743844-015.pdf - 第22页

• Intel ® Virtualization T echnology (Intel ® VT -x) • Intel ® Virtualization T echnology for Directed I/O (Intel ® VT -d) • Intel ® APIC Virtualization T echnology (Intel ® APICv) • Hypervisor-Managed Linear Address T r…

Processor Volatility Statement

The processor families do not retain any end-user data when powered down and/or

when the processor is physically removed.

NOTE

Powered down refers to the state which all processor power rails are off.

Package Support

The S/S Refresh Processor lines are available in the following package:

• LGA1700

— A 45 X 37.5 mm

— Substrate Z=1.116 mm +/-0.95

— Substrate + Die Z is 1.116+0.37= 1.486 mm

The E/E Refresh-Processor line is available in the following packages:

• LGA1700

— A 45 X 37.5 mm

— Substrate Z=1.116 mm +/-0.95

— Substrate + Die Z is 1.116+0.37= 1.486 mm

The HX/HX Refresh-Processor line is available in the following packages:

• BGA1964

— A 45 X 37.5 mm

— Substrate Z = 0.594+/-0.08 mm

— 1.185±0.096 (BOTTOM OF BGA TO TOP OF DIE)

The P/H/U/U Refresh/H Refresh-Processor line is available in the following packages:

• BGA1744

— A 25 X 50 mm

— Substrate Z = 0.594+/-0.08 mm

— 1.185±0.096 (BOTTOM OF BGA TO TOP OF DIE)

The PX-Processor line is available in the following packages:

• BGA1792

— A 25 X 40 mm

— Substrate Z = 0.594+/-0.08 mm

— 1.171±0.082 (BOTTOM OF BGA TO TOP OF DIE)

Supported Technologies

• PECI – Platform Environmental Control Interface

1.1

1.2

1.3

Introduction—Intel

Core

™

, Xeon

™

6300 And Xeon

™

E 2400 Processors

Generation Intel

Core

™

, Intel

Core

™

Generation, Intel

Core

™

Processor (Series 1) and (Series 2), Intel

Xeon

™

2400 Processor and Intel

Xeon

™

6300 Processor

May 2025 Datasheet, Volume 1 of 2

Doc. No.: 743844, Rev.: 015 21

• Intel

Virtualization Technology (Intel

VT-x)

• Intel

Virtualization Technology for Directed I/O (Intel

VT-d)

• Intel

APIC Virtualization Technology (Intel

APICv)

• Hypervisor-Managed Linear Address Translation (HLAT)

• Intel

Trusted Execution Technology (Intel

TXT)

• Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI)

• PCLMULQDQ (Perform Carry-Less Multiplication Quad word) Instruction

• Intel

Secure Key

• Execute Disable Bit

• Intel

Boot Guard

• SMEP – Supervisor Mode Execution Protection

• SMAP – Supervisor Mode Access Protection

• SHA Extensions – Secure Hash Algorithm Extensions

• UMIP – User Mode Instruction Prevention

• RDPID – Read Processor ID

• Intel

Total Memory Encryption (Intel

TME)

• Intel

Control-flow Enforcement Technology (Intel

CET)

• KeyLocker Technology

• Devils gate Rock (DGR)

• Smart Cache Technology

• IA Core Level 1 and Level 2 Caches

• Intel's Performance Hybrid Architecture

• Intel

Turbo Boost Technology 2.0

• Intel

Turbo Boost Max Technology 3.0

• PAIR – Power Aware Interrupt Routing

• Intel

Hyper-Threading Technology (Intel

HT Technology)

• Intel SpeedStep

Technology

• Intel

Speed Shift Technology

• Intel

Advanced Vector Extensions 2 (Intel

AVX2)

• Intel

AVX2 Vector Neural Network Instructions (Intel

AVX2 VNNI)

• Intel

64 Architecture x2APIC

• Intel

Dynamic Tuning technology (Intel

DTT)

• Intel

GNA 3.0 (GMM and Neural Network Accelerator)

• Intel

Image Processing Unit (Intel

IPU)

• Cache Line Write Back (CLWB)

• Intel

Processor Trace

• Platform CrashLog

• Telemetry Aggregator

Intel

Core

™

, Xeon

™

6300 And Xeon

™

E 2400 Processors—Introduction

Generation Intel

Core

™

, Intel

Core

™

Generation, Intel

Core

™

Processor (Series 1) and (Series 2), Intel

Xeon

™

2400 Processor and Intel

Xeon

™

6300 Processor

Datasheet, Volume 1 of 2 May 2025

22 Doc. No.: 743844, Rev.: 015

• Integrated Reference Clock PLL

NOTE

The availability of the features above may vary between different processor SKUs.

Refer to Technologies on page 30 for more information.

API Support (Windows*)

• Direct3D* 2015, Direct3D 12, Direct3D 11.2, Direct3D 11.1, Direct3D 9, Direct3D

10, Direct2D

• OpenGL* 4.5

• Open CL* 2.1, Open CL* 2.0, Open CL* 1.2, Open CL* 3.0

DirectX* extensions:

• PixelSync, Instant Access, Conservative Rasterization, Render Target Reads,

Floating-point De-norms, Shared a Virtual memory, Floating Point atomics, MSAA

sample-indexing, Fast Sampling (Coarse LOD), Quilted Textures, GPU Enqueue

Kernels, GPU Signals processing unit. Other enhancements include color

compression.

Gen 13 architecture delivers hardware acceleration of Direct X* 12 Render pipeline

comprising of the following stages: Vertex Fetch, Vertex Shader, Hull Shader,

Tessellation, Domain Shader, Geometry Shader, Rasterizer, Pixel Shader, Pixel Output.

Power Management Support

Processor Core Power Management

• Full support of ACPI C-states as implemented by the following processor C-states:

— C0, C1, C1E, C6, C8, C10

• Enhanced Intel SpeedStep

Technology

• Intel

Speed Shift Technology

Refer to Processor IA Core Power Management on page 64 for more information.

System Power Management

S/S

Refresh/E-

Processor

HX/HX

Refresh -

Processor

H/H Refresh -

Processor

P / PX -

Processor

U/U Refresh -

Processor

Generation

Intel

Core

™

Processors

and S3 MS

and S3 MS and S3 MS MS

Intel

Xeon

2400

Processors

and S3

Intel

Core

™

Generation

Processors

and S3 MS and S3 MS and S3 MS MS

Note: 1. Modern Standby

1.3.1

1.4

1.4.1

1.4.2

Introduction—Intel

Core

™

, Xeon

™

6300 And Xeon

™

E 2400 Processors

Generation Intel

Core

™

, Intel

Core

™

Generation, Intel

Core

™

Processor (Series 1) and (Series 2), Intel

Xeon

™

2400 Processor and Intel

Xeon

™

6300 Processor

May 2025 Datasheet, Volume 1 of 2

Doc. No.: 743844, Rev.: 015 23