IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第9页
1.1 SCOPE This document describes the preferred, acceptable, and noncon- forming conditions that are either externally or internally observ- able on printed boards. It represents the visual interpretation of minimum requ…
3.1.3 Clearance Hole, Unsupported, to Power/Ground
Planes（电源层/接地层上的非支撑孔，隔离孔） .... 79
3.1.4 Delamination/Blister（分层/起泡） ............................. 80
3.1.5 Etchback（凹蚀） .......................................................... 81
3.1.5.1 Etchback（凹蚀） .......................................................... 82
3.1.5.2 Negative Etchback（负凹蚀） ...................................... 84
3.1.6 Smear Removal（去钻污） ........................................... 85
3.1.7 Dielectric Material, Clearance, Metal Plane for
Supported Holes（金属层上支撑孔的介质间距） ...... 87
3.1.8 Layer-to-Layer Spacing（层间间距） .......................... 88
3.1.9 Resin Recession（树脂凹缩） ...................................... 89
3.1.10 Hole Wall Dielectric/Plated Barrel Separation
(Hole Wall Pullaway)（孔壁介质与孔壁镀层
分离（孔壁拉脱）） ........................................................ 90
3.2 Conductive Patterns – General（导电图形 - 总则） ......... 91
3.2.1 Etching Characteristics（蚀刻特性） ........................... 94
3.2.2 Print and Etch（丝印及蚀刻） ...................................... 96
3.2.3 Surface Conductor Thickness (Foil Plus
Plating)（表面导体厚度（铜箔加上镀层）） ............... 97
3.2.4 Foil Thickness – Internal Layers（内层铜箔厚度） ..... 98
3.3 Plated-Through Holes – General（镀覆孔 - 总则） ...........
99
3.3.1
Annular Ring – Internal Layers（内层环宽） ............ 101
3.3.2 Lifted Lands – (Cross-Sections)
（焊盘起翘（显微切片）） .......................................... 103
3.3.3 Foil Crack – (Internal Foil) ‘‘C’’Crack
（铜箔裂缝–（内层铜箔）C型裂缝） ...................... 104
3.3.4 Foil Crack (External Foil)
（铜箔裂缝（外层铜箔）） .......................................... 105
3.3.5 Plating Crack (Barrel) ‘‘E’’Crack
（镀层裂缝（孔壁）– E型裂缝） .......................... 106
3.3.6 Plating Crack – (Corner) ‘‘F’’Crack
（镀层裂缝–（拐角）F型裂缝） .............................. 107
3.3.7 Plating Nodules（镀层结瘤） ..................................... 108
3.3.8 Copper Plating Thickness – Hole Wall
（铜镀层厚度–孔壁） ............................................... 109
3.3.9 Copper Wrap Plating（铜包覆电镀） ......................... 110
3.3.10 Plating Voids（镀层空洞） ......................................... 113
3.3.11 Solder Coating Thickness (Only When
Specified)（焊料涂覆层厚度（仅当有规定时）） ..... 115
3.3.12 Solder Mask Thickness（阻焊膜厚度） ..................... 116
3.3.13 Wicking（芯吸） .........................................................
117
3.3.13.1
Wicking, Clearance Holes（隔离孔的芯吸） ............ 118
3.3.14 Innerlayer Separation – Vertical (Axial) Microsection
（内层分离–垂直（轴向）显微切片） ................... 119
3.3.15 Innerlayer Separation – Horizontal (Transverse)
Microsection（内层分离–水平（横向）
显微切片） ................................................................... 120
3.3.16 Material Fill of Blind and Buried Vias
（埋/盲导通孔的材料填塞） ..................................... 121
3.3.17 Cap Plating of Filled Holes
（填塞孔的盖覆电镀） ............................................... 123
3.4 Plated-Through Holes – Drilled（镀覆孔 - 钻孔） ........... 125
3.4.1 Burrs（毛刺） .............................................................. 126
3.4.2 Nailheading（钉头） ................................................... 127
3.5 Plated-Through Holes – Punched（镀覆孔 - 冲孔） ....... 128
3.5.1 Roughness and Nodules（粗糙度和结瘤） ................ 129
3.5.2 Flare（锥口） .............................................................. 130
4 Miscellaneous（其他类型板） .............................................. 131
4.1 Flexible and Rigid-Flex Printed Boards
（挠性及刚挠性印制板） .......................................................... 132
4.1.1 Coverlay Coverage – Coverfilm Separations
（覆盖层覆盖–覆盖膜分离） ................................... 133
4.1.2 Coverlay/Covercoat Coverage – Adhesives
（覆盖层/覆盖涂层的覆
盖–粘接剂） .....................
