IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第4页
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IPC-A-600H CN
印制板的可接受性
由IPC产品保证委员会（7-30）
IPC-A-600任务组（7-31a）开发
由IPC TGAsia 7-31aCN技术组翻译
鼓励本标准的使用者参加未来修订版的开发。
联系方式：
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
IPC中国
上海办公室
电话：（8621）54973435/36
深圳办公室
电话：（86755）86141218/19
北京办公室
电话: （8610）67885326
取代：
IPC-A-600G – 2004年7月
IPC-A-600F – 1999年11月
If a conflict occurs
between the English
and translated versions
of this document, the
English version will
take precedence.
本文件的英文版本与翻
译版本如存在冲突, 以
英文版本为优先。
®
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任何包含复杂技术的标准都要有大量的资料来源。IPC产品保证委员会（7-30）IPC-A-600任务组（7-31a）全体成员共同努力开发
出了此项标准。谢谢他们为此做出的无私奉献。我们不可能罗列所有参与和支持本标准开发的个人和单位，下面仅仅列出了IPC-
A-600任务组的主要成员。然而我们不得不提到IPC TGAsia 7-31aCN技术组的成员，他们力求译文文字的信达雅，为此标准中文版
的翻译、审核付出了艰苦的劳动。我们在此一并对上述各有关组织和个人表示衷心的感谢。特别感谢刚性印制板委员会（D-30）
的成员为建立印制板验收标准所做的努力。
产品保证委员会
主席
Mel Parrish
STI Electronics
副主席
Michael E. Hill
Colonial Circuits, Inc.
IPC-A-600任务组
主席
Mark Buechner
BAE Systems
副主席
Randy R. Reed
Viasystems Group, Inc.
刚性印制板委员会
主席
Vicka White
Honeywell Inc. Air Transport Systems
副主席
Debora Obitz
Trace Laboratories - East
IPC董事会技术联络员
Peter Bigelow
IMI Inc.
Sammy Yi
Aptina Imaging Corp.
IPC-A-600任务组
Lance Auer, Raytheon Missile Systems
Robert F. Bagsby, Rockwell Collins
Wendi Boger, DDi Corp.
Gerald Leslie Bogert, Bechtel Plant
Machinery, Inc.
Scott Bowles, Hallmark Circuits Inc.
Elaine Brown, Lockheed Martin Systems
Integration
Tracey Bumann, Minco Products Inc.
Byron Case, L-3 Communications
Laya Chen, Microtek (Changzhou) Product
Services Co., Ltd.
Pei-Liang Chen, Shanghai Printronics
Electronics Co., Ltd.
Christine Coapman, Delphi Electronics and
Safety
C. Don Dupriest, Lockheed Martin Missiles
and Fire Control
Theodore Edwards, Dynaco Corp.
Alan Exley, Raytheon Company
Gary Ferrari, FTG Circuits
Lionel Fullwood, WKK Distribution Ltd.
Mahendra Gandhi, Northrop Grumman
Aerospace Systems
Thomas Gardeski, Gemini Sciences
Constantino Gonzalez, ACME Training &
Consulting
Hue Green, Lockheed Martin Space Systems
Company
Michael Green, Lockheed Martin Space
Systems Company
Philip Henault, Raytheon Company
Michael Hill, Colonial Circuits Inc.
Eddie Huddleston, Elbit Systems of America
Todd Jarman, L-3 Communications
Candee Kaminski, Honeywell Inc. Air
Transport Systems
Thomas E. Kemp, Rockwell Collins
Jason Koch, Robisan Laboratory Inc.
Nick Koop, Minco Products Inc.
Karin LaBerge, Microtek Laboratories
Leo Lambert, EPTAC Corporation
Jeff Lewis, Holaday Circuits Inc.
Michael G. Luke, Raytheon Company
Clifford Maddox, Boeing Company
Brian Madsen, Continental AG
Chris Mahanna, Robisan Laboratory Inc.
Rene Martinez, Northrop Grumman
Aerospace Systems
Matthew McQueen, NSWC Crane
Renee J. Michalkiewicz, Trace Laboratories -
East
Roger Miedico, Raytheon Company
Michael Miller, NSWC Crane
James Monarchio, TTM Technologies, Inc.
Bob Neves, Microtek Laboratories
Steven M. Nolan, Lockheed Martin Maritime
Systems & Sensors
Debora Obitz, Trace Laboratories - East
William Ortloff, Raytheon Company
Michael Paddack, Boeing Company
J. Lee Parker, JLP
Mel Parrish, STI Electronics
Marybeth Perrino, Endicott Interconnect
Technologies Inc
Stephen Pierce, SGP Ventures, Inc.
Donna Richardson, M-Flex (Multi-Fineline
Electronix Inc)
Jose Rios, Endicott Interconnect
Technologies Inc
Gary Roper, Roper Resources, Inc.
Joseph Schmidt, Raytheon Missile Systems
Russell Shepherd, Microtek Laboratories
Lowell Sherman, Defense Supply Center
Columbus
James Stack, Endicott Interconnect
Technologies Inc
Kevin Therault, Lockheed Martin Space
Systems Company
Dung Q. Tiet, Lockheed Martin Space
Systems Company
Bradley Toone, L-3 Communications
Crystal E. Vanderpan, Underwriters
Laboratories Inc.
Sharon Ventress, U.S. Army Aviation &
Missile Command
Rob Walls, PIEK International Education
Centre BV
Clark Webster, ALL Flex LLC
Vicka White, Honeywell Inc. Air Transport
Systems
Dewey Whittaker, Honeywell Inc. Air
Transport Systems
Mike Wilson, Minco Products Inc.
鸣谢
iiiIPC-A-600H-2010 2010年4月