IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第110页
T arget Condition - Class 1,2,3 （⽬标条件 - 1,2,3级） • All holes accurately registered in the center of the lands. • 所有的 孔 准确地对准 焊 盘 的中 心 。 Acceptable - Class 3 （可接受条件 - 3级） • Annular ring measures 0.025 mm [0.000984 in] or m…
For multilayer printed boards, in addition to physical measurements of printed board surfaces, if internal annular ring breakout is detected in
the vertical cross section, but the degree of breakout cannot be determined, internal registration may be assessed by nondestructive techniques
other than microsection, such as, special patterns, probes, and/or software, which are configured to provide information on the interpolated
annual ring remaining and pattern skew. Techniques include, but are not limited to the following:
• The optional F or R coupon detailed in IPC-2221.
• Custom designed electrically testable coupons.
• Radiographic (x-ray) techniques.
• Horizontal microsection.
• CAD/CAM data analysis as correlated to pattern skew by layer.
Note: Microsectioning or statistical sampling shall be used to verify correlation of the approved technique, and a calibration standard estab-
lished for the specific technique employed.
If misregistration to the point of breakout is detected in vertical microsections, the concerns are that:
1. The conductor width minimum may be compromised at the land junction and,
2. There is insufficient electrical spacing.
The extent and direction of breakout shall be determined. Appropriate test coupons or actual production printed boards shall be tested at the
affected area(s) and analyzed on the suspect layer(s) to determine compliance. This may be accomplished by the techniques listed above.
Measurements for internal annular ring are taken at the copper hole wall plating/internal land interface to the outer most tip of the internal
land as shown in Figure 331a.
对于多层印制板，除了要测量印制板表面特性之外，如在垂直
显微剖切中发现内层孔环有破环，但不能判定破环的程度，
内层的错位则可通过除显微剖切外的非破环性方法确定，例如
特殊图形、探头及（或）软件。其原理是利用错位的孔环和
偏斜的图形找到情况。这类技术包含但不局限于以下几种：
• IPC-2221中详细描述的可选附连板F或R；
• 定制的可用于电气测试的附连板；
•X射线术；
• 水平显微剖切；
• 与每层图形定位相关的CAD/CAM资料分析
注：应当采用显微剖切或统计抽样来验证上述检测技术的符
合性，及为所采用的具体技术建立的特定校准标准。
一旦在垂直显微切片上发现错位，注意下列事项：
1. 在导体与焊盘的连接区，最小导体宽度可能受到危及；
2. 没有足够的电气间距。
应当测定破环的大小与方向。应当在适用的测试附连板或实
际成品印制板的受影响区域进行测试，并分析可疑层面从而
进行判定。可通过以上所列的技术进行评定。
内层环宽的测量从孔壁的铜镀层/内部连接盘界面测至内部连
接盘的最外端，如图331a。
图331a
3.3 PLATED-THROUGH HOLES – GENERAL（镀覆孔 – 总则）
3.3.1 Annular Ring – Internal Layers（内层环宽）
101IPC-A-600H-2010 2010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• All holes accurately registered in the center of the lands.
• 所有的孔准确地对准焊盘的中心。
Acceptable - Class 3（可接受条件 - 3级）
• Annular ring measures 0.025 mm [0.000984 in] or more.
• 环宽大于或等于0.025mm[0.000984in]。
Acceptable - Class 2（可接受条件 - 2级）
• 90° hole breakout is allowed provided the land/conductor junc-
tion is not reduced below the allowable width reduction in
2.10.1.1 and minimum lateral spacing is maintained.
• 如破环未使焊盘/导体连接区减少至小于2.10.1.1节允许的宽
度减少值并保持最小侧向间距，则允许有90°的破环。
Acceptable - Class 1（可接受条件 - 1级）
• Hole breakout is allowed provided the land/conductor junction is
not reduced below the allowable width reduction in 2.10.1.1 and
minimum lateral spacing is maintained.
• 如破环未使焊盘/导体连接区减少至小于2.10.1.1节允许的宽
度减少值并保持最小间距。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图331d
图331c
图331b
3.3 PLATED-THROUGH HOLES – GENERAL（镀覆孔 – 总则）
3.3.1 Annular Ring – Internal Layers (cont.)（内层环宽（续））
102 IPC-A-600H-20102010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• No lifting of lands.
• 无焊盘起翘。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
After thermal stress testing or rework simulation:
• Lifted lands are allowed.
热应力测试或模拟返工后：
• 允许焊盘起翘。
图332a
图332b
3.3 PLATED-THROUGH HOLES – GENERAL（镀覆孔 – 总则）
3.3.2 Lifted Lands – (Cross-Sections)（焊盘起翘（显微切⽚））
103IPC-A-600H-2010 2010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）