134
4.1.2.1
Adhesive Squeeze-Out – Land Area
（焊盘区域粘接剂的挤出） ....................................... 134
4.1.2.2 Adhesive Squeeze-Out – Foil Surface
（铜箔表面粘接剂的挤出） ....................................... 135
4.1.3 Access Hole Registration for Coverlay and
Stiffeners（元器件孔与覆盖层及增强板
的重合度） ................................................................... 136
4.1.4 Plating Defects（镀层缺陷） ...................................... 137
4.1.5 Stiffener Bonding（增强板的粘接） .......................... 138
4.1.6 Transition Zone, Rigid Area to Flexible Area
（刚性区域与挠性区域的过渡区） ........................... 140
4.1.7 Solder Wicking/Plating Penetration Under
Coverlay（覆盖层下的焊料芯吸/镀层渗透） .......... 141
4.1.8 Laminate Integrity（层压板完整性） ......................... 143
4.1.8.1 Laminate Integrity – Flexible Printed Board
（层压板完整性–挠性印制板） ............................... 144
4.1.8.2 Laminate Integrity – Rigid-Flex Printed Board
（层压板的完整性–刚挠性印制板） ....................... 145
4.1.9 Etchback (Type 3 and Type 4 Only)（凹蚀
（仅3型和4型板）） ......................................................
146
4.1.10
Smear Removal (Type 3 and 4 Only)（去钻污
（仅3型和4型板）） ...................................................... 147
4.1.11 Trimmed Edges/Edge Delamination
（裁切边缘/边缘分层） ............................................. 148
4.1.12 Fold/Bend Marks（折叠/弯曲痕迹） ........................ 150
4.1.13 Silver Film Integrity（银膜完整性） .......................... 151
4.2 Metal Core Printed Boards（⾦属芯印制板） ................... 153
4.2.1 Type Classifications（分类） ...................................... 154
4.2.2 Spacing Laminated Type（层压型板的间距） .......... 155
4.2.3 Insulation Thickness, Insulated Metal Substrate
（绝缘型金属基板的绝缘厚度） ............................... 156
4.2.4 Insulation Material Fill, Laminated Type Metal Core
（层压型金属芯板的绝缘材料填充） ....................... 157
4.2.5 Cracks in Insulation Material Fill, Laminated Type
（层压型板绝缘材料填充中的裂缝） ....................... 158
4.2.6 Core Bond to Plated-Through Hole Wall
（金属芯与镀覆孔壁的连接） ................................... 159
4.3 Flush Printed Boards（齐平印制板） ................................. 160
4.3.1 Flushness of Surface Conductor
（表面导体的平整性） ............................................... 160
5 Cleanliness（清洁度测试） ................................................... 161
5.1
Solderability（可焊性测试） .................................................
162
5.1.1 Plated-Through Holes (Applicable to Test C/C1)
（镀覆孔（适用于C/C1 测试）） ............................... 163
5.2 Electrical Integrity（电⽓完整性） ....................................... 164
Table of Contents（⽬录）
vi IPC-A-600H-20102010年4月
1.1 SCOPE
This document describes the preferred, acceptable, and noncon-
forming conditions that are either externally or internally observ-
able on printed boards. It represents the visual interpretation of
minimum requirements set forth in various printed board specifica-
tions, e.g.; IPC-6010 series, J-STD-003, etc.
1.1 范围
本文件描述了可从印制板外部或内部观察到的理想的、可接
受的和不符合的条件，给出了在各种印制板规范，即IPC-6010
系列文件、J-STD-003等文件中描述的最低要求的图示说明。
1.2 PURPOSE
The visual illustrations in this document portray specific criteria of
the requirements of current IPC specifications. In order to properly
apply and use the content of this document, the printed board
should comply with the design requirements of the applicable IPC-
2220 series document and the performance requirements of the
applicable IPC-6010 series document. In the event the printed
board does not comply with these or equivalent requirements, then
the acceptance criteria should be as agreed between user and sup-
plier (AABUS).
