743844-015.pdf - 第206页

Symbol Parameter Segment Minimum Typical Maximum Units Notes 1,2,5 Sustain and Sustain Gated rails. TOB 1P05_PROC Vcc1P05 T olerance All Processor Lines ± 5 % 3,5 Icc MAX_1P05_PROC Maximum Current for Vcc1P05 P/H/H Refre…

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V
DD2
DC Specifications
Table 83. Memory Controller (VDD2) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
V
DD2(LPDDR4x
)
Processor I/O supply voltage
for LPDDR4x
All Processor Lines Typ-5% 1.115 Typ+5% V 3,4,5
V
DD2
(LPDDR5/x)
Processor I/O supply voltage
for LPDDR5/x
All Processor Lines Typ-5% 1.065 Typ+5% V 3,4,5
V
DD2 (DDR4)
Processor I/O supply voltage
for DDR4
All Processor Lines Typ-5% 1.2 Typ+5% V 3,4,5
V
DD2 (DDR5)
Processor I/O supply voltage
for DDR5
All Processor Lines Typ-4.5% 1.116 Typ+4.5% V 3,4,5
TOB
VDD2
VDD2 Tolerance All Processor Lines VDD2 MIN <AC+DC< VDD2 MAX V 3,4
Icc
MAX_VDD2
(LPDDR4x)
Maximum Current for V
DD2
Rail (LPDDR4x)
P/H/PX-Processor
Line
— — 2.6
A 2
Icc
MAX_VDD2
(LPDDR5/x)
Maximum Current for V
DD2
Rail (LPDDR5/x)
P/H/PX-Processor
Line
— — 2.6
Icc
MAX_VDD2
(DDR4)
Maximum Current for V
DD2
Rail (DDR4)
S/S Refresh -
Processor Line
— — 2.6
A 2
Icc
MAX_VDD2
(DDR5)
Maximum Current for V
DD2
Rail (DDR5 Non-ECC)
S/S Refresh/E/E
Refresh -Processor
Line
— —
4
Maximum Current for V
DD2
Rail (DDR5 ECC)
4.5
Icc
MAX_VDD2
(DDR5)
Maximum Current for V
DD2
Rail (DDR5)
E -Processor Line — — 4.5 A 6
Icc
MAX_VDD2
(DDR4)
Maximum Current for V
DD2
Rail (DDR4)
HX/HX Refresh -
Processor Line
— — 2.6 A 2
Icc
MAX_VDD2
(DDR5)
Maximum Current for V
DD2
Rail (DDR5 Non-ECC)
HX/HX Refresh-
Processor Line
— —
4
A 2
Maximum Current for V
DD2
Rail (DDR5 ECC)
4.5
Notes: 1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will
be updated with characterized data from silicon measurements at a later date.
2. The current supplied to the DIMM modules is not included in this specification.
3. Includes AC and DC error, where the AC noise is bandwidth limited to under 1 MHz, measured on package pins.
4. No requirement on the breakdown of AC versus DC noise.
5. The voltage specification requirements are measured on package pins as near as possible to the processor with
an oscilloscope set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the
system is not coupled into the oscilloscope probe.
6. For Entry Server applications (Windows and Linux Server OS) the expected worst-case peak current draw for
the VDD2 rail will be 4.5A, this is for conditions with Tj under 95°C.
Vcc
1P05_PROC
DC Specifications
Table 84. Vcc
1P05_PROC
Supply DC Voltage and Current Specifications
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2,5
Vcc
1P05_PROC
Processor Power
Rail voltage
support internal
All Processor Lines — 1.05 — V 3
continued...
13.2.1.3
13.2.1.4
R
Electrical Specifications—Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
May 2025 Datasheet, Volume 1 of 2
Doc. No.: 743844, Rev.: 015 205
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2,5
Sustain and
Sustain Gated
rails.
TOB
1P05_PROC
Vcc1P05
Tolerance
All Processor Lines ± 5 % 3,5
Icc
MAX_1P05_PROC
Maximum Current
for Vcc1P05
P/H/H
Refresh/PX/U/U
Refresh-Processor
Line
— — 900 mA 4
Icc
MAX_1P05_PROC
Maximum Current
for Vcc1P05
S/S Refresh/E/E
Refresh -Processor
Line
— — 770 mA 4
Icc
MAX_1P05_PROC
Maximum Current
for Vcc1P05
HX/HX Refresh-
Processor Line
— — 770 mA 4
Notes: 1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will
be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
3. The voltage specification requirements are measured on package pins as near as possible to the processor with
an oscilloscope set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the
system is not coupled into the oscilloscope probe.
