IPC-7095C-2013.pdf - 第6页
Guy Ramsey , R & D Assembly T eresa Rowe, AAI Corporation Robert Rowland, RadiSys Corporation Manny Sanchez, Boeing Company Christopher Sattler, AQS - All Quality & Services, Inc. Martin Scionti, Raytheon Missile…
Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the IPC Ball Grid Array Task Group (5-21f) of the Assembly & Joining Processes Committee (5-20) are shown below,
it is not possible to include all of those who assisted in the evolution of this standard. To each of them, the members of the
IPC extend their gratitude.
Assembly & Joining
Processes Committee
Ball Grid Array
Task Group
Technical Liaisons of the
IPC Board of Directors
Chair
Leo P. Lambert
EPTAC Corporation
Chair
Ray Prasad
Ray Prasad Consultancy Group
Bob Neves
Microtek Laboratories
Dongkai Shangguan
Flextronics International
Ball Grid Array Task Group
David Adams, Rockwell Collins
Syed Sajid Ahmad, North Dakota
State University
Dudi Amir, Intel Corporation
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
Gerald Leslie Bogert, Bechtel Plant
Machinery, Inc.
Richard Bradford, Raytheon
Company
Lyle Burhenn, BAE Systems
Platform Solutions
Stephen Butkovich, Cisco Systems,
Inc.
Scott Buttars, Intel Corporation
Calette Chamness, U.S. Army
Aviation & Missile Command
Beverley Christian, Research In
Motion Limited
Terence Collier, Collier Ventures, Inc.
Richard Davidson, Honeywell
Aerospace
William Dieffenbacher, BAE Systems
Platform Solutions
Harold Ellison, Quantum Corporation
Gary Ferrari, FTG Circuits
Joe Fjelstad, Verdant Electronics
Lionel Fullwood, WKK Distribution
Ltd.
Mahendra Gandhi, Northrop
Grumman Aerospace Systems
Reza Ghaffarian, Jet Propulsion
Laboratory
Constantino Gonzalez, ACME
Training & Consulting
Michael Green, Lockheed Martin
Space Systems Company
Hue Green, Lockheed Martin Space
Systems Company
Gaston Hidalgo, Samsung
Telecommunications America
David Hillman, Rockwell Collins
Robert Hills, Tait Communications
Constantin Hudon, Varitron
Technologies Inc.
Bruce Hughes, U.S. Army Aviation &
Missile Command
Greg Hurst, BAE Systems
Jennie Hwang, H-Technologies
Group
Joseph Kane, BAE Systems Platform
Solutions
Lilia Kondrachova, Intel Corporation
Dale Kratz, Plexus Corporation
George Liu, Flextronics Mfg.
(Zhuhai) Co. Ltd.
Helen Lowe, Celestica
Chris Mahanna, Robisan Laboratory
Inc.
Karen McConnell, Northrop
Grumman Corporation
Mradul Mehrotra, Raytheon Missile
Systems
Jay Messner, Boeing Company
Roger Miedico, Raytheon Company
George Milad, Uyemura International
Corp.
Barry Morris, Advanced Rework
Technology
Paul Neathway, Jabil Circuit, Inc.
(HQ)
David Nelson, Adtran Inc.
Lei Nie, Intel Corporation
Mark Northrup, IEC Electronics
Corp.
Deassy Novita, Intel Corporation
Jack Olson, Caterpillar Inc.
William Ortloff, Raytheon Company
George Oxx, Jabil Circuit, Inc. (HQ)
Agnes Ozarowski, BAE Systems
Deepak Pai, General Dynamics Info.
Sys., Inc
Mel Parrish, STI Electronics, Inc.
Dawn Patterson, Northrop Grumman
Corporation
Sam Polk, Lockheed Martin Missiles
& Fire Control
Ray Prasad, Ray Prasad Consultancy
Group
Jagadeesh Radhakrishnan, Intel
Corporation
John Radman, Trace Laboratories -
Denver
January 2013 IPC-7095C
iii
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Guy Ramsey, R & D Assembly
Teresa Rowe, AAI Corporation
Robert Rowland, RadiSys
Corporation
Manny Sanchez, Boeing Company
Christopher Sattler, AQS - All
Quality & Services, Inc.
Martin Scionti, Raytheon Missile
Systems
Sundar Sethuraman, Jabil Circuit,
Inc.
Gilbert Shelby, Raytheon Systems
Company
Jeff Shubrooks, Raytheon Company
Dana Smith, Lockheed Martin
Missiles & Fire Control
Vern Solberg, Solberg Technical
Consulting
Kerry Spencer, Lockheed Martin
Missile & Fire Control
Gregg Stearns, Emerson Climate
Technologies- Retail Solutions
Kristen Troxel, Hewlett-Packard
Company
Sharon Ventress, U.S. Army Aviation
& Missile Command
Joe Vo, Broadcom Corporation
Bill Vuono, Raytheon Company
Girish Wable, Jabil Circuit, Inc. (HQ)
Clint Wenthur, Plexus Manufacturing
Solutions - Neenah 1
Dewey Whittaker, Honeywell Inc. Air
Transport Systems
Bob Willis, The SMART Group
Linda Woody, Lockheed Martin
Missile & Fire Control
Fonda Wu, Raytheon Company
Michael Yuen, Foxconn
CMMSG-NVPD
Gil Zweig, Glenbrook Technologies
Inc.
A special note of thanks goes to the following individuals for their dedication to bringing this project to fruition. We
would like to highlight those individuals who made major contributions to the development of this standard.