1.2 ⽬的
本文件中的目检示意图描述了现有IPC规范要求的具体准则。
为了适当地运用和使用本文件内容，印制板应该符合适用的
IPC-2220系列文件的设计要求和适用的IPC-6010系列文件的
性能要求。在印制线路板不符合这些要求或等效要求的情况
下，验收准则应该由供需双方协商确定（AABUS）。
1.3 APPROACH TO THIS DOCUMENT
Characteristics are divided into two general groups:
• Externally Observable (section 2)
• Internally Observable (section 3)
‘‘Externally observable’’ conditions are those features or
imperfections which can be seen and evaluated on or from the exte-
rior surface of the board. In some cases, such as voids or blisters,
the actual condition is an internal phenomenon and is detectable
from the exterior.
‘‘Internally observable’’ conditions are those features or imper-
fections that require microsectioning of the specimen or other
forms of conditioning for detection and evaluation. In some cases,
these features may be visible from the exterior and require micro-
sectioning in order to assess acceptability requirements.
Specimens should be illuminated during evaluation to the extent
needed for effective examination. The illumination should be such
that no shadow falls on the area of interest except those shadows
caused by the specimen itself. It is recommended that polarization
and/or dark field illumination be employed to prevent glare during
the examination of highly reflective materials.
The illustrations in this document portray specific criteria relating
to the heading and subheading of each page, with brief descriptions
of the acceptable and nonconforming conditions for each product
class. (See 1.4.) The visual quality acceptance criteria are intended
to provide proper tools for the evaluation of visual anomalies. The
illustrations and photographs in each situation are related to spe-
cific requirements. The characteristics addressed are those that can
be evaluated by visual observation and/or measurement of visually
observable features.
Supported by appropriate user requirements, this document should
provide effective visual criteria to quality assurance and manufac-
turing personnel.
This document cannot cover all of the reliability concerns encoun-
tered in the printed board industry; therefore, attributes not
addressed in this issue shall be AABUS. The value of this docu-
ment lies in its use as a baseline document that may be modified by
expansions, exceptions, and variations which may be appropriate
for specific applications.
When making accept and/or reject decisions, the awareness of
documentation precedence must be maintained.
This document is a tool for observing how a product may deviate
due to variation in processes. Refer to IPC-9191.
IPC-A-600 provides a useful tool for understanding and interpret-
ing Automated Inspection Technology (AIT) results. AIT may be
applicable to the evaluation of many of the dimensional character-
istics illustrated in this document.
1.3 本⽂件的使⽤⽅法
本文件中的有关特性可分为两大类：
• 外部可观察特性（第2章）
• 内部可观察特性（第3章）
“外部可观察特性”是指那些可在或可从板外表面观察到并
进行评定的特征或瑕疵。在某些情况下，例如空洞或起泡，
其实际状况是一种内部现象，但可从外部进行检查。
“内部可观察特性”是指那些需要对试样进行显微剖切片或
采用其它方法处理才能检查和评定的特征或缺陷。在某些情
况下，这些特征可从外部观察到，但仍需要进行显微剖切，
以确定其是否符合可接受性要求。
为了有效地进行检查，在评定过程中应该保证试样有足够照
明，即除试样本身引起的阴影外，照明不应该在所观察的区
域产生阴影。建议采用偏振光和/或暗场照明，防止在检验强
反射材料的过程中受反光的影响。
本文件中的示意图描述了与每页主标题和副标题有关的具体
准则，并以文字简述了每级产品的可接受条件和不符合条件
(见1.4节)。目检质量验收准则旨在为评定可见异常情况提供
1 INTRODUCTION（前⾔）
Introduction（前⾔）
1IPC-A-600H-2010 2010年4月
适当的工具。每一种情况下的示意图和照片与具体的要求有
关。本文件描述的各种特征可通过目视观察和/或对目视可观
察特征的测量进行评定。
本文件再加上适当的用户要求，应该足以为质量保证及制造
人员提供有效的目检准则。
本文件不可能覆盖印制板行业遇到的所有可靠性问题，
因此，凡本文件没有提到的特性应当由供需双方协商确定
（AABUS）。本文件的价值在于可将其作为基础文件，为了
使之适合于某些具体的应用，可以对其进行补充、免除和变
更等修改。
当作出接受和/或拒收决定时，必须了解并遵守文件的优先顺
序。
本文件可作为观察产品如何因工艺波动而导致其质量可能偏
离的一种工具。参见IPC-9191。
IPC-A-600为理解和解释采用自动检测技术（AIT）检测出的
结果提供了有效的工具。自动检测技术（AIT）可用于评定本
文件图示的许多尺寸特性。
1.4 CLASSIFICATION
This standard recognizes that electrical and electronic products are
subject to classifications by intended end-item use. Three general
end-product classes have been established to reflect differences in
producibility, complexity, functional performance requirements,
and verification (inspection/test) frequency. It should be recog-
nized that there may be overlaps of product between classes.
