IPC-7095C-2013.pdf - 第4页
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IPC-7095C
Design and
Assembly Process
Implementation
for BGAs
Developed by the IPC Ball Grid Array Task Group (5-21f) of the
Assembly & Joining Processes Committee (5-20) of IPC
Users of this publication are encouraged to participate in the
development of future revisions.
Contact:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
Supersedes:
IPC-7095B - March 2008
IPC-7095A - October 2004
IPC-7095 - August 2000
®
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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This Page Intentionally Left Blank
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the IPC Ball Grid Array Task Group (5-21f) of the Assembly & Joining Processes Committee (5-20) are shown below,
it is not possible to include all of those who assisted in the evolution of this standard. To each of them, the members of the
IPC extend their gratitude.
Assembly & Joining
Processes Committee
Ball Grid Array
Task Group
Technical Liaisons of the
IPC Board of Directors
Chair
Leo P. Lambert
EPTAC Corporation
Chair
Ray Prasad
Ray Prasad Consultancy Group
Bob Neves
Microtek Laboratories
Dongkai Shangguan
Flextronics International
Ball Grid Array Task Group
David Adams, Rockwell Collins
Syed Sajid Ahmad, North Dakota
State University
Dudi Amir, Intel Corporation
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
Gerald Leslie Bogert, Bechtel Plant
Machinery, Inc.
Richard Bradford, Raytheon
Company
Lyle Burhenn, BAE Systems
Platform Solutions
Stephen Butkovich, Cisco Systems,
Inc.
Scott Buttars, Intel Corporation
Calette Chamness, U.S. Army
Aviation & Missile Command
Beverley Christian, Research In
Motion Limited
Terence Collier, Collier Ventures, Inc.
Richard Davidson, Honeywell
Aerospace
William Dieffenbacher, BAE Systems
Platform Solutions
Harold Ellison, Quantum Corporation
Gary Ferrari, FTG Circuits
Joe Fjelstad, Verdant Electronics
Lionel Fullwood, WKK Distribution
Ltd.
Mahendra Gandhi, Northrop
Grumman Aerospace Systems
Reza Ghaffarian, Jet Propulsion
Laboratory
Constantino Gonzalez, ACME
Training & Consulting
Michael Green, Lockheed Martin
Space Systems Company
Hue Green, Lockheed Martin Space
Systems Company
Gaston Hidalgo, Samsung
Telecommunications America
David Hillman, Rockwell Collins
Robert Hills, Tait Communications
Constantin Hudon, Varitron
Technologies Inc.
Bruce Hughes, U.S. Army Aviation &
Missile Command
Greg Hurst, BAE Systems
Jennie Hwang, H-Technologies
Group
Joseph Kane, BAE Systems Platform
Solutions
Lilia Kondrachova, Intel Corporation
Dale Kratz, Plexus Corporation
George Liu, Flextronics Mfg.
(Zhuhai) Co. Ltd.
Helen Lowe, Celestica
Chris Mahanna, Robisan Laboratory
Inc.
Karen McConnell, Northrop
Grumman Corporation
Mradul Mehrotra, Raytheon Missile
Systems
Jay Messner, Boeing Company
Roger Miedico, Raytheon Company
George Milad, Uyemura International
Corp.
Barry Morris, Advanced Rework
Technology
Paul Neathway, Jabil Circuit, Inc.
(HQ)
David Nelson, Adtran Inc.
Lei Nie, Intel Corporation
Mark Northrup, IEC Electronics
Corp.
Deassy Novita, Intel Corporation
Jack Olson, Caterpillar Inc.
William Ortloff, Raytheon Company
George Oxx, Jabil Circuit, Inc. (HQ)
Agnes Ozarowski, BAE Systems
Deepak Pai, General Dynamics Info.
Sys., Inc
Mel Parrish, STI Electronics, Inc.
Dawn Patterson, Northrop Grumman
Corporation
Sam Polk, Lockheed Martin Missiles
& Fire Control
Ray Prasad, Ray Prasad Consultancy
Group
Jagadeesh Radhakrishnan, Intel
Corporation
John Radman, Trace Laboratories -
Denver
January 2013 IPC-7095C
iii
Copyright IPC-Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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