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13.0 Electrical Specifications.......................................................................................... 185 13.1 Power Deliv ery...........................................................................…

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8.1.1 DMI Error Flow........................................................................................147
8.1.2 DMI Link Down....................................................................................... 147
8.2 On Package Interface (OPI).................................................................................. 147
8.2.1 OPI Support........................................................................................... 147
8.2.2 Functional Description..............................................................................148
9.0 Graphics....................................................................................................................149
9.1 Processor Graphics..............................................................................................149
9.1.1 Media Support (Intel
®
QuickSync and Clear Video Technology HD)................. 149
9.1.2 Platform Graphics Hardware Feature ......................................................... 152
10.0 Display.................................................................................................................... 153
10.1 Display Technologies Support..............................................................................153
10.2 Display Configuration.........................................................................................153
10.3 Display Features................................................................................................157
10.3.1 General Capabilities............................................................................... 157
10.3.2 Multiple Display Configurations................................................................157
10.3.3 High-bandwidth Digital Content Protection (HDCP)..................................... 157
10.3.4 DisplayPort*......................................................................................... 158
10.3.5 High-Definition Multimedia Interface (HDMI*)........................................... 160
10.3.6 embedded DisplayPort* (eDP*)............................................................... 162
10.3.7 MIPI* DSI............................................................................................ 162
10.3.8 Integrated Audio................................................................................... 163
11.0 Camera/MIPI.......................................................................................................... 165
11.1 Camera Pipe Support......................................................................................... 165
11.2 MIPI* CSI-2 Camera Interconnect....................................................................... 165
11.2.1 Camera Control Logic.............................................................................166
11.2.2 Camera Modules....................................................................................166
11.2.3 CSI-2 Lane Configurations...................................................................... 166
12.0 Signal Description................................................................................................... 168
12.1 System Memory Interface...................................................................................169
12.1.1 DDR4 Memory Interface......................................................................... 169
12.1.2 LP4x-LP5 Memory Interface.................................................................... 170
12.1.3 DDR5 Memory Interface......................................................................... 172
12.2 PCI Express* Graphics (PEG) Signals................................................................... 174
12.3 Direct Media Interface (DMI) Signals....................................................................174
12.4 Reset and Miscellaneous Signals.......................................................................... 175
12.5 Display Interfaces .............................................................................................177
12.5.1 Digital Display Interface (DDI) Signals..................................................... 177
12.5.2 Digital Display Audio Signals................................................................... 178
12.6 USB Type-C Signals........................................................................................... 178
12.7 MIPI CSI 2 Interface Signals............................................................................... 179
12.8 Processor Clocking Signals..................................................................................180
12.9 Testability and Monitoring Signals........................................................................ 180
12.10 Error and Thermal Protection Signals..................................................................181
12.11 Processor Power Rails.......................................................................................182
12.12 Ground and Reserved Signals............................................................................183
12.13 Processor Internal Pull-Up / Pull- Down on Package ............................................. 184
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Contents
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
6 Doc. No.: 743844, Rev.: 015
13.0 Electrical Specifications.......................................................................................... 185
13.1 Power Delivery.................................................................................................185
13.1.1 Power and Ground Pins.......................................................................... 185
13.1.2 Digital Linear Voltage Regulator (DLVR) .................................................. 185
13.1.3 V
CC
Voltage Identification (VID)...............................................................186
13.1.4 Fast V-Mode..........................................................................................186
13.1.5 Current Excursion Protection (CEP).......................................................... 187
13.2 DC Specifications.............................................................................................. 187
13.2.1 Processor Power Rails DC Specifications....................................................188
13.2.2 Processor Interfaces DC Specifications..................................................... 207
14.0 Package Mechanical Specifications......................................................................... 216
14.1 Package Mechanical Attributes............................................................................ 216
14.2 Package Storage Specifications........................................................................... 218
15.0 CPU And Device IDs................................................................................................ 219
15.1 CPUID..............................................................................................................219
15.2 PCI Configuration Header................................................................................... 220
15.3 Device IDs........................................................................................................221
R
Contents—Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
May 2025 Datasheet, Volume 1 of 2
Doc. No.: 743844, Rev.: 015 7
Figures
1 S Processor Line Platform Diagram.............................................................................17
2 E/E Refresh Processor Line Platform Diagram.............................................................. 17
3 S Refresh Processor Line Platform Diagram................................................................. 18
4 P/H/H Refresh Processor Line Platform Diagram...........................................................18
5 U/U Refresh Processor Line Platform Diagram..............................................................19
6 HX /HX RefreshProcessor Line Platform Diagram.......................................................... 20
7 PX Processor Line Platform Diagram...........................................................................20
8 Example for PECI Host-Clients Connection...................................................................31
9 Example for PECI EC Connection................................................................................32
10 Device to Domain Mapping Structures ....................................................................... 36
11 Hybrid Cache.......................................................................................................... 46
12 Processor Camera System........................................................................................ 56
13 Telemetry Aggregator...............................................................................................58
14 Processor Package and IA Core C-States.....................................................................63
15 Idle Power Management Breakdown of the Processor IA Cores.......................................65
16 Package C-State Entry and Exit................................................................................. 68
17 Package Power Control............................................................................................. 78
18 PROCHOT Demotion Description ............................................................................... 84
19 Intel
®
DDR4/5 Flex Memory Technology Operations.................................................... 123
20 DDR4 Interleave (IL) and Non-Interleave (NIL) Modes Mapping....................................128
21 PCI Express* Related Register Structures in the Processor ..........................................145
22 S/S Refresh, HX/HX Refresh Processor Display Architecture......................................... 155
23 P, PX/U/U Refresh/H/H Refresh Processor Display Architecture.....................................156
24 DisplayPort* Overview............................................................................................158
25 HDMI* Overview ...................................................................................................161
26 MIPI* DSI Overview...............................................................................................163
27 Input Device Hysteresis ......................................................................................... 215
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Figures
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
8 Doc. No.: 743844, Rev.: 015