Dudi Amir, Intel Corporation
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
Scott Buttars, Intel Corporation
Michael Green, Lockheed Martin
Space Systems Company
David Hillman, Rockwell Collins
Bruce Hughes, U.S. Army Aviation &
Missile Command
Jennie Hwang, H-Technologies
Group
Karen McConnell, Northrop
Grumman Corporation
Ray Prasad, Ray Prasad Consultancy
Group
Jagadeesh Radhakrishnan, Intel
Corporation
Robert Rowland, RadiSys
Corporation
Vern Solberg, Solberg Technical
Consulting
Kristen Troxel, Hewlett Packard
Company
Linda Woody, Lockheed Martin
Missile & Fire Control
Front and back cover photos courtesy of Wavelength Electronics and Neuralynx
IPC-7095C January 2013
iv
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---
Table of Contents
1 SCOPE ...................................................................... 1
1.1 Purpose ................................................................. 1
1.2 Intent .................................................................... 1
2 APPLICABLE DOCUMENTS .................................... 1
2.1 IPC ....................................................................... 1
2.2 JEDEC .................................................................. 2
3 SELECTION CRITERIA AND MANAGING BGA
IMPLEMENTATION
................................................... 2
3.1 Description of Infrastructure ............................... 3
3.1.1 Land Patterns and Circuit Board
Considerations ...................................................... 3
3.1.2 Technology Comparison ...................................... 5
3.1.3 Assembly Equipment Impact .............................. 8
3.1.4 Stencil Requirements ........................................... 8
3.1.5 Inspection Requirements ..................................... 9
3.1.6 Test ....................................................................... 9
3.2 Time-to-Market Readiness .................................. 9
3.3 Methodology ........................................................ 9
3.4 Process Step Analysis .......................................... 9
3.5 BGA Limitations and Issues ............................... 9
3.5.1 Visual Inspection ............................................... 10
3.5.2 Moisture Sensitivity ........................................... 10
3.5.3 Thermally Unbalanced BGA Design ................ 10
3.5.4 Rework ............................................................... 11
3.5.5 Cost .................................................................... 11
3.5.6 Availability ......................................................... 12
3.5.7 Voids in BGA ..................................................... 12
3.5.8 Pad Cratering ..................................................... 12
3.5.9 Standardization Issues ....................................... 12
3.5.10 Reliability Concerns .......................................... 13
3.5.11 Drivers for Lead-Free Technology .................... 14
4 COMPONENT CONSIDERATIONS ........................ 14
4.1 Semiconductor Packaging Comparisons and
Drivers ................................................................ 14
4.1.1 Package Feature Comparisons ........................... 14
4.1.2 BGA Package Drivers ....................................... 15
4.1.3
Cost Issues ......................................................... 15
4.1.4
Component Handling ......................................... 15
4.1.5
Thermal Performance ........................................ 17
4.1.6
Real Estate ......................................................... 17
4.1.7
Electrical Performance ....................................... 17
4.1.8
Mechanical Performance ................................... 17
4.2
Die Mounting in the BGA Package .................. 17
4.2.1 Wire Bond .......................................................... 18
4.2.2 Flip Chip ............................................................ 19
4.3 Standardization ................................................... 19
4.3.1 Industry Standards for BGA .............................. 19
4.3.2 Ball Pitch ........................................................... 20
4.3.3 BGA Package Outline ....................................... 21
4.3.4 Ball Size Relationships ...................................... 21
4.3.5 Package-on-Package BGA ................................. 22
4.3.6 Coplanarity ......................................................... 22
4.4
Component Packaging Style Considerations .... 23
4.4.1
Solder Ball Alloy ............................................... 23
4.4.2
Ball Attach Process ............................................ 24
4.4.3
Ceramic Ball Grid Array ................................... 24
4.4.4
Ceramic Column Grid Arrays ........................... 25
4.4.5
Tape Ball Grid Arrays ....................................... 25
4.4.6
Multiple Die Packaging ..................................... 25
4.4.7
System-in-Package (SiP) ................................... 26
4.4.8
3D Folded Package Technology ........................ 27
4.4.9
Ball Stack, Package-on-Package ....................... 27
4.4.10
Folded and Stacked Packaging Combination ... 28
4.4.11
Package-on-Package .......................................... 28
4.4.12
Benefits of Multiple Die Packaging .................. 28
4.4.13 Solutions for Very Fine Pitch Array
Packaging ........................................................... 28
4.5
BGA Connectors and Sockets ........................... 29
4.5.1 Material Considerations for BGA
Connectors ......................................................... 29
4.5.2 Attachment Considerations for BGA
Connectors ......................................................... 29
4.5.3
BGA Materials and Socket Types ..................... 30
4.5.4 Attachment Considerations for BGA
Sockets ............................................................... 30
4.6
BGA Construction Materials ............................. 31
4.6.1
Types of Substrate Materials ............................. 31
4.6.2
Properties of Substrate Materials ...................... 33
4.7
BGA Package Design Considerations ............... 33
4.7.1
Power and Ground Planes ................................. 33
4.7.2
Signal Integrity .................................................. 34
4.7.3 Heat Spreader Incorporation Inside the
Package .............................................................. 34
4.8 BGA Package Acceptance Criteria and
Shipping Format ................................................ 34
4.8.1
Missing Balls ..................................................... 34
4.8.2
Voids in Solder Balls ......................................... 34
January 2013 IPC-7095C
v
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---