IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第141页
Imperfections such as wrinkles, creases, and nonlamination are acceptable provided they do not exceed the limits for foreign inclusions in 2.3.4 and the limits below. 皱褶 、 折 痕 和 非层 压 之类的瑕疵， 只 要 未超 过下述 限 制及 2.3.4 节对外 来夹杂物…
This section covers the acceptability requirements specific to flexible and rigid-flex printed boards. Parameters not covered in this section are
to be evaluated using the other sections of this document.
The numeric type designator for flexible and rigid-flex printed boards differs from that of rigid printed boards. The various types for flexible
and rigid-flex printed boards are defined as follows:
Type 1 Single-sided flexible printed boards containing one conductive layer, with or without stiffeners.
Type 2 Double-sided flexible printed boards containing two conductive layers with PTHs, with or without stiffeners.
Type 3 Multilayer flexible printed board containing three or more conductive layers with PTHs, with or without stiffeners.
Type 4 Multilayer rigid and flexible material combinations containing three or more layers with PTHs.
Type 5 Flexible or rigid-flex printed boards containing two or more conductive layers without PTHs.
The types referred to in this section on flexible and rigid-flex printed boards will use the definitions above.
The physical requirements for folding flexibility and flexibility endurance are not described in this document. If required by the procurement
documentation, refer to IPC-6013 for details.
本节涵盖了挠性和刚挠性印制板的可接受性要求。本节未涉及的参数可采用本文件其它章节来评定。
挠性和刚挠性印制板的数字类型代码与刚性印制板是不同的。挠性和刚挠性印制板的数字类型代码定义如下：
1型板 包含一层导电层的挠性单面印制线路,有或没有增强板。
2型板 包含两层导电层的挠性双面印制线路，有镀覆孔；有或没有增强板。
3型板 包含三层或三层以上导电层的挠性多层印制线路，有镀覆孔、有或没有增强板。
4型板 包含三层或三层以上导电层的刚性多层和挠性材料组合，有镀覆孔。
5型板 包含两层或两层以上导电层的挠性或刚挠印制线路，没有镀覆孔。
本节有关挠性和刚挠性印制板类型将采用上述定义。
本文件未涉及折叠挠曲性和耐挠折性的物理要求。如采购文件有要求，其详细要求参见IPC-6013。
4.1
FLEXIBLE
AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
Introduction（引⾔）
132 IPC-A-600H-20102010年4月
Imperfections such as wrinkles, creases, and nonlamination are acceptable provided they do not exceed the limits for foreign inclusions in
2.3.4 and the limits below.
皱褶、折痕和非层压之类的瑕疵，只要未超过下述限制及2.3.4节对外来夹杂物的限制，都是可接受的。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Uniform and no separations or delamination.
• No wrinkles, creases or soda strawing.
• 覆盖层均匀无分离或分层。
• 无皱褶、折痕或吸管状空隙。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
Delamination and nonlamination meets the following criteria:
• At random locations away from conductors, each separation is no larger than
0.80 x 0.80 mm [0.0315 x 0.0315 in] and is not within 1.0 mm [0.0394 in] of
the printed board edge or the coverfilm opening.
• The total number of separations does not exceed three in any 25 x 25 mm
[0.984 x 0.984 in] of coverfilm surface area.
• The total separation does not exceed 25% of the spacing between adjacent con-
ductors.
• No coverfilm nonlamination along the outer edges of the coverfilm.
分离和未层压住符合以下准则：
• 在远离导体的随机位置，每处分离不大于0.80x0.80mm[0.0315inx0.0315
in]且不在距板边或覆盖膜开口1.0mm[0.0394in]范围内。
• 在覆盖膜表面任一25mmx25mm[0.984inx0.984in]的区域内，分离总数未
超过3个。
• 分离的总长度没有超过相邻导体间距的25%。
• 沿覆盖膜外部边缘的覆盖膜没有出现未层压住。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图411a
图411b
图411c
图411d
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.1 Coverlay Coverage – Coverfilm Separations（覆盖层覆盖 – 覆盖膜分离）
133IPC-A-600H-2010 2010年4月
The covercoat coverage shall have the same requirements as the solder mask coatings in the rigid printed board section of this document. This
section covers the acceptability requirements for coverlay coverage including squeeze-out of adhesive over the solderable land area and foil
surface.
覆盖层的覆盖要求应当与本文件中刚性印制板一节规定的阻焊膜涂层的要求相同。本节覆盖层的覆盖可接受性要求包括下述的焊
盘和铜箔表面挤出的粘接剂。
4.1.2.1 Adhesive Squeeze-Out – Land Area（焊盘区域粘接剂的挤出）
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• No unwanted material on land area.
• 焊盘区域无多余的材料。
Acceptable - Class 3（可接受条件 - 3级）
• A 0.05 mm [0.00197 in] solderable annular ring for 360° of the
circumference.
• 圆周360°范围内有0.05mm[0.00197in]宽的可焊孔环。
Acceptable - Class 2（可接受条件 - 2级）
• A 0.05 mm [0.00197 in] solderable annular ring for at least 270°
of the circumference.
• 圆周至少270°范围内有0.05mm[0.00197in]宽的可焊孔环。
Acceptable - Class 1（可接受条件 - 1级）
• A solderable annular ring for at least 270°of the circumference.
• 圆周至少270°范围内有可焊孔环。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图4121a
图4121b
270°
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.2 Coverlay/Covercoat Coverage – Adhesives（覆盖层/覆盖涂层的覆盖 – 粘接剂）
134 IPC-A-600H-20102010年4月