IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第46页

Haloing: Mechanically induced fracturing or delamination on or below the surface of the base material; a light area around the holes, other machined areas or both are usually indications of haloing. See also 2.1.3. 晕圈： 由…

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Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图256d
2.5 HOLES – PLATED-THROUGH – GENERAL（镀覆孔 – 通则）
2.5.6 Cap Plating of Filled Holes – (Visual) (cont.)（填塞孔的盖覆电镀 –（⽬检）（续））
37IPC-A-600H-2010 2010年4月
Haloing: Mechanically induced fracturing or delamination on or below the surface of the base material; a light area around the holes, other
machined areas or both are usually indications of haloing. See also 2.1.3.
晕圈：由于机械加工引起的基材表面上或表面下的破裂或分层现象；通常表现为在孔周围或其它机械加工的部位呈现泛白区域，
或两处同时存在。又见2.1.3节。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• No haloing.
• 无晕圈。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Distance between the haloing penetration and the nearest conduc-
tive feature is not less than the minimum lateral conductor spac-
ing, or 100 µm [3,937 µin] if not specified.
• 晕圈渗透 与最近导电图形间的距离不小于最小侧向导体间
距，如未规定，则不小于100µm[3,937µin]。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图261a
图261b
图261c
2.6 HOLES – UNSUPPORTED（⾮⽀撑孔）
2.6.1 Haloing（晕圈）
38 IPC-A-600H-20102010年4月
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Contacts are free of pits, pinholes and surface nodules.
• No exposed copper or plating overlap between solder finish or
solder mask and tip finish.
• 接触片上没有麻点、针孔和表面结瘤。
• 焊料涂覆层或阻焊膜与接触片末端涂覆层之间既没有露铜也
没有涂层重叠。
Acceptable - Class - 1,2,3 (Critical Contact Area)
（可接受条件 - 1,2,3级（关键接触区））
• Surface defects do not expose underlying metal in critical contact
area.
• Solder splashes or tin-lead plating does not occur in critical con-
tact area.
• No nodules and metal bumps in critical contact area.
• Pits, dents or depressions do not exceed 0.15 mm [0.00591 in] in
their longest dimension. There are not more than three per con-
tact, and they do not appear on more than 30% of the contacts.
• 在接插关键区内表面缺陷没有曝露底层金属。
• 在接插关键区内没有溅出的焊料或锡铅镀层。
• 在接插关键区内没有结瘤和金属突出。
• 麻点、凹坑或凹陷处的最长尺寸不超过0.15mm[0.00591in]。
每个接触片上的缺陷不超过3处，且有这些缺陷的接触片不
超过接触片总数的30%。
Acceptable - Class 3 (Gap/Overlap Area)
（可接受条件 - 3级（露铜/重叠区域））
• Exposed copper or plating overlap is 0.8 mm [0.031 in] or less.
• 露铜/镀层重叠区小于等于0.8mm[0.031in]。
Acceptable - Class 2 (Gap/Overlap Area)
（可接受条件 - 2级（露铜/重叠区域））
• Exposed copper or plating overlap does not exceed 1.25 mm
[0.04921 in].
• 露铜/镀层重叠区不超过1.25mm[0.04921in]。
Acceptable - Class 1 (Gap/Overlap Area)
（可接受条件 - 1级（露铜/重叠区域））
• Exposed copper or plating overlap does not exceed 2.5 mm
[0.0984 in].
• 露铜/镀层重叠区不超过2.5mm[0.0984in]。
Note 1: Discoloration is permitted in the plating overlap zone.
Note 2: Critical Contact Area. These conditions do not apply to a band 0.15 mm [0.00591 in] wide around the periphery of the printed con-
tact land.
注1：镀层重叠区允许变色。
注2：关键接插区域。这些条件不适用于围绕包括印制接触焊盘周围0.15mm[0.00591in]宽的区域。
图271a
图271b
2.7 PRINTED CONTACTS（印制接触⽚）
2.7.1 Surface Plating – Plated Contacts（表⾯镀层 – 电镀的接触⽚）
39IPC-A-600H-2010 2010年4月