743844-015.pdf - 第217页
Package Parameter HX Processor Lines Land Side Capacitors Y es Die Side Capacitors Y es (resistor/Capacitors) Die Configuration Single Die Single-Chip Package Package Dimensions Nominal Package Size 45.0 x 37.5 mm Z Subs…
14.0 Package Mechanical Specifications
Package Mechanical Attributes
The S/S refresh Processor Lines use a Flip Chip technology available in a Land Grid
Array (LGA) package. The following table provides an overview of the package
mechanical attributes. For specific dimensions (die size, die location, and so on), refer
to the processor package mechanical drawings.
Table 97. S/S Refresh/E/E Refresh LGA Processor Package Mechanical Attributes
Package Parameter S LGA Processor Lines
Package Technology
Package Type Flip Chip Land Grid Array
Interconnect Land Grid Array (LGA)
Lead Free N/A
Halogenated Flame
Retardant Free
Yes
Package Configuration
Solder Ball Composition N/A
Ball/Pin Count 1700
Grid Array Pattern Grid Array
Land Side Capacitors Yes
Die Side Capacitors Yes
Die Configuration Single Die Single-Chip Package with HIS
Package Dimensions
Nominal Package Size 45.0 x 37.5 mm
Z
Substrate Z=1.116 mm +/-0.95
Die Z is 0.37 mm
Minimum Ball/Pin pitch 0.8 mm
Table 98. HX BGA Processor Package Mechanical Attributes
Package Parameter
HX Processor Lines
Package Technology
Package Type Flip Chip Ball Grid Array
Interconnect Ball Grid Array (BGA)
Lead Free N/A
Halogenated Flame
Retardant Free
Yes
Package Configuration
Solder Ball Composition Yes
Ball/Pin Count 1964
Grid Array Pattern Grid Array
continued...
14.1
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Package Mechanical Specifications
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
216 Doc. No.: 743844, Rev.: 015
Package Parameter
HX Processor Lines
Land Side Capacitors Yes
Die Side Capacitors Yes (resistor/Capacitors)
Die Configuration Single Die Single-Chip Package
Package Dimensions
Nominal Package Size 45.0 x 37.5 mm
Z
Substrate Z = 1.119+/-0.095 mm
2.005±0.114 (BOTTOM OF BGA TO TOP
OF DIE)
Minimum Ball/Pin pitch 0.8 mm
Table 99. P/H/U - Processor Package Mechanical Attributes
Package Parameter
P/H/U Processor Line
Package Technology
Package Type Flip Chip Ball Grid Array
Interconnect Ball Grid Array (BGA)
Lead Free Yes
Halogenated Flame
Retardant Free
Yes
Package Configuration
Solder Ball Composition SAC405
Ball/Pin Count 1744
Grid Array Pattern Balls anywhere
Land Side Capacitors Yes
Die Side Capacitors No
Die Configuration 2 Dice Multi Chip package (MCP)
Package Dimensions
Nominal Package Size 25 x 50 mm
Z
Substrate Z = 0.594+/-0.08mm
1.185±0.096 (BOTTOM OF BGA TO TOP
OF DIE)
Minimum Ball/Pin pitch 0.65 mm BP
Table 100. PX - Processor Package Mechanical Attributes
Package Parameter PX Processor Line
Package Technology
Package Type Flip Chip Ball Grid Array
Interconnect Ball Grid Array (BGA)
Lead Free Yes
Halogenated Flame
Retardant Free
Yes
Package Configuration
Solder Ball Composition SAC405
Ball/Pin Count 1792
Grid Array Pattern Ball Anywhere
Land Side Capacitors Yes
continued...
R
Package Mechanical Specifications—Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
May 2025 Datasheet, Volume 1 of 2
Doc. No.: 743844, Rev.: 015 217
Package Parameter PX Processor Line
Die Side Capacitors No
Die Configuration 2 Dice Multi Chip Package (MCP)
Package Dimensions
Nominal Package Size 25 X 40 mm
Z
Substrate Z= 0.594+/-0.08 mm
1.171±0.082 (Bottom of BGA to Top of
Die)
Minimum Ball/Pin pitch 0.62 mm BP
Package Storage Specifications
Parameter Description Minimum Maximum
T
ABSOLUTE STORAGE
The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
subjected to this temperature for any length of
time in Intel Original sealed moisture barrier bag
and / or box.
-25°C 125°C
T
SUSTAINED STORAGE
The ambient storage temperature limit (in
shipping media) for the sustained period of time
-5°C 40°C
RH
SUSTAINED STORAGE
The maximum device storage relative humidity for
the sustained period of time as specified below in
Intel Original sealed moisture barrier bag and / or
box
60%@ 24°C
TIME
SUSTAINED STORAGE
Maximum time: associated with customer shelf life
in Intel Original sealed moisture barrier bag and /
or box
NA
Moisture Sensitive
Devices: 60 months
from bag seal date; Non-
moisture sensitive
devices: 60 months from
lot date
Storage Conditions
Processors in a non-operational state may be installed in a platform, in a tray, boxed, or loose
and may be sealed in airtight package or exposed to free air. Under these conditions,
processor landings should not be connected to any supply voltages, have any I/Os biased, or
receive any clocks. Upon exposure to "free air" (that is, unsealed packaging or a device
removed from packaging material), the processor should be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material. Boxed Land Grid
Array packaged (LGA) processors are MSL 1 ('unlimited' or unaffected) as they are not heated
in order to be inserted in the socket.
Notes: 1. T
ABSOLUTE STORAGE
applies to the un-assembled component only and does not apply to the shipping media,
moisture barrier bags or desiccant. Refers to a component device that is not assembled in a board or socket
that is not to be electrically connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount re-flow are specified by
applicable JEDEC J-STD-020 documents. The JEDEC, J-STD-020 moisture level rating and associated handling
practices apply to all moisture sensitive devices removed from the moisture barrier bag.
3. Post board attaches storage temperature limits are not specified for non-Intel branded boards. Consult your
board manufacturer for storage specifications.
14.2
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Package Mechanical Specifications
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
218 Doc. No.: 743844, Rev.: 015