IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第32页
Delamination: A separation between plies within a base mate- rial, between a material and conductive foil, or any other planar separations within a printed board. 分层： 出现在基材内的 层 与 层 之 间 、基材与 导电箔 之 间 ，或 印制板 任何 其它 层 内的分 离 现…
Acceptable - Class 1（可接受条件 - 1级）
• The imperfection does not reduce the conductor spacing below
the minimum.
• No propagation as a result of thermal testing that replicates the
manufacturing process.
• Crazing at the edge of the printed board does not reduce the mini-
mum distance between printed board edge and conductive pat-
tern; or more than 2.5 mm [0.0984 in] if not specified.
• 瑕疵未使导体间距减少至低于最小导体间距。
• 没有由于模拟制造过程的热测试而扩大。
• 印制板边的微裂纹未减少板边与导电图形间的最小距离，若
未规定最小距离时，则微裂纹不大于2.5mm[0.0984in]。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图232e
2.3 BASE MATERIAL SUBSURFACE（基材表⾯下）
2.3.2 Crazing (cont.)（微裂纹（续））
23IPC-A-600H-2010 2010年4月
Delamination: A separation between plies within a base mate-
rial, between a material and conductive foil, or any other planar
separations within a printed board.
分层：出现在基材内的层与层之间、基材与导电箔之间，或
印制板任何其它层内的分离现象。
Blister: Delamination in the form of a localized swelling and
separation between any of the layers of a lamination base material,
or between base material and conductive foil or protective coating.
起泡：表现为层压基材的任意层之间或者基材与导电箔或保
护性涂覆层之间的局部膨胀和分离的分层。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• No blistering or delamination.
• 无起泡或分层。
Acceptable - Class 2,3（可接受条件 - 2,3级）
• The area affected by imperfections does not exceed 1% of the
printed board area on each side.
• The imperfection does not reduce the space between conductive
patterns below the minimum conductor spacing.
• The blister or delamination does not span more than 25% of the
distance between adjacent conductive patterns.
• No propagation as a result of thermal testing that replicates the
manufacturing process.
• The imperfection does not exceed the specified minimum dis-
tance between printed board edge and conductive pattern, or 2.5
mm [0.0984 in] if not specified.
• 受瑕疵影响的面积不超过印制板每面面积的1%。
• 瑕疵没有使导电图形间的间距减少至低于最小导体间距。
• 起泡或分层的跨距不大于相邻导电图形之间距离的25%。
• 没有由于模拟制造制程的热应力测试而扩大。
• 瑕疵未减少板边与导电图形间规定的最小距离，若未规定最
小距离时，则微裂纹不大于2.5mm[0.0984in]。
图233a
注：此图仅⽤作说明状况，并不要求做显微剖切评价。
图233b
图233c
2.3 BASE MATERIAL SUBSURFACE（基材表⾯下）
2.3.3 Delamination/Blister（分层/起泡）
24 IPC-A-600H-20102010年4月
Acceptable - Class 1（可接受条件 - 1级）
• The area affected by imperfections does not exceed 1% of the
printed board area on each side.
• The blister or delamination spans more than 25% of the distance
between conductors, but does not reduce the space between con-
ductor patterns below the minimum conductor spacing.
• No propagation as a result of thermal testing that replicates the
manufacturing process.
• The imperfection does not exceed the specified minimum dis-
tance between printed board edge and conductive pattern, or 2.5
mm [0.0984 in] if not specified.
• 受瑕疵影响的面积不能超过印制板每面面积的1%。
• 起泡或分层跨距大于相邻导体间距的25%，但没有使导电图
形间的间距减小到至低于最小导体间距。
• 没有由于模拟制造制程的热应力测试而扩大。
• 瑕疵未超过印制板边缘与导电图形间规定的最小距离，若未
规定最小距离时，则微裂纹不大于2.5mm[0.0984in]。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
Note: The area affected is determined by combining the area of each imperfection and dividing by the total area of the printed board. A sepa-
rate determination is made for each side.
注：受影响的面积，是由各瑕疵面积的总和除以印制板的总面积来确定的。要分别确定每面受影响面积的百分比。
图233d
图233e
2.3 BASE MATERIAL SUBSURFACE（基材表⾯下）
2.3.3 Delamination/Blister (cont.)（分层/起泡（续））
25IPC-A-600H-2010 2010年4月