743844-015.pdf - 第79页
• The Psys signal and associated power limits / T au are optional for the system designer and disabled by default. • The Psys data will not include power consumption for charging. • The Intel Dynamic T uning (DT T) is re…
Figure 17. Package Power Control
SOC/Platform Power Limiting Knobs Options Visual
PL4
1
PL1/PsysPL1
1
PL2/PsysPL2
1
Å Power could
sustain here up to
~100s seconds
(Average power)
Time
Power
PL3
1
/PsysPL3
1
Å Power could
sustain here
forever
Note1: Optional Feature, default is disabled
Power in this region can be configured
via PL1 Tau/PsysPL1 Tau
Power
could
peak
for up
to
10ms
Duty cycles of power peaks in
this region can be configurable
via PL3/PsysPL3
Platform Power Control
The processor introduces Psys (Platform Power) to enhance processor power
management. The Psys signal needs to be sourced from a compatible charger circuit
and routed to the IMVP9.1 (voltage regulator). This signal will provide the total
thermally relevant platform power consumption (processor and rest of platform) via
SVID to the processor.
When the Psys signal is properly implemented, the system designer can utilize the
package power control settings of PsysPL1, PsysPL1 Tau , PsysPL2, and PsysPL3 for
additional manageability to match the platform power delivery and platform thermal
solution limitations for Intel
®
Turbo Boost Technology 2.0. The operation of the
PsysPL1, PsysPL1 Tau , PsysPL2 and PsysPL3 are analogous to the processor power
limits described in Package Power Control on page 77.
• Platform Power Limit 1 (PsysPL1): A threshold for average platform power
that will not be exceeded - recommend to set to equal platform thermal capability.
• Platform Power Limit 2 (PsysPL2): A threshold that if exceeded, the PsysPL2
rapid power limiting algorithms will attempt to limit the spikes above PsysPL2.
• Platform Power Limit 3 (PsysPL3): A threshold that if exceeded, the PsysPL3
rapid power limiting algorithms will attempt to limit the duty cycle of spikes above
PsysPL3 by reactively limiting frequency.
• PsysPL1 Tau: An averaging constant used for PsysPL1 exponential weighted
moving average (EWMA) power calculation.
4.1.1.2
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Thermal Management
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
78 Doc. No.: 743844, Rev.: 015
• The Psys signal and associated power limits / Tau are optional for the system
designer and disabled by default.
• The Psys data will not include power consumption for charging.
• The Intel Dynamic Tuning (DTT) is recommended for performance improvement in
mobile platforms. Dynamic Tuning is configured by system manufacturers
dynamically optimizing the processor power based on the current platform thermal
and power delivery conditions. Contact Intel Representatives for enabling details.
Turbo Time Parameter (Tau)
Turbo Time Parameter (Tau) is a mathematical parameter (units of seconds) that
controls the Intel
®
Turbo Boost Technology 2.0 algorithm. During a maximum power
turbo event, the processor could sustain PL2 for a duration longer than the Turbo Time
Parameter. If the power value and/or Turbo Time Parameter is changed during
runtime, it may take some time based on the new Turbo Time Parameter level for the
algorithm to settle at the new control limits. The time varies depending on the
magnitude of the change, power limits and other factors. There is an individual Turbo
Time Parameter associated with Package Power Control and Platform Power Control.
Assured Power (cTDP)
Assured Power (cTDP) form a design option where the processor's behavior and
package Processor Base Power (a.k.a TDP) are dynamically adjusted to a desired
system performance and power envelope. Assured Power (cTDP) and Low-Power Mode
technologies offer opportunities to differentiate system design while running active
workloads on select processor SKUs through scalability, configuration and adaptability.
The scenarios or methods by which each technology is used are customizable but
typically involve changes to PL1 and associated frequencies for the scenario with a
resultant change in performance depending on system's usage. Either technology can
be triggered by (but are not limited to) changes in OS power policies or hardware
events such as docking a system, flipping a switch or pressing a button. Assured
Power (cTDP) is designed to be configured dynamically and do not require an
operating system reboot.
