IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第149页
T arget Condition - Class 1,2,3 （⽬标条件 - 1,2,3级） • Solder or plating on land covers all exposed metal and stops at coverlay. • Solder wicking or plating penetration does not extend into the bend or flex transition area. •…
The transition zone is the area centered at the edge of the rigid portion from which the flexible portion extends. The inspection range is lim-
ited to 3.0 mm [0.12 in], about the center of the transition, which is the edge of the rigid portion.
过渡区以刚性段和挠性段的的边缘为中心。检验范围局限于过渡区的中心（即刚性段的边缘）附近3mm[0.12in]内。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Adhesive squeeze-out.
• Localized deformation of dielectric or conductors.
• Protruding dielectric material.
• 粘接剂挤出。
• 介质或导体的局部变形。
• 介质材料的突出。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图416a
图416b
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.6 Transition Zone, Rigid Area to Flexible Area（刚性区域与挠性区域的过渡区）
140 IPC-A-600H-20102010年4月
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Solder or plating on land covers all exposed metal and stops at
coverlay.
• Solder wicking or plating penetration does not extend into the
bend or flex transition area.
• 焊盘上的焊料或镀层覆盖了所有裸露的金属并止于覆盖层。
• 焊料芯吸或镀层渗透未延伸至弯曲或挠性过渡区域。
Acceptable - Class 3（可接受条件 - 3级）
• Solder wicking/plating penetration does not extend under cover-
lay more than 0.1 mm [0.004 in].
• Solder wicking or plating penetration does not extend into the
bend or flex transition area.
• Meets conductor spacing requirements.
• 焊料芯吸/镀层渗透在覆盖层下延伸不超过0.1mm[0.004in]。
• 焊料芯吸或镀层渗透没有延伸至弯曲或挠性过渡区域。
• 满足导体间距要求。
Acceptable - Class 2（可接受条件 - 2级）
• Solder wicking/plating penetration does not extend under cover-
lay more than 0.3 mm [0.012 in].
• Solder wicking or plating penetration does not extend into the
bend or flex transition area.
• Meets conductor spacing requirements.
• 焊料芯吸或镀层渗透在覆盖层下延伸不超过0.3mm[0.012
in]。
• 焊料芯吸或镀层渗透没有延伸至弯曲或挠性过渡区域。
• 满足导体间距要求。
图417a
图417b
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.7 Solder Wicking/Plating Penetration Under Coverlay（覆盖层下的焊料芯吸/镀层渗透）
141IPC-A-600H-2010 2010年4月
Acceptable - Class 1（可接受条件 - 1级）
• Solder wicking/plating penetration does not extend under cover-
lay more than 0.5 mm [0.020 in].
• Solder wicking or plating penetration does not extend into the
bend or flex transition area.
• Meets conductor spacing requirements.
• 焊 料 芯吸 或 镀层渗 透在覆盖层 下延伸不超过0.5mm[0.012
in]。
• 焊料芯吸或镀层渗透没有延伸至弯曲或挠性过渡区域。
• 满足导体间距要求。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图417c
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.7 Solder Wicking/Plating Penetration Under Coverlay（覆盖层下的焊料芯吸/镀层渗透（续））
142 IPC-A-600H-20102010年4月