IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第146页
The stiffener is evaluated for mechanical support only by way of the test method listed below. 只 通过下列测试方法对 增 强板的 机 械 支 撑 进行评定。 Acceptable - Class 1,2,3 (Stiffener) （可接受条件 - 1,2,3级（ 增强 板） • Mechanical support is required;…
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Plating is uniform and meets the minimum thickness require-
ments.
• No defects of the plating or base material present.
• 镀层均匀一致且满足最小厚度要求。
• 镀层或基材不存在缺陷。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Minor defects present but meet the minimum requirements:
a. Slight deformation of base material and minor smear.
b. Adhesive or dielectric filament with small nodule, but copper
thickness meets minimum requirements.
c. Localized thin and non-uniform plating; copper slightly thin
over one corner and minor extrusion of base material, but cop-
per thickness meets minimum requirements.
• 出现轻微缺陷，但满足最小要求：
a. 基材轻微变形并有少量钻污。
b. 粘 接 剂 或 介 质 细 丝 有 小 的 结 瘤，但 铜 厚 度满足最小
要求。
c.镀层局部偏薄和不均匀；其中一个拐角铜层稍薄和基材
出现轻微突出，但铜厚度满足最小要求。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria and/or the fol-
lowing:
d. Adhesive filament causing cracks in plating.
e. Nodules, extrusion and deformation of base material violate
minimum hole size requirements.
f. Plating violates the minimum thickness requirement.
g. Circumferential voids.
• 缺陷不符合或超出上述要求。
d. 粘接剂细丝造成镀层裂缝；
e. 基材的结瘤、凸起和变形违反了最小孔径要求；
f.镀层违反了最小厚度要求；
g. 出现环状空洞。
图414a
图414b
图414c
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.4 Plating Defects（镀层缺陷）
137IPC-A-600H-2010 2010年4月
The stiffener is evaluated for mechanical support only by way of the test method listed below.
只通过下列测试方法对增强板的机械支撑进行评定。
Acceptable - Class 1,2,3 (Stiffener)（可接受条件 - 1,2,3级（增强板）
• Mechanical support is required; void-free bonding is not required.
• The stiffener does not reduce the solderable annular ring below the minimum solderable annular ring requirements.
• Peel strength between the flexible printed board and the stiffener, when tested in accordance with the method below, is a minimum of 1.4kg
per 25 mm [0.984 in] width when bonded with thermoset adhesive and 0.38kg per 25 mm [0.984 in] width when bonded with pressure sen-
sitive adhesive.
• 要求机械支撑，但不要求无空洞粘接。
• 增强板没有使可焊孔环的宽度减少至低于最小环宽要求。
• 挠性印制板和增强板之间的剥离强度，当按下述方法测试时，使用热固粘接剂时的剥离强度最低为1.4kg/25mm[0.984in]，使用
压敏粘接剂时的剥离强度最低为0.38kg/25mm[0.984in]。
Acceptable - Class 3 (Adhesive)（可接受条件 - 3级）（粘接剂）
• The adhesive used to bond the stiffener does not reduce the solderable annular ring below the minimum solderable annular ring require-
ments.
• The total area of voids does not exceed 10% of the stiffener surface area.
• Each void does not exceed 2.5 mm [0.0984 in] in the longest dimension.
• 用于粘接增强板的粘接剂未使可焊孔环的宽度减少至低于最小环宽要求。
• 总的空洞区域未超过增强板表面面积的10%。
• 每个空洞的最长尺寸不超过2.5mm[0.0984in]。
Acceptable - Class 2 (Adhesive) （可接受条件 - 2级）（粘接剂）
• The adhesive used to bond the stiffener does not reduce the solderable annular ring below the minimum solderable annular ring require-
ments.
• The total area of voids does not exceed 20% of the stiffener surface area.
• Each void does not exceed 2.5 mm [0.0984 in] in the longest dimension.
• 用于粘接增强板的粘接剂未使可焊孔环的宽度减少至低于最小环宽要求。
• 总的空洞区域未超过增强板表面面积的20%。
• 每个空洞的最长尺寸不超过2.5mm[0.0984in]。
图415a
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.5 Stiffener Bonding（增强板的粘接）
138 IPC-A-600H-20102010年4月
Acceptable - Class 1 (Adhesive)（可接受条件 - 1级）（粘接剂）
• The adhesive used to bond the stiffener does not reduce the solderable annular ring below the minimum solderable annular ring require-
ments.
• The total area of voids does not exceed 30% of the stiffener surface area.
• Each void does not exceed 2.5 mm [0.0984 in] in the longest dimension.
• 用于粘接增强板的粘接剂未使可焊孔环的宽度减少至低于最小环宽要求。
• 总的空洞区域未超过增强板表面面积的30%。
• 每个空洞的最长尺寸不超过2.5mm[0.0984in]。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
Test Method: Using a sharp instrument such as a scalpel or razor blade, cut approximately 10 mm [0.394 in] wide by 80 mm [3.15 in] long
through the flexible printed board to the stiffener so that approximately halfway through the peeling operation the sample will be perpendicu-
lar to the pull. Pull at a rate of 50 ± 6.3 mm/minute. Take readings at the beginning, middle, and end of the pull, and average the reading for
acceptability.
测试⽅法： 用一种锋利的工具，如解剖刀或剃须刀片，沿着挠性线路往增强板方向切割出一条宽约为10mm[0.394in]、长约为80
mm[3.15in]的粘接剂带,因此在剥离操作进行至约一半时样品将与剥离的方向成直角。剥离的速度为50±6.3mm/min。在剥离操作
的开始、中间和终止时记下测量数据，将测量数据平均从而确定可接受性。
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.5 Stiffener Bonding（增强板的粘接（续））
139IPC-A-600H-2010 2010年4月