Process Indicator imperfections are permitted and are deliverable.
The user is responsible for defining the product class. The procure-
ment documentation package shall state the product class and any
exceptions to specific parameters, where appropriate.
Criteria defined in this document reflect three classes, which are as
follows:
Class 1 – Includes limited life products suitable for applications
where the requirement is function of the completed product.
Class 2 – Includes products where continued performance and
extended life is required, and for which uninterrupted service is
desired but not critical.
Class 3 – Includes products where continued high performance or
performance-on-demand is critical, product downtime cannot be
tolerated, and the product must function when required.
Acceptability criteria in this document have been separated so that
printed board product may be evaluated to any one of the three
classes. The use of one class for a specific characteristic does not
mean that all other characteristics must meet the same class. Selec-
tion should be based on minimum need. The customer has the ulti-
mate responsibility for identifying the class to which the product is
evaluated. Thus, accept and/or reject decisions must be based on
applicable documentation such as contracts, procurement docu-
mentation, specifications, standards and reference documents.
1.4 产品分级
本文件认 可 电气和 电子产品的级别由其预期的最终用途决
定。根据生产性、复杂性、功能性能要求及验证（检验/测
试）频次将印制板分为三个通用级别。应该认识到不同级别
的产品之间可能会重叠。
制程警示类瑕疵是允许的，可交付使用。
用户负责产品级别的界定。采购文件包应当描述其产品级别
和对具体参数的任何例外（适用时）。
本文件中定义的准则反映了如下三个级别：
1级 – 包括寿命有限、对整机产品仅有功能性要求的产品。
2级 – 包括要求持续运行和较长寿命的产品，同时希望产品能
够不间断地工作，但这一要求并不严格。
３级 – 包括以连续高性能运行或严格按指令运行为关键的产
品。这类产品的服务间断是不允许的，且在有要求时必须能
够正常工作。
本文件的验收准则是按三种级别分别列出的，可按照三个级
别中的任何一个级别来评定印制板产品。对某一具体特性使
用某一级别的要求，并不意味着所有的其它特性也必须使用
同一级别的要求。产品级别的选择应该基于最低需要。用户
对确定产品的级别负有最终责任。因此，必须根据适用的文
件，如合同、采购文件、规范、标准和引用文件来作出接受
和/或拒收的决定。
1.5 ACCEPTANCE CRITERIA
Most of the illustrations and photographs included in this document
represent three levels of quality for each specific characteristic; i.e.,
Target Condition, Acceptable and Nonconforming. The text
included with each level establishes the ‘‘Acceptance Criteria’’ for
each class of product.
Target Condition in many cases is close to perfect. While this is
the desired condition it is not always achievable and may not be
necessary to ensure the reliability of the printed board in its service
environment.
Acceptable indicates that the condition depicted, while not nec-
essarily perfect, will maintain the integrity and reliability of the
printed board in its service environment. The acceptable condition
is considered acceptable for at least one or more classes but may
not be acceptable for all classes, as specified by the associated
acceptance criteria.
Nonconforming indicates that the condition depicted may be
insufficient to ensure the reliability of the printed board in its ser-
vice environment. The nonconforming condition is considered
1 INTRODUCTION（前⾔）
Introduction (cont.)（前⾔（续））
2 IPC-A-600H-20102010年4月