IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第45页
Nonconforming - Class 1,2,3 (不符合条件 - 1,2,3级) • Defects either do not meet or exceed above criteria. • 缺陷不符合或 超 出上述要求。 图 256d 2.5 HOLES – PLA TED-THROUGH – GENERAL (镀覆孔 – 通则) 2.5.6 Cap Plating of Filled Holes – (Visual) (…

Target Condition - Class 1,2,3(⽬标条件 - 1,2,3级)
• Copper surface is planar with no indication of cap plating.
• 铜表面平整,无盖覆电镀的迹象。
Acceptable - Class 1,2,3(可接受条件 - 1,2,3级)
• When cap plating of the filled via is specified on the procurement
documentation, the requirements of 2.7.1.1 and the requirements
of the applicable performance specification for rectangular and
round surface mount pads shall apply.
• No plating voids exposing the resin fill area, unless covered by
solder mask.
• Visually discernable protrusions (bumps) and/or depressions
(dimples) that meet the microsection requirements of the appli-
cable performance specification.
• 当采购文件中规定盖覆电镀填塞孔时,矩形和圆形表面贴装
焊盘应当采用2.7.1.1节的要求和适用的性能规范要求。
• 除非被阻焊膜覆盖,否则不能有暴露树脂填塞区域的镀层空
洞。
• 目视可辨识的凹陷(凹坑)和凸起(凸块)满足适用的性能
规范中显微切片的要求。
图256a
图256b
图256c
2.5 HOLES – PLATED-THROUGH – GENERAL(镀覆孔 – 通则)
2.5.6 Cap Plating of Filled Holes – (Visual)(填塞孔的盖覆电镀 –(⽬检))
36 IPC-A-600H-20102010年4月

Nonconforming - Class 1,2,3(不符合条件 - 1,2,3级)
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图256d
2.5 HOLES – PLATED-THROUGH – GENERAL(镀覆孔 – 通则)
2.5.6 Cap Plating of Filled Holes – (Visual) (cont.)(填塞孔的盖覆电镀 –(⽬检)(续))
37IPC-A-600H-2010 2010年4月

Haloing: Mechanically induced fracturing or delamination on or below the surface of the base material; a light area around the holes, other
machined areas or both are usually indications of haloing. See also 2.1.3.
晕圈:由于机械加工引起的基材表面上或表面下的破裂或分层现象;通常表现为在孔周围或其它机械加工的部位呈现泛白区域,
或两处同时存在。又见2.1.3节。
Target Condition - Class 1,2,3(⽬标条件 - 1,2,3级)
• No haloing.
• 无晕圈。
Acceptable - Class 1,2,3(可接受条件 - 1,2,3级)
• Distance between the haloing penetration and the nearest conduc-
tive feature is not less than the minimum lateral conductor spac-
ing, or 100 µm [3,937 µin] if not specified.
• 晕圈渗透 与最近导电图形间的距离不小于最小侧向导体间
距,如未规定,则不小于100µm[3,937µin]。
Nonconforming - Class 1,2,3(不符合条件 - 1,2,3级)
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图261a
图261b
图261c
2.6 HOLES – UNSUPPORTED(⾮⽀撑孔)
2.6.1 Haloing(晕圈)
38 IPC-A-600H-20102010年4月