IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第52页
T arget/Acceptable - Class 1,2,3 （⽬标/可接受条件 - 1,2,3级） • Good plating adhesion as evidenced by tape test. No plating removed. If overhanging metal breaks off and adheres to the tape, it is evident of overhang or slivers, b…
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Smooth edge condition.
• 边缘光滑。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Edge condition - smooth, no burrs, no rough edges, no lifted plat-
ing on printed contacts, no separation (delamination) of printed
contacts from the base material, and no loose fibers on the bev-
eled edge. Exposed copper at end of printed contact is expected
and permissible.
• 边缘状况 - 平滑、无毛刺、无粗糙边缘、印制接触片的镀
层不起翘，印制接触片与基材无分离（分层），接触片的倒
角斜边上无松散的纤维。印制接触片末端允许露铜。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图272a
图272b
图272c
2.7 PRINTED CONTACTS（印制接触⽚）
2.7.2 Burrs on Edge-Board Contacts（印制接触⽚ – 边缘⽑刺）
43IPC-A-600H-2010 2010年4月
Target/Acceptable - Class 1,2,3（⽬标/可接受条件 - 1,2,3级）
• Good plating adhesion as evidenced by tape test. No plating
removed. If overhanging metal breaks off and adheres to the tape,
it is evident of overhang or slivers, but not of plating adhesion
failure. Figure 273b provides an example of overhanging metal.
• 经胶带测试证明镀层具有良好的附着力，没有镀层脱落。如
果镀层突沿脱落并粘附到胶带上，则只说明有镀层突沿或镀
屑，并非镀层附着力不良。图273b给出了突沿金属的实例示
意图。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
Note 1: The adhesion of the plating shall be tested in accordance with IPC-TM-650, Method 2.4.1, using a strip of pressure sensitive tape
applied to the surface and removed by manual force applied perpendicular to the circuit pattern.
Note 2: Plating that has adhered to the tape.
注1：镀层附着力应当按IPC-TM-650测试方法2.4.1进行测试，用一条压敏胶带压贴到镀层表面上，然后沿垂直于电路图形方向以
手用力撕离胶带。
注2：镀层粘附到胶带上。
图273a
图273c
图273b
2.7 PRINTED CONTACTS（印制接触⽚）
2.7.3 Adhesion of Overplate（外镀层附着⼒）
44 IPC-A-600H-20102010年4月
This section covers acceptability criteria for marking of printed boards. Marking of printed boards provides a means of identification and aids
in assembly. Legends screened over metal will generally degrade in a solder process or stringent cleaning environments. Legends over metal
are not recommended. When use of legends over solderable surfaces is required, an etched legend is target condition. Minimum requirements
should be specified on the procurement documentation. Examples of the marking addressed by this section are:
• Assembly or fabrication part numbers when a requirement of the procurement documentation. Each individual board, each qualification
board, and each set of quality conformance test circuitry (as opposed to each individual coupon) shall be marked in order to ensure trace-
ability between the boards/test circuitry and the manufacturing history and to identify the supplier (logo, etc.).
• Component insertion locators, when a requirement of the procurement documentation.
• Manufacturing sequence number when required by the work order.
• Revision letter when the part number is a requirement of the procurement documentation.
• Designator for test points or adjustment points.
• Polarity or clocking indicators.
• U.L. designator.
The procurement documentation (artwork) is the controlling document for location and type of marking. The procurement documentation
revision letter to which the printed board is fabricated shall be marked on the board if part number marking is a requirement of the procure-
ment documentation. Marking on printed boards shall withstand all tests, cleaning and compatible processes to which the printed boards are
subjected and shall be legible (capable of being read and understood) as defined by the requirements of this document. If a conductive mark-
ing is used, the marking shall be treated as a conductive element on the printed board and shall conform to IPC-4781.
本节涵盖了印制板标记的可接受性准则。印制板的标记提供了识别的方法并在组装时提供帮助。网印在金属表面上的字符，通常
会在焊接过程中或严酷的清洗之后变质。因此，不建议在金属表面上印字符。当需要在可焊表面制作字符时，蚀刻字符为目标条
件。应该在采购文件中规定最低要求。本节所涉及的标记示例如下：
• 采购文件中要求的组装或制造部件号。每一块单独板、每一块鉴定测试板及每套质量一致性测试电路（相对于每块单独的附连
板）均应当标识，以便追溯板/测试电路及制造历史，并识别供应商（商标等）。
• 采购文件中要求的元器件插装位置。
• 加工单中要求的制作顺序号。
• 采购文件中要求的部件号的版本字符。
• 测试点或调节点的指示符号。
• 极性或方位的指示符号。
•U
L标志。
采购文件（照相底图）是规定标记位置和类型的控制文件。如果采购文件中要求标识部件号，则所制造的板上应当标记有该采
购文件的版本字符。印制板上的标记应当能够经受所有的测试、清洗，并与其它工艺制程相兼容，并按本标准要求规定，在经受
测试及有关制程后，板面上的标记应当仍可识别（能读出与理解）。当采用导电标记时，应当把标记作为印制板上的导电要素对
待，且应当符合IPC-4781。
图28a
2.8 MARKING（标记）
Introduction（引⾔）
45IPC-A-600H-2010 2010年4月