IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第78页

Supported Hole: A hole within a printed board that has its inside surfaces plated or otherwise reinforced. ⽀撑孔： 印制板中 孔 的表面 经 过 电镀 或采用其它方法 增 强的 孔 。 T arget Condition - Class 1,2,3 （⽬标条件 - 1,2,3级） • Holes are centered in t…

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External Annular Ring: The minimum annular ring on external layers is the minimum amount of copper (at the narrowest point) between
the edge of the hole and the edge of the land after plating of the finished hole (see Figure 2102a). Hole breakout refers to a condition where
a hole is not completely surrounded by the land (see Figure 2102b).
外层环宽：外层的最小环宽是成品孔在电镀后孔边缘和焊盘边缘之间（最窄处）的最小量的铜（见图2102a）。孔的破环指孔未被
焊盘完全包围的状况（见图2101b）。
Conductor to Land Junction: A 90° area centered around the point where the conductor connects to the land (see Figure 2102c). This
area only applies to breakout conditions (see Figure 2102d).
导体与焊盘的连接区：以导体与焊盘连接点为中心的90°区域（见图2102c）。该区域仅适用于破环的状况（见2102d）。
图2102a 外层环宽
图2102b 90°和180°的破环
B
A
180°
90°
图2102c 导体与焊盘的连接区 图2102d 导体与焊盘连接处的破环
2.10 PATTERN DEFINITION – DIMENSIONAL（图形精确度 – 尺⼨要求）
2.10.2 External Annular Ring – Measurement（外层环宽的测量）
69IPC-A-600H-2010 2010年4月
Supported Hole: A hole within a printed board that has its inside surfaces plated or otherwise reinforced.
⽀撑孔：印制板中孔的表面经过电镀或采用其它方法增强的孔。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Holes are centered in the lands.
• 孔位于焊盘中心。
Acceptable - Class 3（可接受条件 - 3级）
• Holes are not centered in the lands, but the annular ring measures
0.050 mm [0.0020 in] or more.
• The minimum external annular ring may have 20% reduction of
the minimum annular at the measurement area due to defects such
as pits, dents, nicks, pinholes, or splay.
• 孔 没有位 于 焊 盘中心，但 环宽大于或等于0.050mm[0.0020
in]。
• 测量区域内的最小环宽由于诸如麻点、凹坑、缺口、针孔或
斜孔等缺陷的存在，可减少最小外层环宽的20%。
图2103a
图2103b
0.050 mm
[0.0020 in]
0.050 mm
[0.0020 in]
0.050 mm
[0.0020 in]
图2103c
0.050 mm
[0.0020 in]
2.10 PATTERN DEFINITION – DIMENSIONAL（图形精确度 – 尺⼨要求）
2.10.3 External Annular Ring – Supported Holes（⽀撑孔的外层环宽）
70 IPC-A-600H-20102010年4月
Acceptable - Class 2（可接受条件 - 2级）
• 90° breakout or less (see item A in Figure 2103d).
• If breakout occurs at the conductor to land junction area, the land/
conductor junction is not reduced by more than 20% of the mini-
mum conductor width specified on the engineering drawing or the
production master nominal. The conductor junction should never
be less than 0.050 mm [0.0020 in] or the minimum line width,
whichever is smaller (see item C in Figure 2103d).
• Minimum lateral spacing is maintained.
• 破环小于或等于90°（见图2103d中的A项）。
• 如破环发生在焊盘与导体的连接区，则导体宽度的减少不大
于工程图纸或生产底版中标称的最小导体宽度的20%。导体
连接处绝不应该小于0.050mm[0.0020in]，或不应该小于最小
线宽，取两者中的较小者（见图2103d中的C项）。
• 满足导体之间最小侧向间距要求。
Acceptable - Class 1（可接受条件 - 1级）
• 180° breakout or less (see item B in Figure 2103d).
• If breakout occurs at the conductor to land junction area, the con-
ductor is not reduced by more than 30% of the minimum conduc-
tor width specified on the production master nominal (see item D
in Figure 2103d).
• Form, fit and function are not affected.
• Minimum lateral spacing is maintained.
• 破环小于等于180°（见图2103d中的B项）。
• 如破环发生在焊盘与导体的连接区，导体宽度的减少不大于
生产底版中标称的最小导体宽度的30%。（见图2103d中的D
项）
• 外形、安装和功能未受影响。
• 满足导体之间最小侧向间距要求。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图2103d
A
B
A
B
C
D
2.10 PATTERN DEFINITION – DIMENSIONAL（图形精确度 – 尺⼨要求）
2.10.3 External Annular Ring – Supported Holes (cont.)（⽀撑孔的外层环宽（续））
71IPC-A-600H-2010 2010年4月