IPC-A-600H-2010 中文版印制板的可接受性 (1).pdf - 第61页

T arget Condition - Class 1,2,3 （⽬标条件 - 1,2,3级） • The solder mask exhibits uniform appearance over the base mate- rial surface, conductor sides and edges. It is firmly bonded to the printed board surface with no visible …

The term ‘‘Solder Mask’’ is used in this document as a general term when referring to any type of permanent polymer coating material used

on printed boards. Solder masks are used to limit and control the application of solder to selected areas of the printed board during assembly

soldering operations. Solder mask coatings are used to control and limit surface contamination of printed board surfaces during soldering and

subsequent processing operations, and are sometimes used to reduce dendritic filament growth(s) between conductive patterns over the

printed board base material surface. Detailed specifications and information regarding solder mask requirements are contained in IPC-6012

and IPC-SM-840.

Solder mask materials are not intended for use as a substitute for conformal coatings that are applied after assembly to cover components,

component lead/terminations and solder connections. Determination of compatibility of solder mask materials with conformal coating mate-

rials, or other substances, is dependent upon the end item assembly environments.

Solder mask thickness cannot be visually determined. If solder mask thickness is specified, microsectional analysis is required and evaluated

per 3.3.12.

The types of solder mask include:

• Deposited image, (liquid) screen printed form.

• Deposited image, electrostatic.

• Photo defined image, (liquid) form.

• Photo defined image, (dry film) form.

• Photo defined image, temporary mask.

• Photo defined, dry film over liquid.

Note: Touch up, if required to cover these areas with solder mask, shall be of a material that is compatible to and of equal resistance to sol-

dering and cleaning as the originally applied mask.

本文件使用的术语“阻焊膜（阻焊剂）”是指在印制板上用到的任何类型的永久性聚合物涂覆材料的通用术语。在装配焊接操作

期间，阻焊膜（阻焊剂）用来在印制板所选定的区域内限制及控制焊料的施加。阻焊涂覆层还用于在焊接中及后续的工艺操作中

控制及减少印制板表面的污染，有时还用于减少在印制板基材表面导电图形之间枝状细丝（枝晶）的生长。有关阻焊膜要求的详

细规范及信息参见IPC-6012和IPC-SM-840。

阻焊剂材料不能作为装配后覆盖元器件、元器件引线/端子及焊接连接的敷形涂覆层的代用品。阻焊剂材料与敷形涂覆材料或其

它材料兼容性的确定取决于最后组件的使用环境。

阻焊膜厚度不能通过目视检查确定。如果阻焊膜厚度有规定，则要求按3.3.12节做显微切片分析和评定。

阻焊剂的类型包括：

• 液态网印成像型；

• 静电沉积成像型；

• 液态光致成像型阻焊剂；

• 干膜光致成像型阻焊剂；

• 光致成像型暂性阻焊剂；

• 干膜覆盖在湿膜上的光致成像型阻焊剂。

注：如要求用阻焊膜修补以覆盖这些区域时，应当使用与最初使用的阻焊剂相兼容的并具有同等耐焊接性和耐清洗性的材料。

2.9 SOLDER MASK（阻焊膜（阻焊剂））

Introduction（引⾔）

52 IPC-A-600H-20102010年4月

Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）

• The solder mask exhibits uniform appearance over the base mate-

rial surface, conductor sides and edges. It is firmly bonded to the

printed board surface with no visible skipping, voids or other

defects.

• 阻焊膜在基材表面、导体侧面和边缘处都呈现均匀的外表，

并已牢固粘接在印制板表面上，无可见的跳印、空洞或其它

缺陷。

Acceptable - Class 2,3（可接受条件 - 2,3级）

• In areas containing parallel conductors, adjacent conductors are

not exposed by the absence of solder mask except where space

between conductors is intended to be exposed.

• Touch up, if required to cover these areas with solder mask, is of

a material that is compatible to and of equal resistance to solder-

ing and cleaning as the originally applied solder mask.

• 在有平行导体的区域内，除了导体之间有意不覆盖阻焊剂处

外，没有由于缺少阻焊剂而使相邻导体暴露。

• 如要求用阻焊膜修补以覆盖这些区域时，使用与最初使用的

阻焊剂相兼容的并具有同等耐焊接性和耐清洗性的材料。

Acceptable - Class 1（可接受条件 - 1级）

• The missing solder mask does not reduce the conductor spacing

between conductive patterns below the minimum acceptability

requirements.

• There is skipping of the solder mask along the sides of the con-

ductive patterns.

• 缺失的阻焊膜未使导体间的间距减少至低于最小可接收性要

求。

• 沿着导电图形侧边可有跳印的阻焊膜。

Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）

• Defects either do not meet or exceed above criteria.

• 缺陷不符合或超出上述要求。

图291a

图291b

图291c

2.9 SOLDER MASK（阻焊膜（阻焊剂））

2.9.1 Coverage Over Conductors (Skip Coverage)（导体上的覆盖（跳印））

53IPC-A-600H-2010 2010年4月

Target Condition - Class 1,2,3

（⽬标条件 - 1,2,3级）

• No solder mask misregistration. The solder mask is

centered around the lands within the nominal regis-

tration spacings.

• 未出现阻焊膜错位。阻焊膜在标称的重合度间

距内，以焊盘为中心环绕在其周围。

Acceptable - Class 1,2,3

（可接受条件 - 1,2,3级）

• Misregistration of the mask to the land patterns but

the solder mask does not violate minimum annular

ring requirements.

• No solder mask in PTHs, except those not intended

for soldering.

• Adjacent, electrically isolated lands or conductors

are not exposed.

• 阻焊膜图形与焊盘错位，但不违反最小环宽要

求。

• 除那些无需焊接的孔外，镀覆孔内无阻焊膜。

• 未暴露相互电气隔离的相邻焊盘或导体。

Nonconforming - Class 1,2,3

（不符合条件 - 1,2,3级）

• Defects either do not meet or exceed above criteria.

• 缺陷不符合或超出上述要求。

图292a

图292c

图292e

图292b

图292d

图292f

2.9 SOLDER MASK（阻焊膜（阻焊剂））

2.9.2 Registration to Holes (All Finishes)（与孔的重合度（所有涂覆层））

54 IPC-A-600H-20102010年4月