4. Vcc
1P05_PROC
may be named in other document as Vcc
1P05_CPU
5. Vcc
1P05_PROC
momentarily may rise to 1.15V during certain scenarios. No side effects are expected.
Vcc
1P8_PROC
DC Specifications
Table 85. Vcc
1P8_PROC
Supply DC Voltage and Current Specifications
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2,5
Vcc
1P8_PROC
Processor Power
Rail voltage
support PCIe
(PHY)
S/S Refresh/E/E
Refresh /P/PX/H/
U/U Refresh/H
Refresh Processor
Lines
— 1.8 — V 3
Vcc
1P8_PROC
Processor Power
Rail voltage
support PCIe
(PHY)
HX/HX Refresh
Processor Lines
— 1.8 — V 3
TOB
1P8_PROC
Vcc
1P8_PROC
Tolerance
All Processor
Lines
± 4 % 3,5
AC Noise AC Noise
All Processor
Lines
— —
+/-15
Frequency range
from 1KHz Up to
10MHz
+/-5
Frequency range
Above 10MHz
mV 6
Icc
MAX_1P8_PROC
Maximum
Current for
Vcc
1P8_PROC
P/H/PX/U/U
Refresh/H
Refresh-Processor
Lines
— — 100 mA 4
continued...
13.2.1.5
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Electrical Specifications
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
206 Doc. No.: 743844, Rev.: 015
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2,5
Icc
MAX_1P8_PROC
Maximum
Current for
Vcc
1P8_PROC
S/S Refresh/E/E
Refresh -
Processor Line
— — 106 mA 4
Icc
MAX_1P8_PROC
Maximum
Current for
Vcc
1P8_PROC
HX/HX Refresh-
Processor Line — — 140 mA 4
Notes: 1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will
be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
3. The voltage specification requirements are measured on capacitors pads near to the package, with an
oscilloscope set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the
system is not coupled into the oscilloscope probe.
4. Vcc
1P8_PROC
power rail may be named in different document as Vcc
1P8_CPU
5. For S-process line, AC noise spec include VR self generated noise or input source AC noise that passes through
to VR output and droop/overshoot due to transient load.
Processor Interfaces DC Specifications
DDR4 DC Specifications
Table 86. DDR4 Signal Group DC Specifications
Symbol Parameter Minimum Typical Units Notes
1
V
IL
Input Low Voltage — 0.75*Vdd2 0.68*Vdd2 V 2, 3, 4
V
IH
Input High Voltage
0.82*Vdd2 0.75*Vdd2
—
Maximum
V 2, 3, 4
R
ON_UP(DQ)
Data Buffer pull-up Resistance 30 — 50 Ω 5,12
R
ON_DN(DQ)
Data Buffer pull-down Resistance 30 — 50
R
ODT(DQ)
On-die termination equivalent
resistance for data signals
40 — 200 Ω 6, 12
V
ODT(DC)
On-die termination DC working point
(driver set to receive mode)
0.45*Vdd2 — 0.85*Vdd2 V 12
R
ON_UP(CK)
Clock Buffer pull-up Resistance 25 — 45 Ω 5, 12
R
ON_DN(CK)
Clock Buffer pull-down Resistance 25 — 45 Ω 5, 12
R
ON_UP(CMD)
Command Buffer pull-up Resistance 25 — 45 Ω 5, 12
R
ON_DN(CMD)
Command Buffer pull-down Resistance 25 — 45 Ω 5, 12
R
ON_UP(CTL)
Control Buffer pull-up Resistance 25 — 45 Ω 5, 12
R
ON_DN(CTL)
Control Buffer pull-down Resistance 25 — 45 Ω 5, 12
R
ON_UP
(SM_PG_CNTL1)
System Memory Power Gate Control
Buffer Pull-up Resistance
45 — 125 Ω —
R
ON_DN
(SM_PG_CNTL1)
System Memory Power Gate Control
Buffer Pull- down Resistance
40 — 130 Ω —
I
LI
Input Leakage Current (DQ, CK)
0 V
0.2* V
DD2
0.8* V
DD2
— — 1.1 mA —
continued...
13.2.2
13.2.2.1
R
Electrical Specifications—Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
May 2025 Datasheet, Volume 1 of 2
Doc. No.: 743844, Rev.: 015 207