IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第161页

There are two types of metal core printed boards, both having one or more conductive patterns on each side of an insulated metal substrate. Interconnection between conductive patterns is made with PTHs. In the first type…

100%1 / 180
Nonconforming - Class 1,2,3
(不符合条件 - 1,2,3级)
Defects either do not meet or exceed above criteria.
缺陷不符合或出上述要求。
4113c
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS及刚挠性印制板)
4.1.13 Silver Film Integrity (cont.)膜完性(续)
152 IPC-A-600H-201020104
There are two types of metal core printed boards, both having one or more conductive patterns on each side of an insulated metal substrate.
Interconnection between conductive patterns is made with PTHs.
In the first type, for double-sided printed boards, the metal core is laminated on each side with single-sided copper clad laminate to form a
two-sided printed board with the conductors subsequently etched and plated by conventional printed board processes. For multilayer appli-
cations, additional etched internal layers may be laminated to the core or multiple cores. The cores may serve as a heat sink, a power or ground
plane, or as a constraining plane to decrease the coefficient of thermal expansion (CTE) of the printed board in the planar direction.
For this type, the cores are commonly aluminum, copper, or (for CTE control) copper clad invar or molybdenum. If the cores are not to be
electrically connected to the circuitry (as is normally the case with aluminum cores), clearance holes for PTHs are drilled or punched prior to
lamination and filled with an insulating material. Copper cores may be electrically connected through the PTH. However, copper clad invar
or molybdenum requires special processing to make acceptable electrical connections.
In the second type of metal core printed board, clearance holes are drilled, punched or machined in the bare core and it is then coated with an
insulating material by spray coating, electrophoretic processes, or fluidized bed techniques. The coating must be pinhole free and of the
specified thickness required to withstand electrical leakage and arc-over. After coating, the insulation is covered with electroless copper and
plated and etched to provide required surface conductors and PTHs. For this type, the core may be copper, aluminum or steel, and most often
acts as a heat sink or stiffener.
板有两种类,两种类是在一绝缘基材的两面有一多个导电导电互连是通过
实现的。
在第一种类中,对双面印制板说,是在的两面面覆铜层双面板,接采用常规的印制板工进行
电镀制作线。作为多层板应用时,的内层层到一多个上。这些可作为散热
或接地,或作为印制板在面方膨胀CTE)的
对于这种类印制板说,其通常是或(作为CTE用的)覆瓦钢板。如不作为电气
接线路(这种情况下通常用铝芯,则对于离孔要在前钻冲孔并用绝缘材料加以充。可以通
孔来实现电气连接。但是,覆瓦钢钼芯材料则要求采用特加工才能获得可接受的电气连接。
在第类的印制板中,离孔是在材中采用冲孔或其它方法加工而成采用流化
技术覆上一绝缘材料。这种类必须没有针孔耐漏放电等所规定的要求。在绝缘
采用镀铜电镀铜覆盖在绝缘上,通过以提供所要求的表面体和。对于这种类说,材可以是
,其多数是作为散热强板。
4.2
METAL CORE PRINTED BOARDS(⾦属印制板)
Introduction(引⾔)
153IPC-A-600H-2010 20104
Metal Core Printed Board Types(⾦属印制板类型
Laminated Type Metal Core Printed Board
压型⾦属印制板
Single conductive layer on both sides and insulated from the
metal core substrate. Conductive material to be copper foil and
electrodeposited copper.
两面上各有一基板绝缘导电层导电材料是覆
铜箔电镀铜
Laminated Type Metal Core Multilayer Printed Board
压型⾦属芯多层印制板
More than one conductive layer on one or both sides and insulated
from the metal core substrate. Conductive material to be copper
foil and electrodeposited copper.
一面或两面上有一以上与基板绝缘导电层导电
材料是覆铜箔电镀铜
Insulated-Metal-Substrate Metal Core Printed Board
缘的⾦属基板印制板
Single conductive layer on both sides and insulated from the
metal core substrate. Conductive material to be electroless copper
and a copper flash is then applied over all surfaces. From this
point on, document printed board fabrication processes are
employed. This process is generally limited to double-sided
printed boards only.
两面各有一层导电层基板绝缘导电材料是在
部表面进行镀铜镀铜再采用常规的印制生
产工进行制作。这种工通常仅限于生产双面印制
板。
421a
421b
421c
4.2 METAL CORE PRINTED BOARDS(⾦属印制板)
4.2.1 Type Classifications(分
154 IPC-A-600H-201020104