NOTE
Assured Power (cTDP) is not battery life improvement technologies.
Assured Power (cTDP)
NOTE
Assured Power (cTDP) availability may vary between the different SKUs.
With Assured Power (cTDP), the processor is capable of altering the maximum
sustained power with an alternate processor IA core base frequency. Assured Power
(cTDP) allows operation in situations where extra cooling is available or situations
where a cooler and quieter mode of operation is desired.
cTDP consists of three modes as shown in the following table.
4.1.1.3
4.1.2
4.1.2.1
R
Thermal Management—Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
May 2025 Datasheet, Volume 1 of 2
Doc. No.: 743844, Rev.: 015 79
Table 11. Assured Power (cTDP) Modes
Mode Description
Processor Base
Power (a.k.a TDP)
The time-averaged power dissipation that the processor is validated to not exceed
during manufacturing while executing an Intel-specified high complexity workload at
Base Frequency and at the maximum junction temperature for the SKU segment and
configuration. Refer Processor Line Thermal and Power Specifications on page 101
Note: The System on Chip processor integrates multiple compute cores and I/O on a
single package. Platform support for specific usage experiences may require additional
concurrency power to be considered when designing the power delivery and thermal
sustained system capability.
Maximum Assured
Power (cTDP-Up)
Maximum Assured Power ( a.k.a cTDP UP) is a specific processor IA core option, where
manufacturing confirms logical functionality within the set of operating condition limits
specified for the SKU segment.
Refer Processor Line Thermal and Power Specifications on page 101. The Maximum
Assured Power (a.k.a cTDP-Up) Frequency and corresponding Processor Base Power is
higher than the processor IA core Base Frequency and SKU Segment Base on the
Processor Base Power.
Minimum Assured
Power (cTDP-
Down)
Minimum Assured Power ( a.k.a cTDP Down) is a specific processor IA core option,
where manufacturing confirms logical functionality within the set of operating condition
limits specified for the SKU segment.
Refer Processor Line Thermal and Power Specifications on page 101. The Minimum
Assured Power (a.k.a cTDP-Down) Frequency and corresponding Processor Base Power
(a.k.a TDP) is lower than the processor IA core Base Frequency and SKU Segment
Processor Base Power.
In each mode, the Intel
®
Turbo Boost Technology 2.0 power limits are reprogrammed
along with a new OS controlled frequency range. The Intel Dynamic Tuning driver
assists in Processor Base Power (a.k.a TDP) operation by adjusting processor PL1
dynamically. The Assured Power (cTDP) mode does not change the maximum per-
processor IA core turbo frequency.
Thermal Management Features
Occasionally the processor may operate in conditions that are near to its maximum
operating temperature. This can be due to internal overheating or overheating within
the platform. In order to protect the processor and the platform from thermal failure,
several thermal management features exist to reduce package power consumption
and thereby temperature in order to remain within normal operating limits.
Furthermore, the processor supports several methods to reduce memory power.
Adaptive Thermal Monitor
The purpose of the Adaptive Thermal Monitor is to reduce processor IA core power
consumption and temperature until it operates below its maximum operating
temperature. Processor IA core power reduction is achieved by:
• Adjusting the operating frequency (using the processor IA core ratio multiplier)
and voltage.
• Modulating (starting and stopping) the internal processor IA core clocks (duty
cycle).
The Adaptive Thermal Monitor can be activated when the package temperature,
monitored by any Digital Thermal Sensor (DTS), meets its maximum operating
temperature. The maximum operating temperature implies maximum junction
temperature Tj
MAX
.
4.1.3
4.1.3.1
R
Intel
®
Core
™
, Xeon
™
6300 And Xeon
™
E 2400 Processors—Thermal Management
13
th
Generation Intel
®
Core
™
, Intel
®
Core
™
14
th
Generation, Intel
®
Core
™
Processor (Series 1) and (Series 2), Intel
®
Xeon
™
E
2400 Processor and Intel
®
Xeon
™
6300 Processor
Datasheet, Volume 1 of 2 May 2025
80 Doc. No.: 743844, Rev.: 015