IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第71页
Tenting refers to a via with a mask material applied bridging over the via wherein no additional materials are in the hole. It may be applied to one side or both sides of the via structure (see Figure 297a), though singl…
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• There are no wrinkles, waves, ripples or other defects in the sol-
der mask coating over the printed board base material surfaces or
conductive patterns.
• 印制板基材表面或导电图形上的阻焊膜涂覆层均未出现皱
褶、波纹、皱纹或其它缺陷。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Waves or ripples in the solder mask do not reduce the solder mask
coating thickness below the minimum thickness requirements
(when specified).
• Wrinkling is located in an area that does not bridge conductive
patterns and passes IPC-TM-640, Method 2.4.28.1 (adhesion tape
pull test).
• 阻焊膜中的波纹或皱纹没有使阻焊剂涂覆层厚度减小至低于
最小厚度要求（当有规定时）。
• 在一个区域内出现的皱褶没有使导电图形桥连，并通过IPC-
TM-650测试方法2.4.28.1的胶带附着力测试。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图296a
图296b
图296c
2.9 SOLDER MASK（阻焊膜（阻焊剂））
2.9.6 Waves/Wrinkles/Ripples（波纹/褶皱/皱纹）
62 IPC-A-600H-20102010年4月
Tenting refers to a via with a mask material applied bridging over the via wherein no additional materials are in the hole. It may be applied
to one side or both sides of the via structure (see Figure 297a), though single sided tenting is not recommended.
用掩膜材料涂敷在孔上，而孔内无其它额外材料的导通孔。可从导通孔的任一面或两面涂敷材料（见图297c），但不推荐从单面
掩蔽导通孔。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• All holes required to be tented are completely covered with mask.
• 所有要求掩蔽的孔都被掩膜完全覆盖。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• All holes required to be tented are covered by mask.
• 所有要求掩蔽的孔都被掩膜覆盖。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图297b
图297c
图297a
注：此图仅⽤作说明状况，并不要求做显微剖切评价。
2.9 SOLDER MASK（阻焊膜（阻焊剂））
2.9.7 Tenting (Via Holes)（掩蔽（导通孔））
63IPC-A-600H-2010 2010年4月
Soda Strawing: A long tubular-like void along the edges of conductive patterns where the solder mask is not bonded to the base material
surface or the edge of the conductor. Tin/lead fusing fluxes, fusing oils, solder fluxes, cleaning agents or volatile materials may be trapped in
the soda straw void.
吸管状空隙：沿着导电图形边缘的一种细长管状的空隙，即阻焊膜未与基材表面或导体边缘粘结。锡铅热熔助焊剂、热熔油、焊
接助焊剂、清洗剂或挥发物可能会被夹封在这种吸管状空隙中。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• No visible soda straw voids between the solder mask and the
printed board base material surface and the edges of the conduc-
tive patterns.
• 阻焊膜和印制板基材表面以及导电图形的侧边之间均不存在
可见空隙。
Acceptable - Class 3（可接受条件 - 3级）
• No evidence of soda strawing.
• 无吸管装空隙迹象。
Acceptable - Class 1,2（可接受条件 - 1,2级）
• Soda strawing along side conductive pattern edges does not
reduce the conductor spacing below the minimum requirements.
• Soda strawing is completely sealed from the external environ-
ment.
• 沿着导电图形侧面边缘出现吸管状空隙，但未使导体间距减
小至低于最小要求。
• 吸管状空隙与周围环境完全封闭。
图298a
图298c
图298b
图298d
2.9 SOLDER MASK（阻焊膜（阻焊剂））
2.9.8 Soda Strawing（吸管状空隙）
64 IPC-A-600H-20102010年4月