 271-283.

Lebonheur, C. Matayaba, S. Houle, and Y. Xu, Thermal

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Mawer, A. J., S. C. Bolton, and E. Mammo, ‘‘Plastic BGA

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September 1994, pp. 239-251.

NCMS, Lead-free Solder Project Final Report, August

1997, www.ncms.org.

Orsten, G. S. F., ‘‘The Problems Associated with Adhesive

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Orsten, G. S. F., W. New, Y. Wang, and M. L. Peloquin

‘‘SMT Considerations in Spaceﬂight and Critical Military

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Phelan, G., and S. Wang, ‘‘Solder Ball Connection

Reliability Model and Critical Parameter Optimization,’’

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Ref: Robert Crowley, Chip Scale Review, May 1998,

p. 37).

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March 1995.

Theo I. Eijm, Albert Holliday, Frank E. Bader and Steven

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Experiment to Determine Attachment Reliability Drivers

for PBGA Packages.’’

‘‘Thermal and Power Cycling Limits of Plastic Ball Grid

Array (PBGA) Assemblies,’’ Robert Darveaux and Andrew

Mawer, Motorola.

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