IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第117页
The average copper thickness should be determined from three measurements, approximately equally spaced, on each side of the PTH. Do not measure in areas having isolated imperfections such as voids, cracks or nodules. 平 …
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Plating is smooth and uniform throughout the hole. No evidence
of roughness or nodules.
• 整个孔壁镀层平滑而均匀。无粗糙或结瘤迹象。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Roughness or nodules do not reduce plating thickness below
absolute minimum requirements or hole diameter below mini-
mum requirements.
• 粗糙或结瘤没有使镀层厚度减小至低于绝对最小值且未使孔
径低于最低要求。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图337a
图337b
图337c
3.3 PLATED-THROUGH HOLES – GENERAL（镀覆孔 – 总则）
3.3.7 Plating Nodules（镀层结瘤）
108 IPC-A-600H-20102010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
The average copper thickness should be determined from three measurements, approximately equally spaced, on each side of the PTH. Do
not measure in areas having isolated imperfections such as voids, cracks or nodules.
平均铜厚应该通过在镀覆孔每侧壁上大约等距离选取三个测试点所得的测量值确定。不要测量有孤立缺陷的区域，例如空洞、裂
缝或结瘤等。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Plating is smooth and uniform throughout the hole. Plating thick-
ness meets requirements.
• 整个孔壁镀层平滑而均匀。镀层厚度满足要求。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Plating thickness varies but meets minimum average require-
ments and minimum thin area requirements in the IPC-6010
series.
• Small localized areas with plating thickness less than minimum
requirement are evaluated as voids.
• 镀层厚度不均，但满足IPC 6010系列中规定的最低平均厚度
要求和最薄区域厚度要求。
• 对于镀层厚度小于最小要求的局部小区域，按空洞对其进行
评定。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图338a
图338b
图338c
3.3 PLATED-THROUGH HOLES – GENERAL（镀覆孔 – 总则）
3.3.8 Copper Plating Thickness – Hole Wall（铜镀层厚度 – 孔壁）
109IPC-A-600H-2010 2010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
Copper wrap plating minimum as specified in the IPC-6010 series shall be continuous from the filled plated hole onto the external surface of
any plated structure and extend by a minimum of 25 µm [984 µin] where an annular ring is required as shown in Figure 339a.
Reduction of surface wrap copper plating by processing (sanding, etching, planarization, etc.) resulting in insufficient wrap plating is not
allowed as shown in Figure 339b.
IPC-6010系列文件中规定的最小铜包覆电镀应当从填塞的镀覆孔到任何电镀结构外层表面是连续的，且在要求有环宽时，至少要
延伸25µm[984µin]，如图339a所示。
不允许出现如图339b所示的由于加工（研磨、蚀刻、整平等）导致包覆铜电镀不足造成的表面包覆铜镀层减少。
Note: Cap plating, if required, over filled holes is not considered in wrap copper thickness measurements.
注： 如要求盖覆电镀，测量包覆铜厚度时，不考虑将塞孔上方作为测量点。
图339a 表⾯包覆铜测量（适⽤于所有填塞的PTH）
图339b 由于过度研磨/整平去除的包覆铜（不可接受）
注：尺寸标注线和箭头标示出了包覆铜已被去除之处。
3.3 PLATED-THROUGH HOLES – GENERAL（镀覆孔 – 总则）
3.3.9 Copper Wrap Plating（铜包覆电镀）
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
110 IPC-A-600H-20102010年4月