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4.0 Thermal Management Processor Thermal Management The thermal solution provides both component-lev el and system-level thermal management. T o allow optimal operation and long-term reliability of Intel processor - base…

TCSS Power

State

Allowed

Package C

Status

Device Attached Description

USB4 CIe is in inactive

IOM is inactive

IOM - TCSS Input Output Manager:

• The IOM interacts with the SoC to perform power management, boot, reset, connect and disconnect

devices to TYPE-C sub-system

TCSS Devices (xHCI / xDCI / TBT Controllers) - power states:

• D0 - Device at Active state.

• D3 - Device at lowest-powered state.

Power Management—Intel

Core

™

, Xeon

™

6300 And Xeon

™

E 2400 Processors

Generation Intel

Core

™

, Intel

Core

™

Generation, Intel

Core

™

Processor (Series 1) and (Series 2), Intel

Xeon

™

2400 Processor and Intel

Xeon

™

6300 Processor

May 2025 Datasheet, Volume 1 of 2

Doc. No.: 743844, Rev.: 015 75

4.0 Thermal Management

Processor Thermal Management

The thermal solution provides both component-level and system-level thermal

management. To allow optimal operation and long-term reliability of Intel processor-

based systems, the system/processor thermal solution should be designed so that the

processor:

• Remains below the maximum junction temperature (Tj

MAX

) specification at the

maximum Processor Base power (a.k.a TDP).

• Conforms to system constraints, such as system acoustics, system skin-

temperatures, and exhaust-temperature requirements.

CAUTION

Thermal specifications given in this chapter are on the component and package level

and apply specifically to the processor. Operating the processor outside the specified

limits may result in permanent damage to the processor and potentially other

components in the system.

Thermal Considerations

The Processor Base Power (a.k.a TDP) is the assured sustained power that should be

used for the design of the processor thermal solution, Design to a higher thermal

capability will get more Turbo residency. Processor Base Power (a.k.a TDP) is the time-

averaged power dissipation that the processor is validated to not exceed during

manufacturing while executing an Intel-specified high complexity workload at Base

Frequency and at the maximum junction temperature for the SKU segment and

configuration.

NOTE

The System on Chip processor integrates multiple compute cores and I/O on a single

package. Platform support for specific usage experiences may require additional

concurrency power to be considered when designing the power delivery and thermal

sustained system capability.

The processor integrates multiple processing IA cores, graphics cores and for some

SKUs a PCH on a single package. This may result in power distribution differences

across the package and should be considered when designing the thermal solution.

Intel

Turbo Boost Technology 2.0 allows processor IA cores to run faster than the

base frequency. It is invoked opportunistically and automatically as long as the

processor is conforming to its temperature, power, power delivery, and current control

limits. When Intel

Turbo Boost Technology 2.0 is enabled:

4.1

4.1.1

Intel

Core

™

, Xeon

™

6300 And Xeon

™

E 2400 Processors—Thermal Management

Generation Intel

Core

™

, Intel

Core

™

Generation, Intel

Core

™

Processor (Series 1) and (Series 2), Intel

Xeon

™

2400 Processor and Intel

Xeon

™

6300 Processor

Datasheet, Volume 1 of 2 May 2025

76 Doc. No.: 743844, Rev.: 015

• The processor may exceed the Processor Base Power (a.k.a TDP) for short

durations to utilize any available thermal capacitance within the thermal solution.

The duration and time of such operation can be limited by platform runtime

configurable registers within the processor.

• Graphics peak frequency operation is based on the assumption of only one of the

graphics domains (GT/GTx) being active. This definition is similar to the IA core

Turbo concept, where peak turbo frequency can be achieved when only one IA

core is active. Depending on the workload being applied and the distribution

across the graphics domains the user may not observe peak graphics frequency

for a given workload or benchmark.

• Thermal solutions and platform cooling that is designed to less than thermal

design guidance may experience thermal and performance issues.

NOTE

Intel

Turbo Boost Technology 2.0 availability may vary between the different SKUs.

Package Power Control

The package power control settings of PL1, PL2, PL3, PL4, and Tau allow the designer

to configure Intel

Turbo Boost Technology 2.0 to match the platform power delivery

and package thermal solution limitations.

• Power Limit 1 (PL1): A threshold for average power that will not exceed -

recommend to set to equal Processor Base Power (a.k.a TDP). PL1 should not be

set higher than thermal solution cooling limits.

• Power Limit 2 (PL2): A threshold that if exceeded, the PL2 rapid power limiting

algorithms will attempt to limit the spike above PL2.

• Power Limit 3 (PL3): A threshold that if exceeded, the PL3 rapid power limiting

algorithms will attempt to limit the duty cycle of spikes above PL3 by reactively

limiting frequency. This is an optional setting

• Power Limit 4 (PL4): A limit that will not be exceeded, the PL4 power limiting

algorithms will preemptively limit frequency to prevent spikes above PL4.

• Turbo Time Parameter (Tau): An averaging constant used for PL1 exponential

weighted moving average (EWMA) power calculation.

NOTES

1. Implementation of Intel

Turbo Boost Technology 2.0 only requires configuring

PL1, PL1, Tau and PL2.

2. The Turbo Implementation guide and BIOS Specification.

3. PL3 and PL4 are disabled by default.

4. The Intel Dynamic Tuning (DTT) is recommended for performance improvement in

mobile platforms. Dynamic Tuning is configured by system manufacturers

dynamically optimizing the processor power based on the current platform thermal

and power delivery conditions. Contact Intel Representatives for enabling details.

4.1.1.1

Thermal Management—Intel

Core

™

, Xeon

™

6300 And Xeon

™

E 2400 Processors

Generation Intel

Core

™

, Intel

Core

™

Generation, Intel

Core

™

Processor (Series 1) and (Series 2), Intel

Xeon

™

2400 Processor and Intel

Xeon

™

6300 Processor

May 2025 Datasheet, Volume 1 of 2

Doc. No.: 743844, Rev.: 015 77