743844-015.pdf - 第122页
DDR Frequency Shifting DDR interfaces emit electromagnetic radiation which can couple to the antennas of various r adios that are integrated in the system, and cause r adio frequency interference (RFI). The DDR Radio Fre…

Processor Technology
DDR
Maximum
Rate
[MT/s]
SAGV-LowBW SAGV-MedBW SAGV-HighBW
SAGV-
MaxBW/
lowest latency
DDR5 1DPC on
2DPC UDIMM S
only
4400 2000 G2 3600 G2 4000 G2 4400 G2
DDR5 1DPC on
2DPC SODIMM
(HX only)
4000 2000 G2 3600 G2 3600 G2 4000 G2
Processor
4,5
HX
Refresh
DDR5 1DPC on
2DPC 1R
SODIMMHX
Refresh only
7
4400 2000 G2 3600 G2 4000 G2 4400 G2
DDR5
6,7
2DPC
1R/1R HX Refresh
only
4400 2000 G2 3600 G2 4000 G2 4400 G2
DDR5
6,7
2DPC
2R/2R HX Refresh
only
4000 2000 G2 3600 G2 3600 G2 4000 G2
Processor
4,5
S/S refresh/HX
DDR5
6
2DPC
1R/1R
4000 2000 G2 3600 G2 3600 G2 4000 G2
DDR5
6
2DPC
2R/2R
3600 2000 G2 3200 G2 3200 G2 3600 G2
Processor
5
H/P/U/U-
Refresh /H-
Refresh
LPDDR4x 4266 2666 G4 3733 G4 4266G4 4266 G2
LPDDR5/x 1R PCB
T4
6400 2400 G4 6000 G4 6400 G4 5200 G2
LPDDR5/x 2R PCB
T4 Refresh only
7
6400 2400 G4 6000 G4 6400 G4 5200 G2
LPDDR5/x 2R PCB
T4
6000 2400 G4 5600 G4 6000 G4 5200 G2
LPDDR5 2R PCB
T3
4800 2400 G4 4400 G4 4800 G4 4800 G2
LPDDR5 1R PCB
T3 LPDDR5x
1R/2R PCB T3
5200 2400 G4 4400 G4 5200 G4 4800 G2
DDR4 3200 2133 G2 2933 G2 3200 G2 2666 G1
DDR5 5600 2000 G2 3600 G2 5200 G2 5600 G2
DDR5 5200 2000 G2 3600 G2 4800 G2 5200 G2
Notes: 1. The Processor supports dynamic gearing technology where the Memory Controller can run at 1:1 (Gear-1,
Legacy mode) or 1:2 (Gear-2 mode) and 1:4 (Gear-4 mode) ratio of DRAM speed. The gear ratio is the ratio of
DRAM speed to Memory Controller Clock.
MC Channel Width equal to DDR Channel width multiply by Gear Ratio
2. SA-GV modes
a. LowBW- Low frequency point, Minimum Power point. Characterized by low power, low BW, high latency. The
system will stay at this point during low to moderate BW consumption.
b. MedBW - Tuned for balance between power & performance.
c. HighBW Characterized by high power, low latency, moderate BW also used as RFI mitigation point.
d. MaxBW/ lowest latency Lowest Latency point, low BW and highest power.
3. Intel
®
System Agent Enhanced Speed Step
®
is not enabled for S/S Refresh-Processor 125W/150W SKUs
4. SAGV point may change based on memory module Type.
5. On mixed module type configurations, the selected SAGV point will be the set to the lower frequency
configuration.
R
Memory—Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
May 2025 Datasheet, Volume 1 of 2
Doc. No.: 743844, Rev.: 015 121

DDR Frequency Shifting
DDR interfaces emit electromagnetic radiation which can couple to the antennas of
various radios that are integrated in the system, and cause radio frequency
interference (RFI).
The DDR Radio Frequency Interference Mitigation (DDR RFIM) feature is primarily
aimed at resolving narrowband RFI from DDR4/5 and LPDDR4/5 technologies for the
Wi-Fi* high and ultra-high bands (~5-7 GHz) .
By changing the DDR data rate, the harmonics of the clock can be shifted out of a
radio band of interest, thus mitigating RFI to that radio. This feature is working with
SAGV on, the 3
rd
SAGV point is used as RFI mitigation point.
Memory Controller (MC)
The integrated memory controller is responsible for transferring data between the
processor and the DRAM as well as the DRAM maintenance. There are two instances of
MC, one per memory slice. Each controller is capable of supporting up to four channels
of LPDDR4x and LPDDR5, two channels of DDR5 and one channel of DDR4.
The two controllers are independent and have no means of communicating with each
other, they need to be configured separately.
In a symmetric memory population, each controller only view half of the total physical
memory address space.
Both MC support only one technology in a system, DDR4 or DDR5 or LPDDR4X, or
LPDDR5. Mix of technologies in one system is not allowed.
Memory Controller Power Gate
Memory Controller Power Gating can only be done for MC0 which is connected to a
separate power domain. MC0 will be gated automatically when it is not occupied.
NOTE
MC1 cannot be gated.
System Memory Controller Organization Mode (DDR4/5 Only)
The IMC supports two memory organization modes, single-channel and dual-channel.
Depending upon how the DDR Schema and DIMM Modules are populated in each
memory channel, a number of different configurations can exist.
Single-Channel Mode
In this mode, all memory cycles are directed to a single channel. Single-Channel mode
is used when either the Channel A or Channel B DIMM connectors are populated in any
order, but not both.
Dual-Channel Mode – Intel
®
Flex Memory Technology Mode
The IMC supports Intel Flex Memory Technology Mode. Memory is divided into a
symmetric and asymmetric zone. The symmetric zone starts at the lowest address in
each channel and is contiguous until the asymmetric zone begins or until the top
5.1.3.3
5.1.4
5.1.5
5.1.6
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Memory
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
122 Doc. No.: 743844, Rev.: 015

address of the channel with the smaller capacity is reached. In this mode, the system
runs with one zone of dual-channel mode and one zone of single-channel mode,
simultaneously, across the whole memory array.
NOTE
Channels A and B can be mapped for physical channel 0 and 1 respectively or vice
versa; however, channel A size should be greater or equal to channel B size.
Figure 19. Intel
®
DDR4/5 Flex Memory Technology Operations
MC BMC A
B B
C
B
B
C
Non interleaved
access
Dual channel
interleaved access
TOM
MC A and MC B can be configured to be physical channels 0 or 1
B – The largest physical memory amount of the smaller size memory module
C – The remaining physical memory amount of the larger size memory module
Dual-Channel Symmetric Mode (Interleaved Mode)
Dual-Channel Symmetric mode, also known as interleaved mode, provides maximum
performance on real world applications. Addresses are ping-ponged between the
channels after each cache line (64-byte boundary). If there are two requests, and the
second request is to an address on the opposite channel from the first, that request
can be sent before data from the first request has returned. If two consecutive cache
lines are requested, both may be retrieved simultaneously, since they are ensured to
be on opposite channels. Use Dual-Channel Symmetric mode when both Channel A
and Channel B DIMM connectors are populated in any order, with the total amount of
memory in each channel being the same.
R
Memory—Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
May 2025 Datasheet, Volume 1 of 2
Doc. No.: 743844, Rev.: 015 123