IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第104页

The copper conductor may consist of combinations of copper foil, copper plating and electroless copper. Metal resist, solder coatings, and reflowed tin-lead plating that would normally be seen in a microsection are not s…

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Note: The extent of outgrowth, if present, is related to the dry film resist thickness. Outgrowth occurs when the plating thickness exceeds
the resist thickness.
Note: The different etch configurations may not meet intended design requirements.
注： 镀层增宽的程度与干膜抗蚀剂的厚度有关。当镀层厚度超过抗蚀剂厚度时，就会产生镀层增宽。
注： 由于蚀刻外形的不同可能不能满足设计目的要求。
图321f
具有镀层增宽的图形电镀（干膜抗蚀剂）
图321h
具有镀层增宽的图形电镀（液态抗蚀剂）
图321g
薄铜箔与图形电镀（抗蚀剂）
图321i
随着表面阻剂W的不同，导体有效宽度与导体的宽度可能会不相同
3.2 CONDUCTIVE PATTERNS – GENERAL（导电图形 – 总则）
3.2.1 Etching Characteristics (cont.)（蚀刻特性（续））
95IPC-A-600H-2010 2010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
The copper conductor may consist of combinations of copper foil, copper plating and electroless copper. Metal resist, solder coatings, and
reflowed tin-lead plating that would normally be seen in a microsection are not shown in these illustrations.
铜导体可由铜箔、铜镀层及化学沉铜层组合而成。通常在显微切片中可以看到的金属抗蚀层、焊料涂覆层及热熔锡铅镀层，在这
里没有给出图示。
Target Condition - Class 1,2,3
（⽬标条件 - 1,2,3级）
• Conductor width exceeds minimum require-
ment.
• 导体宽度大于最小宽度要求。
Acceptable - Class 1,2,3
（可接受条件 - 1,2,3级）
• Conductor width meets minimum require-
ment.
• 导体宽度满足最小宽度要求。
Nonconforming - Class 1,2,3
（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above
criteria.
• 缺陷不符合或超出上述要求。
图322a
图322b
图322c
3.2 CONDUCTIVE PATTERNS – GENERAL（导电图形 – 总则）
3.2.2 Print and Etch（丝印及蚀刻）
96 IPC-A-600H-20102010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
Unless otherwise specified on the procurement documentation, the minimum total (copper foil plus copper plating) conductor thickness after
processing shall be in accordance with Table 3-1.
除非采购文件另有规定，加工后最小总导体厚度（铜箔加上铜镀层）应当满足表3-1的规定：
Table 3-1 External Conductor Thickness after Plating（表3-1 电镀后外层导体厚度）
Weight
1,4
Absolute Cu Min.
(IPC-4562 less
10% reduction)
(µm) [µin]
Plus minimum
plating for
Class 1 and 2
(20 µm) [787 µin]
2
Plus minimum
plating for Class 3
(25 µm) [984 µin]
2
Maximum Variable
Processing
Allowance
Reduction
3
(µm) [µin]
Minimum Surface
Conductor Thickness after
Processing (µm) [µin]
Class1&2 Class3
重量
1,4
铜绝对最⼩值
（IPC-4562
规定值减10%）
（µm）[µin]
对于1级和2
级产品，
加上最⼩镀层
（20µm）[787µin]
2
对于3级产品，
加上最⼩镀层
（25µm）[984µin]
2
加⼯中允许
减少的最⼤值
（µm）[µin]
3
加⼯后的最⼩表⾯导体厚度
（µm）[µin]
1级和2级 3级
1/8 oz. 4.60 [181] 24.60 [967] 29.60 [1,165] 1.50 [59] 23.1 [909] 28.1 [1,106]
1/4 oz. 7.70 [303] 27.70 [1,091] 32.70 [1,287] 1.50 [59] 26.2 [1,031] 31.2 [1,228]
3/8 oz. 10.80 [425] 30.80 [1,213] 35.80 [1,409] 1.50 [59] 29.3 [1,154] 34.3 [1,350]
1/2 oz. 15.40 [606] 35.40 [1,394] 40.40 [1,591] 2.00 [79] 33.4 [1,315] 38.4 [1,512]
1 oz. 30.90 [1,217] 50.90 [2,004] 55.90 [2,201] 3.00 [118] 47.9 [1,886] 52.9 [2,083]
2 oz. 61.70 [2,429] 81.70 [3,217] 86.70 [3,413] 3.00 [118] 78.7 [3,098] 83.7 [3,295]
3 oz. 92.60 [3,646] 112.60 [4,433] 117.60 [4,630] 4.00 [157] 108.6 [4,276] 113.6 [4,472]
4 oz. 123.50 [4,862] 143.50 [5,650] 148.50 [5,846] 4.00 [157] 139.5 [5,492] 144.5 [5,689]
Note 1. Starting foil weight of design requirement per procurement documentation.
Note 2. Process allowance reduction does not allow for rework processes for weights below
1
⁄
2
oz. For
1
⁄
2
oz. and above, the process allowance reduction allows
for one rework process.
Note 3. Reference: Min. Cu Plating Thickness
Class1=20µm[787µin] Class2=20µm[787µin] Class3=25µm[984µin]
Note 4. For copper foil above 4 oz., utilize the formula provided below.
注1：采购文件中起始铜箔重量的设计要求。
注2：对于重量小于1/2oz的铜箔，加工减少厚度值不允许进行返工制程。对于1/2oz或以上的铜箔，加工减少厚度值允许进行一次返工制程。
注3：参考：最小铜镀层厚度
1级=20µm[787µin] 2级=20µm[787µin] 3级=25µm[984µin]
注4：对于大于4oz的铜箔，采用以下的公式。
The minimum surface conductor thickness after processing values given in Table 3-1 are determined by the following equation:
Minimum Surface Conductor Thickness=a+b-c
Where:
a = Absolute copper foil minimum (IPC-4562 nominal less 10% reduction).
b = Minimum copper plating thickness (20 µm [787 µin] for Class 1 and Class 2; 25 µm [984 µin] for Class 3).
c = A maximum variable processing allowance reduction.
表3-1中给出的加工后最小表面导体厚度的值由下列公式确定：
表面导体最小厚度= a+b-c
此处：
a=铜箔最小厚度绝对值（比IPC-4562标称值少10%）。
b=最小铜镀层厚度（1级和2级为20µm[787µin]；3级为25µm[984µin]）。
c=加工允许减少的最大值。
3.2 CONDUCTIVE PATTERNS – GENERAL（导电图形 – 总则）
3.2.3 Surface Conductor Thickness (Foil Plus Plating)（表⾯导体厚度（铜箔加上镀层））
97IPC-A-600H-2010 2010年4月